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MSP430F6776AIPZ

Texas Instruments

MSP430F6776AIPZ by Texas Instruments

MSP430F6776AIPZ by Texas Instruments is a 16-bit microprocessor with 262144 ROM words and 16384 RAM bytes. It features 6-Ch 10-Bit ADC channels, PWM support, and connectivity options like I2C, IRDA, SPI, UART. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

$8.955

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 6,023 parts In-Stock

1+ parts

$8.955

100+ parts

$7.301

1k+ parts

$4.867

10k+ parts

-

6,023

$8.955

$7.301

$4.867

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,763 parts In-Stock

1+ parts

$8.507

100+ parts

-

1k+ parts

-

10k+ parts

-

2,763

$8.507

-

-

-

Vyrian

USA . 4,879 parts In-Stock

1+ parts

-

100+ parts

-

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-

10k+ parts

-

4,879

-

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-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,587 parts In-Stock

1+ parts

$8.060

100+ parts

-

1k+ parts

-

10k+ parts

-

3,587

$8.060

-

-

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Microchip USA

USA . 2,119 parts In-Stock

1+ parts

$32.760

100+ parts

$32.290

1k+ parts

$32.060

10k+ parts

$31.820

2,119

$32.760

$32.290

$32.060

$31.820

Parana Technologies

USA . 882 parts In-Stock

1+ parts

$60.948

100+ parts

$5,659.955

1k+ parts

$54.853

10k+ parts

-

882

$60.948

$5,659.955

$54.853

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DigiPath Technology Company

USA . 836 parts In-Stock

1+ parts

$67.111

100+ parts

$61.742

1k+ parts

-

10k+ parts

-

836

$67.111

$61.742

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ChromeModa Solutions

Germany . 6,587 parts In-Stock

1+ parts

$68.481

100+ parts

$56.154

1k+ parts

-

10k+ parts

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6,587

$68.481

$56.154

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IDEA Electronic Components Group

UK . 1,284 parts In-Stock

1+ parts

$68.481

100+ parts

$65.057

1k+ parts

$61.633

10k+ parts

-

1,284

$68.481

$65.057

$61.633

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Corohmni

South Africa . 2,642 parts In-Stock

1+ parts

$83.676

100+ parts

-

1k+ parts

-

10k+ parts

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2,642

$83.676

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QUARKTWIN TECHNOLOGY LTD

USA . 21,293 parts In-Stock

1+ parts

-

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21,293

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Overview

Unlock the potential of your next project with the Texas Instruments MSP430F6776AIPZ. Known for their high-quality products, Texas Instruments delivers reliability and innovation in the field of microprocessor circuits. This versatile IC offers a wide range of applications, from industrial automation to consumer electronics. With features like ADC channels, DMA channels, and PWM capabilities, this product provides value and efficiency to customers looking to optimize their designs. Trust Texas Instruments to provide the cutting-edge technology you need to bring your ideas to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protects the components inside, ensuring a longer lifespan for the product.

Surface Mount: YES

Allows for easy and compact mounting on circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 3.6 V

Can operate at higher voltages, making it suitable for various power supply configurations.

Bit Size: 16

Offers a higher processing capability compared to smaller bit sizes, enabling complex calculations and operations.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Incorporates various peripherals like ADC channels, DMA channels, timers, and more, enhancing the product's functionality and versatility.

Maximum Clock Frequency: 0.032768 MHz

Provides a faster processing speed, improving overall performance and response time.

ROM Programmability: FLASH

Enables easy reprogramming of the read-only memory (ROM), allowing for software updates and modifications.

Connectivity: I2C(2), IRDA(4), SPI(6), UART(4)

Supports a wide range of communication protocols, facilitating seamless integration with other devices and systems.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6776AIPZ attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

16

Bus Compatibility:

I2C; SPI;UART

CPU Family:

MSP430

Maximum Clock Frequency:

.032768 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

62

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

16384

RAM Words:

16

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(4), SPI(6), UART(4)

Peripherals:

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

MSP430F6776AIPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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