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M38510/30701B2A

Texas Instruments

M38510/30701B2A by Texas Instruments

Texas Instruments M38510/30701B2A is an 8-bit decoder with 41ns propagation delay, suitable for military applications. It operates at a nominal voltage of 5V and has a max power supply current of 10mA. This chip carrier package features a ceramic, metal-sealed co-fired body material and is designed for surface mount assembly.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,931 parts In-Stock

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Anansix

USA . 2,302 parts In-Stock

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Digiode

USA . 2,186 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 289 parts In-Stock

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$17.132

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Parana Technologies

USA . 1,762 parts In-Stock

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$24.890

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$2,311.390

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$22.401

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$2,311.390

$22.401

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DigiPath Technology Company

USA . 802 parts In-Stock

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$27.407

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$25.214

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802

$27.407

$25.214

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ChromeModa Solutions

Germany . 2,918 parts In-Stock

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$27.966

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$22.932

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IDEA Electronic Components Group

UK . 1,123 parts In-Stock

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$27.966

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$26.568

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$25.169

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One Stop Electronics

USA . 733 parts In-Stock

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$35.000

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Corphita

USA . 3,392 parts In-Stock

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Microchip USA

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Overview

Looking for top-quality Decoder & Drivers? Look no further than the M38510/30701B2A by Texas Instruments. With a reputation for excellence in semiconductor manufacturing, Texas Instruments delivers products that are reliable, efficient, and durable. This versatile chip carrier is ideal for a variety of applications, offering a fast propagation delay, low power consumption, and standard input conditioning. Trust in Texas Instruments to provide the high-quality components you need for your next project.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired materials ensures durability and reliability, making it suitable for harsh environments.

Propagation Delay At Nominal Supply: 41 ns

Low propagation delay ensures fast response times, making it ideal for applications where speed is crucial.

Surface Mount: YES

Being surface mount compatible makes it easy to integrate into circuit boards and saves space in the overall design.

Nominal Supply Voltage: 5V

Operates at a standard 5V supply voltage, making it compatible with a wide range of systems and applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, it can withstand elevated temperatures without compromising performance.

Technology: TTL

Utilizes TTL technology known for its reliability and simplicity, making it a trusted choice for decoding and driving circuitry.

Technical Specifications

Decoder & Drivers M38510/30701B2A attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Family:

LS

Input Conditioning:

STANDARD

JESD-30 Code:

S-CQCC-N20

JESD-609 Code:

e0

Length:

8.89 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TUBE

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

10 mA

Propagation Delay At Nominal Supply:

41 ns

Propagation Delay (tpd):

65 ns

Qualification:

Qualified

Screening Level:

MIL-PRF-38535 Class B

Maximum Seated Height:

2.03 mm

Sub-Category:

Decoder/Driver

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.89 mm

Trade Compliance

M38510/30701B2A Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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