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LM3S9D90-IQC80-A2T

Texas Instruments

LM3S9D90-IQC80-A2T by Texas Instruments

Texas Instruments LM3S9D90-IQC80-A2T is a 32-bit microcontroller with Cortex-M3 CPU, 524288 ROM words, and 98304 RAM bytes. It operates at up to 16.384 MHz clock frequency, suitable for industrial applications requiring high-speed processing and ADC/DMA capabilities. With a low profile package style and quad terminal position, it offers compact design flexibility for various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,686 parts In-Stock

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3,686

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Digiode

USA . 243 parts In-Stock

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243

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 642 parts In-Stock

1+ parts

$6.221

100+ parts

-

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642

$6.221

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One Stop Electronics

USA . 800 parts In-Stock

1+ parts

$27.000

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800

$27.000

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Parana Technologies

USA . 1,673 parts In-Stock

1+ parts

$76.214

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1,673

$76.214

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DigiPath Technology Company

USA . 416 parts In-Stock

1+ parts

$83.921

100+ parts

$77.208

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416

$83.921

$77.208

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ChromeModa Solutions

Germany . 1,617 parts In-Stock

1+ parts

$85.634

100+ parts

$70.220

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1,617

$85.634

$70.220

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IDEA Electronic Components Group

UK . 1,563 parts In-Stock

1+ parts

$85.634

100+ parts

$81.352

1k+ parts

$77.071

10k+ parts

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1,563

$85.634

$81.352

$77.071

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Corphita

USA . 4,236 parts In-Stock

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4,236

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Lixinc

USA . 4,203 parts In-Stock

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4,203

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Overview

Unlock the potential of your designs with the LM3S9D90-IQC80-A2T by Texas Instruments. This microcontroller offers top-notch quality and reliability, thanks to its leading manufacturer. Ideal for a wide range of applications, this product provides unmatched value and benefits to customers. With its advanced features and capabilities, including 32-bit processing power, multiple ADC and DMA channels, and flash ROM programmability, the LM3S9D90-IQC80-A2T is sure to take your projects to the next level. Experience the advantages of this powerful microcontroller and see the difference it can make in your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides excellent durability and protection for the microcontroller, making it suitable for various applications.

Bit Size: 32

With a 32-bit architecture, this microcontroller can handle complex computations and data processing efficiently.

Power Supplies (V): 1.3,3.3

With multiple power supply options, this microcontroller can operate in various voltage environments, offering flexibility in design.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows this microcontroller to be used in industrial settings where temperature extremes are common.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller, it offers efficient instruction execution and can handle multiple peripherals, enhancing overall performance.

RAM Bytes: 98304

With a large RAM capacity, this microcontroller can store and process a significant amount of data, enabling complex algorithms and applications.

Technical Specifications

Microcontrollers LM3S9D90-IQC80-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16.384 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

72

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.3,3.3

Qualification:

Not Qualified

RAM Bytes:

98304

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

210 mA

Maximum Supply Voltage:

1.365 V

Minimum Supply Voltage:

1.235 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S9D90-IQC80-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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