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LM3S9D92-IQC80-A1

Texas Instruments

LM3S9D92-IQC80-A1 by Texas Instruments

LM3S9D92-IQC80-A1 by Texas Instruments is a 32-bit microcontroller with 65 I/O lines, 16.384 MHz clock frequency, and ADC/DMA channels. Ideal for industrial applications, it operates b/w -40 to 85°C with a supply voltage range of 1.235V to 1.365V in a compact flatpack package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,453 parts In-Stock

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6,453

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Digiode

USA . 493 parts In-Stock

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493

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Distributors (Availability)

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AZTECH Wire

Italy . 896 parts In-Stock

1+ parts

$16.718

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896

$16.718

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One Stop Electronics

USA . 846 parts In-Stock

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$27.000

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846

$27.000

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Parana Technologies

USA . 2,255 parts In-Stock

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$50.699

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2,255

$50.699

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DigiPath Technology Company

USA . 1,661 parts In-Stock

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$55.826

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1,661

$55.826

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ChromeModa Solutions

Germany . 3,766 parts In-Stock

1+ parts

$56.965

100+ parts

$46.711

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3,766

$56.965

$46.711

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IDEA Electronic Components Group

UK . 553 parts In-Stock

1+ parts

$56.965

100+ parts

$54.117

1k+ parts

$51.268

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553

$56.965

$54.117

$51.268

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Corphita

USA . 3,315 parts In-Stock

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3,315

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Microchip USA

USA . 427 parts In-Stock

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427

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Overview

Experience the power of innovation with the LM3S9D92-IQC80-A1 by Texas Instruments. Crafted with precision and quality, this microcontroller offers unrivaled performance in a compact package. Whether you're looking to create cutting-edge IoT devices or develop advanced robotics, this product is the perfect choice for your next project. Trust in Texas Instruments for superior technology that delivers value, benefits, and advantages to customers around the world. Elevate your designs and bring your ideas to life with the LM3S9D92-IQC80-A1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and can protect the microcontroller from external elements, ensuring long-term reliability.

Surface Mount: YES

Surface mount technology allows for easier and more efficient installation on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 1.365 V

The higher maximum supply voltage allows for flexibility in power requirements while still being within safe operating limits.

Package Shape: SQUARE

The square shape is symmetrical and makes it easier to integrate into circuit layouts, optimizing space usage.

Bit Size: 32

A 32-bit architecture enables higher processing capabilities and performance compared to lower bit sizes.

No. of Terminals: 100

Having a high number of terminals allows for more connectivity options and functionality in the overall system design.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures the microcontroller can function reliably under harsh environmental conditions.

ADC Channels: YES

Having Analog-to-Digital Converter channels allows for direct interfacing with analog sensors, expanding the range of applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller ensures efficient and streamlined operations, maximizing performance and power efficiency.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor technology offers low power consumption and high noise immunity for reliable operation.

Technical Specifications

Microcontrollers LM3S9D92-IQC80-A1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16.384 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

65

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Voltage:

1.365 V

Minimum Supply Voltage:

1.235 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S9D92-IQC80-A1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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