Loading...

LM3S9G97-IQC80-A1

Texas Instruments

LM3S9G97-IQC80-A1 by Texas Instruments

LM3S9G97-IQC80-A1 by Texas Instruments is a 32-bit microcontroller with 100 terminals, operating at up to 16.384 MHz. It features ADC and DMA channels, suitable for industrial applications requiring a wide temperature range (-40 to 85°C) and low profile design (1.6mm height).

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,720 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,720

-

-

-

-

Digiode

USA . 1,124 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,124

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,434 parts In-Stock

1+ parts

$2.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,434

$2.000

-

-

-

AZTECH Wire

Italy . 293 parts In-Stock

1+ parts

$7.038

100+ parts

-

1k+ parts

-

10k+ parts

-

293

$7.038

-

-

-

Parana Technologies

USA . 1,505 parts In-Stock

1+ parts

$42.247

100+ parts

-

1k+ parts

-

10k+ parts

-

1,505

$42.247

-

-

-

ChromeModa Solutions

Germany . 4,145 parts In-Stock

1+ parts

$47.469

100+ parts

$38.925

1k+ parts

-

10k+ parts

-

4,145

$47.469

$38.925

-

-

IDEA Electronic Components Group

UK . 1,634 parts In-Stock

1+ parts

$47.469

100+ parts

$45.096

1k+ parts

$42.722

10k+ parts

-

1,634

$47.469

$45.096

$42.722

-

Corphita

USA . 1,891 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,891

-

-

-

-

DigiPath Technology Company

USA . 722 parts In-Stock

1+ parts

-

100+ parts

$42.798

1k+ parts

-

10k+ parts

-

722

-

$42.798

-

-

Microchip USA

USA . 361 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

361

-

-

-

-

Overview

Unlock the power of innovation with the LM3S9G97-IQC80-A1 microcontroller by Texas Instruments. This cutting-edge device offers unmatched quality and reliability, making it the go-to choice for a wide range of applications. From industrial automation to consumer electronics, this versatile microcontroller delivers superior performance and efficiency. Experience the seamless integration, advanced features, and endless possibilities that this product brings to the table. Elevate your projects to new heights with the LM3S9G97-IQC80-A1 and discover the true meaning of technological excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance between durability and cost-effectiveness, making the product suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, reducing production time and cost.

Maximum Supply Voltage: 1.365 V

With a high maximum supply voltage, the product can handle fluctuations in the power supply without risk of damage.

Package Shape: SQUARE

The square shape allows for efficient use of space on the PCB, ideal for compact designs.

Bit Size: 32

A 32-bit architecture provides higher processing power and capabilities, suitable for complex tasks and applications.

No. of Terminals: 100

Having a high number of terminals allows for a greater connection versatility and functionality in the system.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style offers a compact and space-saving design, ideal for applications where size constraints are a concern.

Minimum Supply Voltage: 1.235 V

The low minimum supply voltage ensures efficient power consumption and operation, especially in battery-powered devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand harsh environments and extended use without overheating.

Minimum Operating Temperature: -40 °C

The wide operating temperature range allows for reliable performance in both extreme cold and hot conditions.

ADC Channels: YES

Having Analog-to-Digital Converter (ADC) channels enables the product to interface with analog sensors and signals, expanding its capabilities.

DMA Channels: YES

Direct Memory Access (DMA) channels improve data transfer efficiency and reduce CPU load, enhancing overall system performance.

Terminal Position: QUAD

Quad terminal position provides a stable and secure connection, reducing the risk of signal loss or disconnect during operation.

Maximum Seated Height: 1.6 mm

The low seated height allows for a slim and compact profile, ideal for applications with tight space constraints.

Width: 14 mm

A compact width dimension ensures easy integration into various PCB layouts, making it versatile for different system designs.

Maximum Clock Frequency: 16.384 MHz

A high clock frequency enables fast processing and response times, suitable for real-time applications and tasks.

Maximum Time At Peak Reflow Temperature (s): 30

The short time at peak reflow temperature reduces the risk of component damage during soldering, ensuring product reliability.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, the product can withstand the soldering process without deformation or damage.

Length: 14 mm

A compact length dimension allows for efficient use of space on the PCB, ideal for space-constrained applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh industrial environments with varying temperature conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture provides efficient processing and low power consumption, making it suitable for embedded systems and IoT devices.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ensuring efficient and reliable operation of the product.

Terminal Form: GULL WING

Gull wing terminal form provides a strong and secure connection, minimizing the risk of signal loss or disconnection during operation.

Nominal Supply Voltage: 1.3 V

The nominal supply voltage provides a stable operating voltage for the product, ensuring consistent performance under varying load conditions.

PWM Channels: YES

Pulse Width Modulation (PWM) channels enable precise control of analog signals, making the product suitable for motor control and power regulation.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and flexible firmware updates, enhancing the product's versatility and adaptability.

Terminal Pitch: 0.5 mm

The small terminal pitch provides high-density interconnectivity, suitable for applications with limited PCB space.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the product can withstand exposure to moderate levels of moisture during storage and handling, ensuring long-term reliability.

Speed: 80 rpm

With a high speed rating, the product can process data and execute tasks quickly, suitable for real-time control applications.

No. of I/O Lines: 60

Having a high number of I/O lines provides versatile connectivity options and interface capabilities, enabling the product to interface with various external devices.

Technical Specifications

Microcontrollers LM3S9G97-IQC80-A1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16.384 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

60

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Voltage:

1.365 V

Minimum Supply Voltage:

1.235 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S9G97-IQC80-A1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20