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TPA6120A2DWPRG4

Texas Instruments

TPA6120A2DWPRG4 by Texas Instruments

TPA6120A2DWPRG4 by Texas Instruments is an audio amplifier IC with 2 channels, operating at ±5/±15V. It features a nominal output power of 0.08W and a bandwidth of 22kHz, suitable for industrial applications requiring high-quality audio amplification in a compact package style. With a small outline and gull wing terminal form, this amplifier offers efficient performance with low supply voltage requirements.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 29,460 parts In-Stock

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29,460

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Vyrian

USA . 4,370 parts In-Stock

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4,370

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Nova Conductors

Japan . 1,000 parts In-Stock

1+ parts

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1,000

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Digiode

USA . 583 parts In-Stock

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583

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 166 parts In-Stock

1+ parts

$2.069

100+ parts

-

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166

$2.069

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Parana Technologies

USA . 985 parts In-Stock

1+ parts

$2.118

100+ parts

-

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$2.632

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985

$2.118

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$2.632

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DigiPath Technology Company

USA . 2,334 parts In-Stock

1+ parts

$2.332

100+ parts

$2.146

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2,334

$2.332

$2.146

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ChromeModa Solutions

Germany . 2,491 parts In-Stock

1+ parts

$2.380

100+ parts

$1.952

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2,491

$2.380

$1.952

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IDEA Electronic Components Group

UK . 952 parts In-Stock

1+ parts

$2.380

100+ parts

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$2.142

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952

$2.380

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$2.142

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Semicontronic

India . 199 parts In-Stock

1+ parts

$6.800

100+ parts

$6.630

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$6.596

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199

$6.800

$6.630

$6.596

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AZTECH Wire

Italy . 897 parts In-Stock

1+ parts

$8.924

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897

$8.924

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One Stop Electronics

USA . 903 parts In-Stock

1+ parts

$10.800

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903

$10.800

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Ampacity Inc.

Singapore . 376 parts In-Stock

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$21.800

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376

$21.800

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S.R.D Solutions

India . 3,000 parts In-Stock

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Continental Prestige Electronics

USA . 2,818 parts In-Stock

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Corphita

USA . 1,887 parts In-Stock

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Argo Parts USA

USA . 1,213 parts In-Stock

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Bastille Electronics

Australia . 550 parts In-Stock

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550

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Overview

Enhance your audio experience with the TPA6120A2DWPRG4 by Texas Instruments. Crafted with precision and expertise, this audio amplifier offers unparalleled quality and performance. Ideal for a wide range of applications in the audio and video industry, this product delivers exceptional value to customers looking for superior sound amplification. Elevate your audio projects with the reliability and efficiency that only Texas Instruments can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this amplifier lightweight and durable, ideal for portable audio devices.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Package Shape: RECTANGULAR

The rectangular package shape makes this amplifier compact and space-saving, perfect for smaller electronic devices.

General IC Type: AUDIO AMPLIFIER

Designed specifically for audio amplification, this IC type ensures high-quality sound output for a better listening experience.

Power Supplies (V): +-5/+-15

With a wide range of power supply voltages, this amplifier is versatile and can be used in various electronic applications.

No. of Terminals: 20

The multiple terminals provide flexibility in connecting external components, allowing for customization and optimization of the amplifier.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG

The small outline package style combined with a heat sink/slug design helps dissipate heat efficiently, preventing overheating and ensuring reliable performance.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures stability and durability even in challenging environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in cold environments without compromising performance.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent corrosion resistance and ensures reliable electrical connections for long-term use.

Technical Specifications

Audio & Video Amplifiers TPA6120A2DWPRG4 attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

Additional Features:

IT CAN ALSO OPERATE WITH 10V TO 30V SINGLE SUPPLY

Nominal Bandwidth:

.022 kHz

General IC Type:

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.825 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

.08 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Power Supplies (V):

+-5/+-15

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

15 mA

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.52 mm

Trade Compliance

TPA6120A2DWPRG4 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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