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LM3S9D96-IQC80-A1

Texas Instruments

LM3S9D96-IQC80-A1 by Texas Instruments

LM3S9D96-IQC80-A1 by Texas Instruments is a 32-bit microcontroller with 65 I/O lines, 16.384 MHz clock frequency, and ADC/DMA channels. Ideal for industrial applications, it operates b/w -40 to 85 °C with a supply voltage range of 3-3.6 V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,665 parts In-Stock

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5,665

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Digiode

USA . 4,374 parts In-Stock

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4,374

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Distributors (Availability)

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AZTECH Wire

Italy . 319 parts In-Stock

1+ parts

$10.364

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319

$10.364

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One Stop Electronics

USA . 1,085 parts In-Stock

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$12.000

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1,085

$12.000

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Parana Technologies

USA . 497 parts In-Stock

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$68.258

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497

$68.258

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ChromeModa Solutions

Germany . 5,337 parts In-Stock

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$76.694

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$62.889

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5,337

$76.694

$62.889

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IDEA Electronic Components Group

UK . 1,056 parts In-Stock

1+ parts

$76.694

100+ parts

$72.859

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$69.025

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1,056

$76.694

$72.859

$69.025

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Corphita

USA . 2,417 parts In-Stock

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2,417

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DigiPath Technology Company

USA . 1,615 parts In-Stock

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$69.147

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$69.147

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Microchip USA

USA . 407 parts In-Stock

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407

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Overview

Discover the cutting-edge LM3S9D96-IQC80-A1 microcontroller by Texas Instruments, renowned for its exceptional quality and reliability. As a leader in the industry, Texas Instruments ensures top-notch performance and longevity in their products. This microcontroller is perfect for a wide range of applications, offering customers unmatched value and benefits. From advanced robotics to industrial automation, this product delivers superior functionality and efficiency. Experience seamless integration and optimal performance with the LM3S9D96-IQC80-A1 microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for electronic components due to its durability and heat resistance, making the product reliable for various applications.

Surface Mount: YES

Surface mount technology allows for more efficient manufacturing processes and compact designs, making the product suitable for space-constrained applications.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage provides flexibility in power sourcing options for the product, enhancing its compatibility with different power systems.

Package Shape: SQUARE

The square package shape helps in optimal use of space on PCBs and ensures easy mounting, contributing to a simplified assembly process.

Bit Size: 32

The 32-bit architecture allows for fast and efficient processing of data, making the product suitable for high-performance applications requiring complex computations.

No. of Terminals: 100

The high number of terminals provides ample connectivity options for peripherals and external devices, enhancing the product's versatility in interfacing with other components.

ADC Channels: YES

The presence of ADC channels allows the product to accurately convert analog signals to digital data, enabling precise sensing and control capabilities in various applications.

DMA Channels: YES

DMA channels help in optimizing data transfer between memory and peripherals, enhancing the product's performance by offloading the CPU from handling data movement tasks.

Maximum Clock Frequency: 16.384 MHz

The high maximum clock frequency enables fast execution of instructions, improving the product's overall processing speed for time-critical tasks.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environmental conditions, making the product suitable for industrial automation and control applications.

Technical Specifications

Microcontrollers LM3S9D96-IQC80-A1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16.384 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

65

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S9D96-IQC80-A1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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