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MSP430F67451IPEU

Texas Instruments

MSP430F67451IPEU by Texas Instruments

MSP430F67451IPEU by Texas Instruments is a 16-bit microprocessor with 131072 ROM words and 16384 RAM bytes. Operating at -40 to 85 °C, it features I2C, SPI, UART bus compatibility for industrial applications requiring low power consumption. With a max supply voltage of 3.6 V and package style of flatpack, it's suitable for compact designs in various electronic devices.

Median Price

$7.055

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,766 parts In-Stock

1+ parts

$7.055

100+ parts

$5.751

1k+ parts

$3.834

10k+ parts

-

1,766

$7.055

$5.751

$3.834

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 275 parts In-Stock

1+ parts

$6.702

100+ parts

-

1k+ parts

-

10k+ parts

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275

$6.702

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Vyrian

USA . 3,643 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,643

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,418 parts In-Stock

1+ parts

$6.350

100+ parts

-

1k+ parts

-

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1,418

$6.350

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Corohmni

South Africa . 4,870 parts In-Stock

1+ parts

$11.095

100+ parts

-

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4,870

$11.095

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AZTECH Wire

Italy . 83 parts In-Stock

1+ parts

$16.020

100+ parts

-

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83

$16.020

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Parana Technologies

USA . 1,701 parts In-Stock

1+ parts

$36.254

100+ parts

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1,701

$36.254

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ChromeModa Solutions

Germany . 3,553 parts In-Stock

1+ parts

$40.735

100+ parts

$33.403

1k+ parts

-

10k+ parts

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3,553

$40.735

$33.403

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IDEA Electronic Components Group

UK . 1,182 parts In-Stock

1+ parts

$40.735

100+ parts

$38.698

1k+ parts

$36.662

10k+ parts

-

1,182

$40.735

$38.698

$36.662

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Component Stockers USA

USA . 2,116 parts In-Stock

1+ parts

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2,116

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DigiPath Technology Company

USA . 2,113 parts In-Stock

1+ parts

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100+ parts

$36.727

1k+ parts

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2,113

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$36.727

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Perfect Parts

USA . 212 parts In-Stock

1+ parts

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212

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Overview

Discover the endless possibilities with the Texas Instruments MSP430F67451IPEU microprocessor circuit, a high-quality product designed to meet your needs. With its advanced technology and innovative features, this device offers unrivaled performance and reliability. Ideal for a wide range of applications, this product provides seamless integration, low power consumption, and efficient operation. Experience the value and benefits of this versatile solution, tailored to exceed your expectations and deliver exceptional results every time. Choose Texas Instruments for cutting-edge solutions that elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic epoxy material is durable and lightweight, making the product easy to handle and resistant to damage.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving time and effort.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage provides flexibility in power input options.

Package Shape: RECTANGULAR

Rectangular package shape allows for efficient use of space on the circuit board.

Bit Size: 16

16-bit architecture enables higher processing capabilities and precision in operations.

Power Supplies (V): 2/3.3

Multiple power supply options allow for compatibility with different systems and environments.

No. of Terminals: 128

Higher number of terminals provide more connectivity options and flexibility in circuit design.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Flatpack design with low profile and fine pitch enhances space efficiency and ease of integration.

Minimum Supply Voltage: 1.8 V

Lower minimum supply voltage ensures efficient power consumption and operation at lower voltages.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows for reliability in various environmental conditions.

CPU Family: MSP430

MSP430 CPU family is known for its low power consumption and high performance, making it ideal for energy-efficient applications.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures reliable performance even in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish provides excellent conductivity and corrosion resistance for long-term reliability.

ADC Channels: YES

Built-in ADC channels enable analog to digital conversion, expanding the range of input signals the product can process.

Terminal Position: QUAD

Quad terminal position allows for easy and secure connections on the circuit board.

ROM Words: 131072

Large ROM capacity accommodates extensive programming and data storage requirements.

Maximum Seated Height: 1.6 mm

Low maximum seated height minimizes space usage and allows for compact device design.

RAM Words: 16

Although small, the RAM capacity is sufficient for temporary data storage and processing needs.

Width: 14 mm

Compact width size contributes to space efficiency and flexibility in circuit board layout.

Maximum Time At Peak Reflow Temperature (s): 30

Product can withstand peak reflow temperature for 30 seconds, ensuring reliable soldering during manufacturing.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability ensures effective soldering and component bonding during assembly.

Length: 20 mm

Moderate length size provides a balance between space efficiency and accessibility for connections.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable performance in harsh operating conditions.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Inclusion of microprocessor circuit enhances the product's processing capabilities and overall performance.

RAM Bytes: 16384

Large RAM capacity allows for efficient data processing and storage operations.

Technology: CMOS

CMOS technology offers low power consumption and high speed performance, making the product energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminal form provides secure soldering connections and mechanical strength on the circuit board.

Maximum Supply Current: 11.75 mA

Low maximum supply current consumption minimizes power usage and heat generation, enhancing energy efficiency.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent and reliable operation of the product.

ROM Programmability: FLASH

Flash ROM programmability offers flexibility for reprogramming and updating software without requiring physical replacement of components.

Bus Compatibility: I2C; SPI; UART

Multiple bus compatibility options expand the product's connectivity and communication capabilities with various devices and systems.

Terminal Pitch: 0.5 mm

Narrow terminal pitch allows for fine-pitch soldering and compact circuit board design.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate moisture sensitivity, requiring standard precautions during storage and handling to prevent damage.

Speed: 25 rpm

High speed capability enables fast data processing and response times for efficient operation.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F67451IPEU attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

128

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.63X.87,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

RAM Words:

16

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F67451IPEU Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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