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M38510/30701SEA

Texas Instruments

M38510/30701SEA by Texas Instruments

M38510/30701SEA by Texas Instruments is an 8-bit decoder & driver with a propagation delay of 41ns at 5V. It operates in military-grade conditions, with a temperature range from -55°C to 125°C. This TTL technology device has a max power supply current of 10mA and is ideal for applications requiring fast signal processing in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 8,462 parts In-Stock

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Anansix

USA . 2,970 parts In-Stock

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2,970

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Vyrian

USA . 1,928 parts In-Stock

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1,928

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Distributors (Availability)

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AZTECH Wire

Italy . 350 parts In-Stock

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$5.530

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350

$5.530

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Parana Technologies

USA . 1,324 parts In-Stock

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$15.251

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$15.648

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1,324

$15.251

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$15.648

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ChromeModa Solutions

Germany . 1,502 parts In-Stock

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$17.136

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$14.052

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1,502

$17.136

$14.052

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IDEA Electronic Components Group

UK . 1,189 parts In-Stock

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$17.136

100+ parts

$16.279

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$15.422

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1,189

$17.136

$16.279

$15.422

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One Stop Electronics

USA . 2,088 parts In-Stock

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$20.000

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2,088

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UNI Independent Distributors

Spain . 5,610 parts In-Stock

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Corphita

USA . 4,238 parts In-Stock

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Microchip USA

USA . 1,598 parts In-Stock

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1,598

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DigiPath Technology Company

USA . 151 parts In-Stock

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$15.450

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151

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$15.450

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Overview

Discover the unparalleled reliability and precision of the M38510/30701SEA by Texas Instruments, a top-tier manufacturer known for cutting-edge technology. This decoder & driver device offers incredible performance with a low propagation delay, ideal for a wide range of applications. With a MIL-PRF-38535 Class S screening level and quality ceramic, glass-sealed package body material, this product ensures durability and longevity. Experience seamless operation and exceptional value with Texas Instruments' M38510/30701SEA, setting new standards in efficiency and performance.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed package body provides durability and protection for the internal components, making this product suitable for harsh environments.

Propagation Delay At Nominal Supply: 41 ns

With a fast propagation delay, this decoder & driver ensures quick response time for efficient signal processing.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage, this product is compatible with many common power sources.

No. of Bits: 8

With 8 bits, this decoder & driver offers a high level of precision and versatility in decoding and driving operations.

Maximum Operating Temperature: 125 °C

Capable of operating at high temperatures, this product can withstand demanding conditions without sacrificing performance.

Technical Specifications

Decoder & Drivers M38510/30701SEA attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Family:

LS

Input Conditioning:

STANDARD

JESD-30 Code:

R-GDIP-T16

JESD-609 Code:

e0

Length:

19.56 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

10 mA

Propagation Delay At Nominal Supply:

41 ns

Propagation Delay (tpd):

65 ns

Qualification:

Qualified

Screening Level:

MIL-PRF-38535 Class S

Maximum Seated Height:

5.08 mm

Sub-Category:

Decoder/Driver

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

6.92 mm

Trade Compliance

M38510/30701SEA Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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