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CD74HC4514M

Texas Instruments

CD74HC4514M by Texas Instruments

CD74HC4514M by Texas Instruments is a 16-bit decoder with 23ns propagation delay, ideal for applications requiring fast signal processing. With a supply voltage range of 2-6V and load capacitance of 50pF, it operates efficiently in various electronic systems. Its compact small outline package and surface mount capability make it suitable for space-constrained designs.

Median Price

$2.298

Lifecycle Status

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1k+

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Chip1Stop

Japan . 2 parts In-Stock

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RS (Exports)

UK . 5 parts In-Stock

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$3.353

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$2.724

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Verical

USA . 255 parts In-Stock

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$2.375

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Rochester

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$1.700

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DigiKey

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Avnet

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Nova Conductors

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Digiode

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$2.128

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$2.128

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Component Electronics Inc.

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$3.850

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$2.880

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$2.500

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$3.850

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$2.500

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Vyrian

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Chip Stock

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First Choice Components Inc.

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Bristol Electronics

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Atlantic Semiconductor

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PC Components Company LLC

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Corphita

USA . 290 parts In-Stock

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$2.016

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Continental Prestige Electronics

USA . 4,711 parts In-Stock

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$2.061

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Argo Parts USA

USA . 4,658 parts In-Stock

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$2.061

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Netroflash

USA . 100 parts In-Stock

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$2.061

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AZTECH Wire

Italy . 344 parts In-Stock

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$7.225

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Parana Technologies

USA . 431 parts In-Stock

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$9.801

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$10.371

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DigiPath Technology Company

USA . 107 parts In-Stock

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$10.792

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ChromeModa Solutions

Germany . 1,662 parts In-Stock

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$11.012

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$9.030

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IDEA Electronic Components Group

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$10.461

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Corohmni

South Africa . 728 parts In-Stock

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Microchip USA

USA . 6,187 parts In-Stock

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Glotronic Ltd.

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QUARKTWIN TECHNOLOGY LTD

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Perfect Parts

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Supply Digital

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GreenTree Electronics

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Overview

Enhance your electronic projects with the Texas Instruments CD74HC4514M Decoder & Drivers. With a reputation for high-quality products, Texas Instruments delivers reliability and precision in every component. This versatile decoder offers 16 bits of input conditioning, making it ideal for a wide range of applications. From industrial automation to consumer electronics, this product provides value by delivering fast propagation delays and efficient power supplies. Trust Texas Instruments to elevate your designs with the CD74HC4514M.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the decoder & drivers.

Propagation Delay At Nominal Supply: 23 ns

Low propagation delay ensures quick response times in data processing, making this product efficient for time-sensitive applications.

Surface Mount: YES

Surface mount capability allows for easy integration into circuit boards, saving space and simplifying the manufacturing process.

Input Conditioning: LATCHED

Latched input conditioning ensures stable and reliable signal processing, reducing the risk of errors or signal interference.

Package Shape: RECTANGULAR

Rectangular package shape provides a practical and space-saving design for installation in electronic devices.

No. of Bits: 16

With 16 bits, this product offers high-resolution and precise data processing capabilities.

Nominal Supply Voltage / Vsup (V): 4.5

Operates at a moderate supply voltage, suitable for various electronic applications.

Load Capacitance (CL): 50 pF

Optimal load capacitance ensures efficient performance and signal integrity.

Power Supplies (V): 2/6

Compatibility with a range of power supply voltages offers flexibility in system integration.

No. of Terminals: 24

Having 24 terminals allows for versatile connectivity options and complex circuit configurations.

Package Style (Meter): SMALL OUTLINE

Small outline package style facilitates space-efficient PCB layout and component placement.

Maximum I (ol): 5.2 Amp

High output current capability supports driving multiple loads or high-power devices.

Propagation Delay (tpd): 415 ns

Although higher than the nominal supply propagation delay, 415 ns is still acceptable for many applications requiring precision timing.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and prolonged use.

Minimum Operating Temperature: -55 °C

Wide operating temperature range ensures reliable performance in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold terminal finish provides excellent conductivity and corrosion resistance for long-term reliability.

Terminal Position: DUAL

Dual terminal positioning allows for enhanced stability and secure connections in the circuit.

Maximum Seated Height: 2.65 mm

Low profile design with a maximum seated height of 2.65 mm enables compact device assembly.

Width: 7.5 mm

Narrow width makes this product suitable for applications where space is limited.

Output Polarity: TRUE

True output polarity ensures correct signal interpretation and compatibility with other components in the system.

Minimum Supply Voltage (Vsup): 2 V

Low minimum supply voltage allows for operation in power-constrained environments.

Maximum Time At Peak Reflow Temperature (s): 30

Sufficient time at peak reflow temperature ensures proper soldering and component reliability during manufacturing.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance supports lead-free soldering processes for RoHS compliance.

Length: 15.4 mm

Compact length dimension facilitates easy integration into electronic assemblies.

Temperature Grade: MILITARY

Military-grade temperature tolerance ensures reliable operation in harsh environmental conditions and demanding applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient and reliable operation.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and secure solder joints during PCB assembly.

Packing Method: TUBE

Tube packing method ensures safe transportation and storage of the product before installation.

Terminal Pitch: 1.27 mm

Standard terminal pitch allows for easy alignment and installation on PCBs with compatible spacing.

Maximum Supply Voltage (Vsup): 6 V

High maximum supply voltage rating accommodates a wide range of system power requirements.

Maximum Power Supply Current (ICC): 0.16 mA

Low power supply current consumption contributes to energy efficiency and prolongs battery life in portable devices.

Technical Specifications

Decoder & Drivers CD74HC4514M attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Additional Features:

ADDRESS LATCHES

Family:

HC

Input Conditioning:

LATCHED

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

15.4 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

5.2 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

16

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.16 mA

Propagation Delay At Nominal Supply:

23 ns

Propagation Delay (tpd):

415 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

CD74HC4514M Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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