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M38510/01004BEA

Texas Instruments

M38510/01004BEA by Texas Instruments

M38510/01004BEA by Texas Instruments is a TTL decoder with 16 terminals, operating at temperatures from -55 to 125°C. It has a propagation delay of 50 ns and an inverted output polarity, suitable for military-grade applications requiring open-collector output characteristics. The package style is in-line with ceramic and glass-sealed body material, making it ideal for high-reliability environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,922 parts In-Stock

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Digiode

USA . 3,898 parts In-Stock

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3,898

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Distributors (Availability)

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AZTECH Wire

Italy . 188 parts In-Stock

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$6.816

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$6.816

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Parana Technologies

USA . 1,334 parts In-Stock

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$26.248

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$26.842

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One Stop Electronics

USA . 578 parts In-Stock

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$27.000

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578

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DigiPath Technology Company

USA . 2,258 parts In-Stock

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$28.902

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$26.590

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$28.902

$26.590

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ChromeModa Solutions

Germany . 2,032 parts In-Stock

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$29.492

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$24.183

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$29.492

$24.183

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IDEA Electronic Components Group

UK . 1,343 parts In-Stock

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$29.492

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$28.017

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$26.543

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Corphita

USA . 3,363 parts In-Stock

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Overview

Unlock the power of reliable decoding and driving with the M38510/01004BEA by Texas Instruments. Crafted with precision and quality in mind, this decoder and driver offers unparalleled performance for a wide range of applications. From military-grade technology to standard input conditioning, this product delivers seamless operation with a nominal supply voltage of 5V. With a compact package style and inverted output polarity, this device is designed to meet the needs of demanding environments. Trust Texas Instruments for cutting-edge solutions that provide value, benefits, and advantages to customers seeking top-notch performance.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed body material ensures durability and reliability, making this product suitable for harsh environments.

Input Conditioning: STANDARD

Standard input conditioning allows for compatibility with a wide range of signal sources, making this decoder and driver versatile in various applications.

Nominal Supply Voltage / Vsup (V): 5

Having a nominal supply voltage of 5V is common and widely supported in many systems, ensuring easy integration.

Propagation Delay (tpd): 50 ns

With a fast propagation delay of 50 ns, this decoder and driver can quickly respond to input signals, making it ideal for time-sensitive applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C allows this product to perform reliably in elevated temperature conditions.

Output Characteristics: OPEN-COLLECTOR

The open-collector output allows for easy interfacing with other components or devices, enhancing flexibility in circuit design.

Technology: TTL

Being based on TTL technology ensures compatibility with many existing systems and standards, making this product a reliable choice for various applications.

Technical Specifications

Decoder & Drivers M38510/01004BEA attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Family:

TTL/H/L

Input Conditioning:

STANDARD

JESD-30 Code:

R-GDIP-T16

Length:

19.56 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

OPEN-COLLECTOR

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Propagation Delay (tpd):

50 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

M38510/01004BEA Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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