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74LVC139PW,112

NXP Semiconductors

74LVC139PW,112 by NXP Semiconductors

NXP Semiconductors' 74LVC139PW,112 is a Decoder & Drivers IC with 7ns propagation delay and 2 functions. Operating at -40 to 125 °C, it has a supply voltage of 1.2-3.6V and load capacitance of 50pF. Ideal for automotive applications due to its compact size and low power consumption.

Median Price

$0.298

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 60,000 parts In-Stock

1+ parts

-

100+ parts

$0.391

1k+ parts

$0.325

10k+ parts

$0.289

60,000

-

$0.391

$0.325

$0.289

Verical

USA . 60,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.406

10k+ parts

$0.362

60,000

-

-

$0.406

$0.362

Farnell

UK . 60,000 parts In-Stock

1+ parts

-

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$0.205

60,000

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$0.205

DigiKey

USA . 10,185 parts In-Stock

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$0.490

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10,185

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$0.490

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Arrow

USA . 7,051 parts In-Stock

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$0.104

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7,051

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$0.104

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Chip1Stop

Japan . 7,051 parts In-Stock

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$0.122

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7,051

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$0.122

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Distributors (In-Stock)

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Nova Conductors

Japan . 10 parts In-Stock

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$0.105

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10

$0.105

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Digiode

USA . 3,195 parts In-Stock

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$0.156

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$0.156

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Chip Stock

USA . 134,000 parts In-Stock

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VNN

France . 8,223 parts In-Stock

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Vyrian

USA . 5,314 parts In-Stock

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Anansix

USA . 598 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 60 parts In-Stock

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Distributors (Availability)

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$0.105

100+ parts

-

1k+ parts

$0.099

10k+ parts

$0.097

2,000

$0.105

-

$0.099

$0.097

Argo Parts USA

USA . 792 parts In-Stock

1+ parts

$0.105

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$0.102

792

$0.105

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$0.102

Corphita

USA . 3,713 parts In-Stock

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$0.148

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$0.148

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AZTECH Wire

Italy . 11,768 parts In-Stock

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$0.190

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$0.190

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Continental Prestige Electronics

USA . 60,000 parts In-Stock

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$0.197

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Supply Digital

USA . 2,355 parts In-Stock

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GreenTree Electronics

Israel . 2,208 parts In-Stock

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Perfect Parts

USA . 968 parts In-Stock

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UNI Independent Distributors

Spain . 685 parts In-Stock

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Microchip USA

USA . 241 parts In-Stock

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iodParts Technologies Inc.

India . 60 parts In-Stock

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Overview

Elevate your electronics projects with the 74LVC139PW,112 by NXP Semiconductors. This top-quality Decoder & Driver offers high performance and reliability, perfect for a wide range of applications. NXP Semiconductors is known for its cutting-edge technology and innovation in the semiconductor industry, ensuring that you get the best value for your money. With fast propagation delay and a compact design, this product is a game-changer for any project. Upgrade your designs today with the 74LVC139PW,112 and experience the difference!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the decoder and driver, ensuring long-lasting performance.

Propagation Delay At Nominal Supply: 7 ns

Low propagation delay allows for quick response times, making this decoder and driver suitable for high-speed applications.

Surface Mount: YES

Surface mount capability enables easy and efficient installation on a circuit board, saving space and simplifying the assembly process.

Nominal Supply Voltage / Vsup (V): 2.7

The operating voltage of 2.7V makes this decoder and driver compatible with a variety of power sources, enhancing versatility in design.

Temperature Grade: AUTOMOTIVE

Designed to withstand automotive temperature requirements, ensuring reliable operation in automotive applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this decoder and driver energy-efficient and reliable in noisy environments.

Technical Specifications

Decoder & Drivers 74LVC139PW,112 attributes and parameters. Explore more Decoder & Drivers devices from NXP Semiconductors

Specs

Family:

LVC/LCX/Z

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

BULK

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

7 ns

Propagation Delay (tpd):

8 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

74LVC139PW,112 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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