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LM3S9L97-IQC80-C1

Texas Instruments

LM3S9L97-IQC80-C1 by Texas Instruments

LM3S9L97-IQC80-C1 by Texas Instruments is a 32-bit microcontroller with 131072 ROM words and 49152 RAM bytes. It operates at a max clock frequency of 16.384 MHz, suitable for industrial applications requiring ADC and DMA channels, as well as PWM functionality. The compact package style (14mm x 14mm) with a low seated height of 1.6mm makes it ideal for space-constrained designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,828 parts In-Stock

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8,828

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Digiode

USA . 1,985 parts In-Stock

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1,985

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Distributors (Availability)

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AZTECH Wire

Italy . 563 parts In-Stock

1+ parts

$12.427

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563

$12.427

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One Stop Electronics

USA . 1,114 parts In-Stock

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$34.000

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$34.000

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Parana Technologies

USA . 2,273 parts In-Stock

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$69.595

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2,273

$69.595

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IDEA Electronic Components Group

UK . 2,332 parts In-Stock

1+ parts

$78.197

100+ parts

$74.287

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$70.377

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2,332

$78.197

$74.287

$70.377

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ChromeModa Solutions

Germany . 2,136 parts In-Stock

1+ parts

$78.197

100+ parts

$64.122

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2,136

$78.197

$64.122

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Corphita

USA . 4,571 parts In-Stock

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4,571

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DigiPath Technology Company

USA . 1,242 parts In-Stock

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$70.502

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1,242

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$70.502

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Microchip USA

USA . 331 parts In-Stock

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Overview

Discover the cutting-edge LM3S9L97-IQC80-C1 microcontroller by Texas Instruments, a high-quality product that offers unmatched performance and reliability. As a leader in the industry, Texas Instruments ensures top-notch manufacturing standards for all its products. This versatile microcontroller is ideal for a wide range of applications, providing customers with unparalleled value and benefits. Whether you're looking to power your next IoT project or enhance industrial automation systems, the LM3S9L97-IQC80-C1 delivers exceptional speed, efficiency, and versatility. Upgrade your projects with this innovative microcontroller today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, making it suitable for various environments and applications.

Surface Mount: YES

Allows for easy and convenient soldering onto circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 1.32 V

Operates efficiently within a specified voltage range, ensuring stable performance and longevity.

Package Shape: SQUARE

Compact and space-saving design that can fit into tight spaces or applications with limited room.

Bit Size: 32

Offers a high level of processing power and capability for handling complex tasks and operations.

Power Supplies (V): 1.2,3.3

Supports multiple power supply options, allowing flexibility in designing and powering the microcontroller.

No. of Terminals: 100

Provides ample connectivity options for interfacing with peripherals, sensors, and other components in the system.

Package Style (Meter): FLATPACK

Facilitates easy installation and mounting on PCBs, contributing to a streamlined and efficient manufacturing process.

Minimum Supply Voltage: 1.08 V

Ensures reliable operation even at lower voltage levels, offering flexibility in power input requirements.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial applications that may experience elevated heat levels.

Minimum Operating Temperature: -40 °C

Functions reliably in cold environments, ensuring consistent performance across a wide temperature range.

ADC Channels: YES

Enables analog-to-digital conversion, allowing the microcontroller to interface with analog sensors and signals.

DMA Channels: YES

Supports direct memory access for efficient data transfer, improving overall system performance and responsiveness.

Terminal Position: QUAD

Facilitates easy connection and integration with other components on the circuit board, enhancing overall system reliability.

ROM Words: 131072

Provides ample storage for firmware and program code, accommodating large and complex applications.

Maximum Seated Height: 1.6 mm

Offers a low-profile design that can be incorporated into compact devices or space-constrained applications.

Width: 14 mm

Compact form factor that allows for easy integration into various electronic devices and systems.

Maximum Clock Frequency: 16.384 MHz

Operates at a high clock speed for swift data processing and real-time responsiveness in applications.

Length: 14 mm

Compact dimensions that enable easy placement and mounting within electronic devices or circuit boards.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments with reliable performance under tough operating conditions.

Peripheral IC Type: MICROCONTROLLER

Specifically designed for controlling and managing various peripherals and devices in embedded systems.

RAM Bytes: 49152

Offers ample random access memory for data storage and processing, supporting multitasking and complex applications.

Technology: CMOS

Utilizes complementary metal-oxide-semiconductor technology for low power consumption and high-speed operation.

Terminal Form: GULL WING

Facilitates secure and reliable soldering connections on circuit boards, ensuring stable electrical connections.

Nominal Supply Voltage: 1.2 V

Standard voltage level for reliable and efficient operation of the microcontroller, ensuring compatibility with common power sources.

PWM Channels: YES

Supports pulse-width modulation for precise control of connected devices, enabling precise and efficient performance.

ROM Programmability: FLASH

Allows for easy reprogramming of the read-only memory, enabling firmware updates and enhancements.

Terminal Pitch: 0.5 mm

Fine pitch spacing for terminals, facilitating high-density mounting on circuit boards and compact device designs.

Speed: 80 rpm

Operates at a specific speed suitable for various real-time applications and control functions.

No. of I/O Lines: 60

Provides a sufficient number of input/output lines for connecting external devices, sensors, and peripherals to the microcontroller.

Technical Specifications

Microcontrollers LM3S9L97-IQC80-C1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16.384 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

60

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

49152

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S9L97-IQC80-C1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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