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M38510/01006BEB

Texas Instruments

M38510/01006BEB by Texas Instruments

M38510/01006BEB by Texas Instruments is a MILITARY-grade TTL Decoder & Driver with 16 terminals. It operates at temperatures ranging from -55 to 125 °C and has a supply voltage of 5V. This RECTANGULAR package in CERAMIC material is ideal for applications requiring precise signal decoding and driving capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,994 parts In-Stock

1+ parts

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7,994

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Digiode

USA . 4,217 parts In-Stock

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4,217

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Beltway Electronics Company

USA . 3 parts In-Stock

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3

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,195 parts In-Stock

1+ parts

$9.628

100+ parts

-

1k+ parts

$10.221

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2,195

$9.628

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$10.221

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IDEA Electronic Components Group

UK . 2,058 parts In-Stock

1+ parts

$10.818

100+ parts

$10.277

1k+ parts

$9.736

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-

2,058

$10.818

$10.277

$9.736

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ChromeModa Solutions

Germany . 1,010 parts In-Stock

1+ parts

$10.818

100+ parts

$8.871

1k+ parts

-

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1,010

$10.818

$8.871

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AZTECH Wire

Italy . 226 parts In-Stock

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$11.664

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226

$11.664

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One Stop Electronics

USA . 858 parts In-Stock

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$58.000

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858

$58.000

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Corphita

USA . 4,578 parts In-Stock

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4,578

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DigiPath Technology Company

USA . 659 parts In-Stock

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$9.754

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659

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$9.754

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Overview

Enhance your electronic projects with the M38510/01006BEB by Texas Instruments, a top-tier manufacturer known for producing high-quality Decoder & Drivers. This versatile component offers reliable performance and precise functionality, making it perfect for a wide range of applications. With a military-grade temperature grade and a durable ceramic package body material, this decoder promises long-lasting durability and stability. Upgrade your designs with ease and efficiency, thanks to the value and benefits this product brings to the table.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages offer excellent thermal conductivity and stability, making them ideal for high temperature environments and long-term reliability.

Screening Level: 38535Q/M;38534H;883B

High screening levels ensure that the product meets stringent quality and reliability standards, making it suitable for mission-critical applications.

Package Shape: RECTANGULAR

Rectangular packages provide a compact and efficient design that can easily fit into various electronic systems.

Nominal Supply Voltage / Vsup (V): 5

A 5V supply voltage makes integration with other standard components and systems easy and straightforward.

Power Supplies (V): 5

Consistent 5V power supplies ensure stable and reliable operation of the decoder and driver.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this product can withstand extreme environmental conditions.

Minimum Operating Temperature: -55 °C

The ability to operate at temperatures as low as -55°C makes this product suitable for a wide range of applications, including in harsh environments.

Terminal Position: DUAL

Dual terminal positions provide flexibility in connection options and ease of installation in electronic circuits.

Temperature Grade: MILITARY

Military-grade temperature tolerance ensures reliable performance in demanding and mission-critical applications.

Technology: TTL

TTL technology offers fast switching speeds and compatibility with various digital systems, making it a versatile choice for decoder and driver applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical connections and are ideal for applications where durability and stability are essential.

Terminal Pitch: 2.54 mm

A standard terminal pitch of 2.54mm allows for easy integration with other components on a circuit board and simplifies the assembly process.

Technical Specifications

Decoder & Drivers M38510/01006BEB attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T16

Logic IC Type:

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

Decoder/Drivers

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

M38510/01006BEB Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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