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M38510/01004BEX

Texas Instruments

M38510/01004BEX by Texas Instruments

M38510/01004BEX by Texas Instruments is a TTL decoder with 16 terminals, 50 ns propagation delay, and inverted output polarity. It operates in military-grade temperatures from -55 to 125 °C and has a package style of IN-LINE. Ideal for applications requiring open-collector output characteristics and standard input conditioning.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,377 parts In-Stock

1+ parts

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4,377

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Vyrian

USA . 4,376 parts In-Stock

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4,376

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 300 parts In-Stock

1+ parts

$9.492

100+ parts

-

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300

$9.492

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One Stop Electronics

USA . 1,361 parts In-Stock

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$19.000

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1,361

$19.000

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Parana Technologies

USA . 1,755 parts In-Stock

1+ parts

$19.161

100+ parts

$1,779.372

1k+ parts

$17.245

10k+ parts

-

1,755

$19.161

$1,779.372

$17.245

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DigiPath Technology Company

USA . 2,105 parts In-Stock

1+ parts

$21.098

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2,105

$21.098

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ChromeModa Solutions

Germany . 4,848 parts In-Stock

1+ parts

$21.529

100+ parts

$17.654

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4,848

$21.529

$17.654

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IDEA Electronic Components Group

UK . 2,146 parts In-Stock

1+ parts

$21.529

100+ parts

$20.453

1k+ parts

$19.376

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2,146

$21.529

$20.453

$19.376

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Corphita

USA . 2,148 parts In-Stock

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2,148

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Overview

Elevate your electronic designs with the M38510/01004BEX by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and reliability in their products. The M38510/01004BEX falls into the Decoder & Drivers category, offering versatility in various applications. With its advanced technology and military-grade temperature grade, this decoder provides unmatched performance and precision. Trust Texas Instruments to deliver exceptional value and benefits to meet all your electronic needs. Choose the M38510/01004BEX for superior quality and reliability in your next project.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed body material provides durability and protection, making this decoder & driver a reliable choice for long-term use.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard supply voltage of 5V ensures compatibility with a wide range of electronic devices, making it versatile and convenient to use.

Propagation Delay (tpd): 50 ns

With a fast propagation delay of 50 ns, this decoder & driver can quickly process input signals and deliver output, enhancing the overall efficiency of the system.

Output Characteristics: OPEN-COLLECTOR

The open-collector output allows for easy interfacing with other components or devices, offering flexibility in system design and integration.

Temperature Grade: MILITARY

Designed to operate in military-grade temperature environments, this decoder & driver is suitable for use in rugged applications where reliability under extreme conditions is essential.

Technical Specifications

Decoder & Drivers M38510/01004BEX attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Family:

TTL/H/L

Input Conditioning:

STANDARD

JESD-30 Code:

R-GDIP-T16

Length:

19.56 mm

Logic IC Type:

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

OPEN-COLLECTOR

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Propagation Delay (tpd):

50 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

M38510/01004BEX Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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