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TPA3255D2DDV

Texas Instruments

TPA3255D2DDV by Texas Instruments

TPA3255D2DDV by Texas Instruments is a 44-terminal audio amplifier with 325W output power. It operates b/w 0-70°C, suitable for commercial applications. With a compact size of 14x6.1x1.2mm and surface-mount design, it's ideal for high-performance audio systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,102 parts In-Stock

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6,102

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Digiode

USA . 1,373 parts In-Stock

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1,373

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Nova Conductors

Japan . 32 parts In-Stock

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32

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,935 parts In-Stock

1+ parts

$0.530

100+ parts

-

1k+ parts

$1.640

10k+ parts

-

1,935

$0.530

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$1.640

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ChromeModa Solutions

Germany . 2,450 parts In-Stock

1+ parts

$0.595

100+ parts

$0.488

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-

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2,450

$0.595

$0.488

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IDEA Electronic Components Group

UK . 1,335 parts In-Stock

1+ parts

$0.595

100+ parts

-

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$0.536

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1,335

$0.595

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$0.536

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Corohmni

South Africa . 921 parts In-Stock

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$3.090

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921

$3.090

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AZTECH Wire

Italy . 1,020 parts In-Stock

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$7.742

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1,020

$7.742

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One Stop Electronics

USA . 1,638 parts In-Stock

1+ parts

$19.800

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1,638

$19.800

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Ampacity Inc.

Singapore . 716 parts In-Stock

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$19.800

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716

$19.800

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Continental Prestige Electronics

USA . 2,509 parts In-Stock

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Corphita

USA . 2,075 parts In-Stock

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2,075

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Argo Parts USA

USA . 2,069 parts In-Stock

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2,069

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DigiPath Technology Company

USA . 1,150 parts In-Stock

1+ parts

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$0.536

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1,150

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$0.536

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Advanced Electronics

New Zealand . 74 parts In-Stock

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74

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Bastille Electronics

Australia . 66 parts In-Stock

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66

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Overview

Elevate your audio experience with the TPA3255D2DDV by Texas Instruments. Crafted with precision and expertise, this audio amplifier offers unparalleled quality and performance for all your audio and video needs. Whether you're a music enthusiast, audiophile, or professional in the industry, this product delivers 325W of power to enhance your listening experience. With a compact design and advanced features, the TPA3255D2DDV is the perfect choice for amplifying sound in a wide range of applications. Upgrade your audio setup today and immerse yourself in the superior sound quality that only Texas Instruments can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product easy to handle and long-lasting.

Surface Mount: YES

The surface mount feature allows for easy installation and space-saving design in electronic circuits.

Package Shape: RECTANGULAR

The rectangular shape provides versatility in mounting options and allows for efficient use of space on a circuit board.

General IC Type: AUDIO AMPLIFIER

An audio amplifier IC type ensures high-quality sound output for an enhanced audio experience.

No. of Terminals: 44

With a higher number of terminals, this amplifier offers more connectivity options for various audio devices.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

This package style ensures efficient heat dissipation, compact design, and compatibility with different circuit layouts.

Nominal Output Power: 325 W

The high nominal output power ensures strong and clear audio signals for a powerful audio performance.

Maximum Seated Height: 1.2 mm

The low seated height makes this amplifier suitable for compact electronic devices with limited space.

Minimum Supply Voltage (Vsup): 12 V

The low minimum supply voltage requirement makes this amplifier energy-efficient and compatible with a wide range of power sources.

No. of Channels: 2

The dual-channel feature allows for stereo sound output, creating a more immersive audio experience for the user.

Terminal Pitch: 0.635 mm

The terminal pitch provides precise connections and compatibility with standard electronic components for seamless integration.

Technical Specifications

Audio & Video Amplifiers TPA3255D2DDV attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES WITH SUPPLY RANGE OF 10.8 V TO 13.2 V

General IC Type:

JESD-30 Code:

R-PDSO-G44

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Nominal Output Power:

325 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

56.5 V

Minimum Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6.1 mm

Trade Compliance

TPA3255D2DDV General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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