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M38510/01001BEA

Texas Instruments

M38510/01001BEA by Texas Instruments

M38510/01001BEA by Texas Instruments is a TTL decoder with 16 terminals and a 5V supply voltage. It offers a propagation delay of 46ns, max operating temperature of 125°C, and can handle up to 16A of current. Ideal for military applications requiring high-speed decoding in harsh environments.

Median Price

$25.240

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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American Microsemiconductor Inc.

USA . 4 parts In-Stock

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$25.240

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Vyrian

USA . 6,596 parts In-Stock

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Digiode

USA . 2,332 parts In-Stock

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Anansix

USA . 591 parts In-Stock

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J2 Sourcing AB

Sweden . 272 parts In-Stock

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Resion

USA . 119 parts In-Stock

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AZTECH Wire

Italy . 264 parts In-Stock

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$12.299

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Parana Technologies

USA . 861 parts In-Stock

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$12.860

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$13.339

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DigiPath Technology Company

USA . 2,323 parts In-Stock

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$14.160

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ChromeModa Solutions

Germany . 3,749 parts In-Stock

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$14.449

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$11.848

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IDEA Electronic Components Group

UK . 820 parts In-Stock

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$14.449

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$13.727

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$13.004

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One Stop Electronics

USA . 916 parts In-Stock

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$48.000

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Corphita

USA . 1,526 parts In-Stock

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Overview

Upgrade your electronic projects with the top-quality M38510/01001BEA decoder and driver by Texas Instruments. With a military-grade screening level and a wide temperature range, this ceramic package delivers reliable performance in extreme conditions. Ideal for applications requiring precision and efficiency, this product boasts a quick propagation delay and low power consumption. Trust Texas Instruments to provide you with cutting-edge technology that enhances your designs and ensures seamless operation every time. Elevate your projects with the M38510/01001BEA and experience unparalleled quality and performance.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent heat dissipation, making the product durable and reliable for long-term use.

Propagation Delay At Nominal Supply: 46 ns

Low propagation delay ensures fast and efficient signal processing, making this decoder & driver suitable for time-sensitive applications.

Screening Level: 38535Q/M;38534H;883B

Compliance with multiple screening levels ensures high quality and reliability in performance, meeting industry standards.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard nominal supply voltage of 5V makes this decoder & driver compatible with a wide range of systems and applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions, increasing its versatility and durability.

Technical Specifications

Decoder & Drivers M38510/01001BEA attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T16

Logic IC Type:

Maximum I (ol):

16 Amp

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

41 mA

Propagation Delay At Nominal Supply:

46 ns

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

Decoder/Drivers

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

M38510/01001BEA Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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