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LM3S9L97-IQC80-C5T

Texas Instruments

LM3S9L97-IQC80-C5T by Texas Instruments

LM3S9L97-IQC80-C5T by Texas Instruments is a 32-bit microcontroller with 131072 ROM words and 49152 RAM bytes. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring high-speed processing and multiple ADC/DMA channels. With a compact square package style and low profile, it's ideal for space-constrained designs in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,242 parts In-Stock

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8,242

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Digiode

USA . 1,812 parts In-Stock

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1,812

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,180 parts In-Stock

1+ parts

$17.192

100+ parts

-

1k+ parts

$17.410

10k+ parts

-

2,180

$17.192

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$17.410

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DigiPath Technology Company

USA . 923 parts In-Stock

1+ parts

$18.931

100+ parts

$17.416

1k+ parts

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923

$18.931

$17.416

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AZTECH Wire

Italy . 449 parts In-Stock

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$19.162

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449

$19.162

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ChromeModa Solutions

Germany . 2,907 parts In-Stock

1+ parts

$19.317

100+ parts

$15.840

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2,907

$19.317

$15.840

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IDEA Electronic Components Group

UK . 357 parts In-Stock

1+ parts

$19.317

100+ parts

$18.351

1k+ parts

$17.385

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357

$19.317

$18.351

$17.385

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One Stop Electronics

USA . 319 parts In-Stock

1+ parts

$28.000

100+ parts

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319

$28.000

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Corphita

USA . 3,208 parts In-Stock

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Microchip USA

USA . 122 parts In-Stock

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Overview

Unlock the potential of your projects with the LM3S9L97-IQC80-C5T microcontroller by Texas Instruments. Renowned for their high-quality products, Texas Instruments delivers exceptional performance and reliability in every device. Ideal for a wide range of applications, this microcontroller offers superior value with its advanced features and capabilities. From industrial automation to consumer electronics, this versatile microcontroller provides unmatched benefits and advantages to customers looking to innovate and succeed. Experience the difference with Texas Instruments LM3S9L97-IQC80-C5T.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for easy handling and protection of internal components.

Surface Mount: YES

Allows for easy and efficient mounting on circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

Provides flexibility in power supply options and compatibility with a wide range of applications.

Bit Size: 32

High-bit size allows for processing and handling of complex data and instructions.

Power Supplies (V): 1.2,3.3

Supports multiple voltage options for enhanced compatibility with different power sources.

No. of Terminals: 100

Sufficient terminals for connecting to peripheral devices and external components.

Package Style (Meter): FLATPACK

Flatpack design saves space and allows for compact integration into electronic systems.

Maximum Operating Temperature: 85 °C

High operating temperature range suitable for industrial environments and extended use.

ADC Channels: YES

Analog-to-digital converter channels for accurate and efficient conversion of analog signals.

RAM Bytes: 49152

Large RAM capacity for data storage and processing, suitable for complex applications.

Technical Specifications

Microcontrollers LM3S9L97-IQC80-C5T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

60

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

49152

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S9L97-IQC80-C5T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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