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LM3S9D81-IQC80-A2

Texas Instruments

LM3S9D81-IQC80-A2 by Texas Instruments

LM3S9D81-IQC80-A2 by Texas Instruments is a 32-bit microcontroller with 524288 ROM words, 98304 RAM bytes, and 65 I/O lines. It operates at a max clock frequency of 16 MHz and has PWM channels for industrial applications requiring high-speed processing and control capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,688 parts In-Stock

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Vyrian

USA . 2,275 parts In-Stock

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2,275

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Distributors (Availability)

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AZTECH Wire

Italy . 287 parts In-Stock

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$4.952

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287

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One Stop Electronics

USA . 917 parts In-Stock

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$8.000

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917

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Parana Technologies

USA . 1,215 parts In-Stock

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$56.853

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DigiPath Technology Company

USA . 1,777 parts In-Stock

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$62.602

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$57.594

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ChromeModa Solutions

Germany . 6,557 parts In-Stock

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$63.880

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$52.382

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6,557

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IDEA Electronic Components Group

UK . 1,934 parts In-Stock

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$63.880

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$60.686

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$57.492

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1,934

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$57.492

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Corphita

USA . 2,819 parts In-Stock

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Microchip USA

USA . 356 parts In-Stock

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Overview

Elevate your projects with the LM3S9D81-IQC80-A2 by Texas Instruments, a top-tier microcontroller that offers unparalleled performance and reliability. Manufactured by the renowned Texas Instruments, this device is designed to meet the highest industry standards, making it ideal for a wide range of applications. From robotics to IoT devices, this microcontroller delivers exceptional value, benefits, and advantages to customers seeking cutting-edge technology. Explore endless possibilities with the LM3S9D81-IQC80-A2 and take your innovations to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body ensures durability and resistance to damage during handling and assembly.

Surface Mount: YES

Surface mount capability makes the product suitable for modern automated assembly processes, saving time and effort in production.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this microcontroller can handle a wide range of power inputs for versatile applications.

Bit Size: 32

The 32-bit architecture enables efficient processing of data and complex algorithms, making this microcontroller suitable for demanding tasks.

Power Supplies (V): 1.3,3.3

Support for multiple power supply voltages (1.3V and 3.3V) offers flexibility in design and integration with various systems.

Package Style (Meter): FLATPACK

The flatpack package style allows for easy placement and soldering onto PCBs, simplifying assembly and reducing production costs.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance in harsh environments or under heavy workloads.

CPU Family: CORTEX-M3

Based on the ARM Cortex-M3 architecture, this microcontroller offers high performance and energy efficiency for a wide range of applications.

ADC Channels: YES

Integrated Analog-to-Digital Converter (ADC) channels allow for sensor interfacing and data acquisition, expanding the microcontroller's capabilities.

DMA Channels: YES

Direct Memory Access (DMA) channels enable efficient data transfer between peripherals and memory, improving overall system performance.

ROM Words: 524288

With a large ROM capacity of 524,288 words, the microcontroller can store program instructions and data for complex applications.

RAM Bytes: 98304

The generous amount of RAM (98,304 bytes) allows for efficient data storage and manipulation during program execution.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz provides fast processing speeds, making this microcontroller suitable for real-time applications.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture and integrated peripherals make this microcontroller a versatile solution for a wide range of embedded system designs.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption and high noise immunity for efficient operation.

Technical Specifications

Microcontrollers LM3S9D81-IQC80-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

65

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.3,3.3

Qualification:

Not Qualified

RAM Bytes:

98304

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

210 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S9D81-IQC80-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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