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LM3S9L97-IQC80-C5

Texas Instruments

LM3S9L97-IQC80-C5 by Texas Instruments

LM3S9L97-IQC80-C5 by Texas Instruments is a 32-bit microcontroller with 131072 ROM words and 49152 RAM bytes. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring high-speed processing. With features like ADC and DMA channels, it offers versatile functionality in a compact flatpack package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,733 parts In-Stock

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Digiode

USA . 241 parts In-Stock

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AZTECH Wire

Italy . 804 parts In-Stock

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$18.622

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$18.622

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One Stop Electronics

USA . 1,454 parts In-Stock

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$31.000

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Parana Technologies

USA . 763 parts In-Stock

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$66.010

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DigiPath Technology Company

USA . 1,081 parts In-Stock

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$72.685

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ChromeModa Solutions

Germany . 5,821 parts In-Stock

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$74.168

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$60.818

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$74.168

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IDEA Electronic Components Group

UK . 916 parts In-Stock

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$74.168

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$70.460

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$66.751

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916

$74.168

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$66.751

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Glotronic Ltd.

UK . 9,000 parts In-Stock

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Corphita

USA . 3,357 parts In-Stock

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Kepictronics

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Microchip USA

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Overview

Elevate your projects with the LM3S9L97-IQC80-C5 by Texas Instruments, a top-tier microcontroller that delivers unparalleled performance and reliability. Manufactured with precision, this cutting-edge device offers a wide range of applications in various industries. With advanced features like ADC and DMA channels, ROM programmability, and PWM channels, this microcontroller provides endless possibilities for innovation. Trust Texas Instruments to provide quality products that exceed expectations. Upgrade your systems today and experience the difference with the LM3S9L97-IQC80-C5.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and efficient PCB assembly, reducing manufacturing time and costs.

Maximum Supply Voltage: 3.6 V

Can handle higher voltage inputs, making it versatile for a variety of applications.

Package Shape: SQUARE

Helps in easier PCB layout and design, optimizing space usage.

Bit Size: 32

Provides a higher processing capability, suitable for complex tasks and computations.

Power Supplies (V): 1.2, 3.3

Offers flexibility in power options, allowing compatibility with different systems.

No. of Terminals: 100

Provides sufficient connectivity options for interfacing with external components and peripherals.

Package Style (Meter): FLATPACK

Enhances thermal performance and enables efficient heat dissipation for improved reliability.

Minimum Supply Voltage: 3 V

Can operate at lower voltage levels, conserving power and extending battery life.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Ensures reliable operation in extreme cold conditions, expanding the range of use cases.

ADC Channels: YES

Enables analog to digital conversion for interfacing with sensors and other analog devices.

DMA Channels: YES

Supports direct memory access for faster data transfers and improved system performance.

Terminal Position: QUAD

Facilitates easy soldering and maintenance, enhancing the overall reliability of the microcontroller.

ROM Words: 131072

Offers a large memory capacity for storing program data, ensuring sufficient space for complex algorithms.

Maximum Seated Height: 1.6 mm

Compact size allows for integration into space-constrained applications and devices.

Width: 14 mm

Compact dimensions make it suitable for small form factor designs, saving space on the PCB.

Maximum Clock Frequency: 16 MHz

Operating at a high clock frequency enables swift execution of instructions and real-time processing.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for efficient soldering during assembly, ensuring a reliable connection.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures during manufacturing processes without degradation.

Length: 14 mm

Compact form factor makes it suitable for space-restricted applications and PCB designs.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments, ensuring reliability and longevity.

Peripheral IC Type: MICROCONTROLLER

Designed specifically for microcontroller applications, providing optimized performance and features.

RAM Bytes: 49152

Offers a large amount of random access memory for data storage and manipulation during operation.

Technology: CMOS

Complementary metal-oxide-semiconductor technology ensures low power consumption and high speed operation.

Terminal Form: GULL WING

Facilitates easy soldering and rework, enhancing the overall reliability of the connection.

Nominal Supply Voltage: 3.3 V

Stable supply voltage ensures consistent performance and operational reliability.

PWM Channels: YES

Supports pulse-width modulation for precise control of motors and other devices.

ROM Programmability: FLASH

Flash memory enables easy reprogramming of the microcontroller, allowing for quick updates and revisions.

Terminal Pitch: 0.5 mm

Fine pitch terminals save space on the PCB and enable high-density mounting for compact designs.

Moisture Sensitivity Level (MSL): 3

Resistant to moisture ingress, ensuring reliability in humid environments.

Speed: 80 rpm

High processing speed enables quick response times and efficient operation.

No. of I/O Lines: 60

Sufficient I/O lines for interfacing with external devices and peripherals, enhancing connectivity options.

Technical Specifications

Microcontrollers LM3S9L97-IQC80-C5 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

60

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

49152

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S9L97-IQC80-C5 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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