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LM3S9B95-IQC80-C5T

Texas Instruments

LM3S9B95-IQC80-C5T by Texas Instruments

LM3S9B95-IQC80-C5T by Texas Instruments is a 32-bit Cortex-M3 microcontroller with 262144 ROM words and 98304 RAM bytes. It operates at a max clock frequency of 16.384 MHz, making it ideal for industrial applications requiring high-speed processing and extensive memory capabilities. With features like ADC and PWM channels, this microcontroller is suitable for tasks that demand precise analog-to-digital conversion and pulse-width modulation control in a compact package style with low profile design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,139 parts In-Stock

1+ parts

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6,139

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Digiode

USA . 4,335 parts In-Stock

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4,335

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 358 parts In-Stock

1+ parts

$7.988

100+ parts

-

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358

$7.988

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One Stop Electronics

USA . 824 parts In-Stock

1+ parts

$32.000

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824

$32.000

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Parana Technologies

USA . 1,210 parts In-Stock

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$40.263

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1,210

$40.263

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DigiPath Technology Company

USA . 1,663 parts In-Stock

1+ parts

$44.334

100+ parts

$40.787

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1,663

$44.334

$40.787

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ChromeModa Solutions

Germany . 3,239 parts In-Stock

1+ parts

$45.239

100+ parts

$37.096

1k+ parts

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3,239

$45.239

$37.096

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IDEA Electronic Components Group

UK . 2,030 parts In-Stock

1+ parts

$45.239

100+ parts

$42.977

1k+ parts

$40.715

10k+ parts

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2,030

$45.239

$42.977

$40.715

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Corphita

USA . 1,116 parts In-Stock

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1,116

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Microchip USA

USA . 496 parts In-Stock

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496

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Overview

Unlock the power of innovation with the LM3S9B95-IQC80-C5T microcontroller from Texas Instruments. Designed with precision and reliability in mind, this cutting-edge device boasts a 32-bit architecture and a wide range of features to elevate your projects to new heights. Ideal for industrial applications and beyond, this microcontroller offers unparalleled performance and efficiency. Experience seamless integration, advanced functionality, and superior quality with the LM3S9B95-IQC80-C5T. Join the Texas Instruments revolution today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and corrosion resistance, ensuring a longer lifespan for the product.

Surface Mount: YES

Surface mount technology makes the product more convenient to install and allows for a smaller overall footprint on PCBs.

Maximum Supply Voltage: 1.365 V

The maximum supply voltage of 1.365 V allows for efficient power consumption and operation within safe voltage limits.

Package Shape: SQUARE

Square package shape can be more space-saving and easier to handle during assembly compared to other shapes.

Bit Size: 32

32-bit architecture provides enhanced processing power and capabilities for the microcontroller.

Power Supplies (V): 1.2,3.3

Support for multiple power supply voltages allows for flexibility in design and compatibility with different systems.

No. of Terminals: 100

Having 100 terminals provides ample connectivity options for various components and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

These package styles offer versatility in mounting options and can accommodate different PCB layouts.

Minimum Supply Voltage: 1.235 V

An efficient minimum supply voltage of 1.235 V ensures reliable operation even at lower power levels.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this microcontroller can withstand high-temperature environments.

CPU Family: CORTEX-M3

The CORTEX-M3 architecture provides high performance and energy efficiency, making it suitable for a wide range of applications.

Minimum Operating Temperature: -40 °C

The microcontroller can operate in extreme cold conditions down to -40°C, expanding its usability in various environments.

ADC Channels: YES

Integrated ADC channels allow for analog signal processing, making the microcontroller suitable for sensor interfacing and data acquisition.

DMA Channels: YES

DMA channels enable efficient data transfer and processing, improving overall system performance.

Terminal Position: QUAD

Quad terminal position provides stable and secure connections for reliable operation in demanding applications.

ROM Words: 262144

With a large ROM size of 262144 words, the microcontroller can store a significant amount of program data for complex applications.

Maximum Seated Height: 1.6 mm

Low seated height of 1.6 mm enables compact designs and reduces overall system size.

Width: 14 mm

A width of 14 mm allows for easy integration into PCB layouts and ensures compatibility with standard board sizes.

Maximum Clock Frequency: 16.384 MHz

High maximum clock frequency of 16.384 MHz provides fast processing speed for efficient operation.

Maximum Time At Peak Reflow Temperature (s): 30

The microcontroller can withstand peak reflow temperatures for up to 30 seconds, ensuring reliable solder joints during assembly.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C ensures proper soldering and robust connections for stable performance.

Length: 14 mm

A length of 14 mm offers a compact form factor for space-constrained applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh environments with temperature fluctuations and variations.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture in the microcontroller delivers high performance and efficiency for a wide range of embedded applications.

RAM Bytes: 98304

Large RAM capacity of 98304 bytes enables efficient data storage and processing for complex algorithms and calculations.

Technology: CMOS

CMOS technology ensures low power consumption, high noise immunity, and reliable operation in various voltage conditions.

Terminal Form: GULL WING

Gull wing terminal form provides secure and reliable solder connections for stable performance in demanding environments.

Nominal Supply Voltage: 1.3 V

A nominal supply voltage of 1.3 V ensures stable and efficient power delivery to the microcontroller for reliable operation.

PWM Channels: YES

Integrated PWM channels enable precise control of motor speed, LED brightness, and other applications requiring pulse-width modulation.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and modifications to the microcontroller firmware without requiring external programming tools.

Terminal Pitch: 0.5 mm

Small terminal pitch of 0.5 mm provides high-density interconnects and enhances PCB layout flexibility for compact designs.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the microcontroller is suitable for reflow soldering and has moderate moisture sensitivity, ensuring proper handling during assembly.

Speed: 80 rpm

With a speed rating of 80 rpm, the microcontroller can process instructions and data quickly, improving overall system performance.

No. of I/O Lines: 65

Having 65 I/O lines provides ample connectivity options for interfacing with external devices and peripherals, making the microcontroller versatile in various applications.

Technical Specifications

Microcontrollers LM3S9B95-IQC80-C5T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16.384 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

65

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

98304

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.365 V

Minimum Supply Voltage:

1.235 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S9B95-IQC80-C5T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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