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MSP430F67751AIPEUR

Texas Instruments

MSP430F67751AIPEUR by Texas Instruments

MSP430F67751AIPEUR by Texas Instruments is a 16-bit microprocessor with 131072 ROM words and 16384 RAM bytes. It features 6-Ch 10-Bit ADC channels, PWM support, and connectivity options like I2C, IRDA, SPI, UART. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

$7.272

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,235 parts In-Stock

1+ parts

$7.272

100+ parts

$5.928

1k+ parts

$3.952

10k+ parts

-

3,235

$7.272

$5.928

$3.952

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 58 parts In-Stock

1+ parts

$5.599

100+ parts

-

1k+ parts

-

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58

$5.599

-

-

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Digiode

USA . 4,829 parts In-Stock

1+ parts

$6.908

100+ parts

-

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4,829

$6.908

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Vyrian

USA . 8,792 parts In-Stock

1+ parts

-

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8,792

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 374 parts In-Stock

1+ parts

$5.599

100+ parts

-

1k+ parts

-

10k+ parts

$5.487

374

$5.599

-

-

$5.487

Ampacity Inc.

Singapore . 3,196 parts In-Stock

1+ parts

$6.180

100+ parts

-

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3,196

$6.180

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Semicontronic

India . 3,012 parts In-Stock

1+ parts

$6.180

100+ parts

$6.026

1k+ parts

$5.995

10k+ parts

-

3,012

$6.180

$6.026

$5.995

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Corohmni

South Africa . 38 parts In-Stock

1+ parts

$6.279

100+ parts

-

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38

$6.279

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Corphita

USA . 2,160 parts In-Stock

1+ parts

$6.545

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-

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2,160

$6.545

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AZTECH Wire

Italy . 717 parts In-Stock

1+ parts

$15.760

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717

$15.760

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Microchip USA

USA . 1,704 parts In-Stock

1+ parts

$20.010

100+ parts

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1,704

$20.010

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Parana Technologies

USA . 410 parts In-Stock

1+ parts

$39.925

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410

$39.925

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DigiPath Technology Company

USA . 2,060 parts In-Stock

1+ parts

$43.962

100+ parts

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10k+ parts

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2,060

$43.962

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ChromeModa Solutions

Germany . 1,577 parts In-Stock

1+ parts

$44.859

100+ parts

$36.784

1k+ parts

-

10k+ parts

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1,577

$44.859

$36.784

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IDEA Electronic Components Group

UK . 685 parts In-Stock

1+ parts

$44.859

100+ parts

$42.616

1k+ parts

$40.373

10k+ parts

-

685

$44.859

$42.616

$40.373

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Argo Parts USA

USA . 4,054 parts In-Stock

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4,054

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Netroflash

USA . 50 parts In-Stock

1+ parts

-

100+ parts

$5.487

1k+ parts

$5.319

10k+ parts

$5.207

50

-

$5.487

$5.319

$5.207

Overview

Unlock the power of innovation with the Texas Instruments MSP430F67751AIPEUR, a cutting-edge microprocessor circuit designed to meet the demands of industrial applications. With advanced features like multiple ADC channels, DMA capabilities, and PWM channels, this device offers unmatched performance and reliability. Experience seamless connectivity with I2C, IRDA, SPI, and UART interfaces, allowing for easy integration into your designs. Trust in Texas Instruments' reputation for quality and excellence, making the MSP430F67751AIPEUR the ideal choice for your next project. Step into the future of technology with this exceptional product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the integrated circuits inside, ensuring long-term reliability.

Maximum Supply Voltage: 3.6 V

Can handle higher voltages without risk of damage, making it suitable for a wide range of applications.

Bit Size: 16

Higher bit size allows for more complex operations and calculations, increasing the capabilities of the product.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold conditions, making it suitable for various environments.

ADC Channels: YES

Integrated Analog to Digital Converters enable the product to interface with analog sensors and signals.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Being a microprocessor circuit, it offers versatile functionality and can handle various tasks efficiently.

Bus Compatibility: I2C; SPI; UART

Support for multiple communication protocols allows for easy integration with other devices and systems.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F67751AIPEUR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

.032768 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

90

No. of Terminals:

128

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

16384

RAM Words:

16

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(4), SPI(6), UART(4)

Peripherals:

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

MSP430F67751AIPEUR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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