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SNJ54LS248W

Texas Instruments

SNJ54LS248W by Texas Instruments

SNJ54LS248W by Texas Instruments is a TTL decoder with 16 terminals and open-collector outputs. It operates at a supply voltage of 5V, with a propagation delay of 100ns. Ideal for military applications requiring fast signal decoding in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,765 parts In-Stock

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5,765

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Digiode

USA . 454 parts In-Stock

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454

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Distributors (Availability)

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AZTECH Wire

Italy . 772 parts In-Stock

1+ parts

$14.438

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772

$14.438

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Parana Technologies

USA . 1,203 parts In-Stock

1+ parts

$16.679

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$16.941

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1,203

$16.679

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$16.941

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DigiPath Technology Company

USA . 334 parts In-Stock

1+ parts

$18.366

100+ parts

$16.897

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334

$18.366

$16.897

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ChromeModa Solutions

Germany . 4,795 parts In-Stock

1+ parts

$18.741

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$15.368

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4,795

$18.741

$15.368

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IDEA Electronic Components Group

UK . 1,616 parts In-Stock

1+ parts

$18.741

100+ parts

$17.804

1k+ parts

$16.867

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1,616

$18.741

$17.804

$16.867

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One Stop Electronics

USA . 1,593 parts In-Stock

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$26.000

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$26.000

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Corphita

USA . 4,590 parts In-Stock

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4,590

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Overview

Elevate your circuit designs with the SNJ54LS248W by Texas Instruments, a high-quality decoder and driver that offers exceptional performance and reliability. Manufactured by industry-leader Texas Instruments, this product is ideal for a wide range of applications, ensuring seamless integration and superior functionality. With its advanced features and cutting-edge technology, the SNJ54LS248W provides unmatched value and benefits to customers, delivering consistent results and optimizing efficiency. Upgrade your projects with confidence and precision using this top-of-the-line component from Texas Instruments.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired material ensures high reliability and durability, making this product suitable for harsh environmental conditions.

Surface Mount: YES

Being surface mountable makes installation easier and more efficient, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard nominal supply voltage of 5V ensures compatibility with various systems and applications.

Propagation Delay (tpd): 100 ns

With a fast propagation delay of 100 ns, this decoder and driver can swiftly process input signals, enhancing overall system performance.

Output Characteristics: OPEN-COLLECTOR WITH PULLUP

The open-collector output with pullup configuration allows for flexible connectivity and control, enabling versatile usage in different circuit designs.

Technical Specifications

Decoder & Drivers SNJ54LS248W attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Additional Features:

RIPPLE BLANKING; LAMP TEST INPUT

Family:

LS

Input Conditioning:

STANDARD

JESD-30 Code:

R-CDFP-F16

Length:

10.2 mm

Load Capacitance (CL):

15 pF

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

OPEN-COLLECTOR WITH PULLUP

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DFP

Package Equivalence Code:

FL16,.3

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

38 mA

Propagation Delay (tpd):

100 ns

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Maximum Seated Height:

2.03 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.73 mm

Trade Compliance

SNJ54LS248W Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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