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LM3S9B95-IBZ80-C1T

Texas Instruments

LM3S9B95-IBZ80-C1T by Texas Instruments

LM3S9B95-IBZ80-C1T by Texas Instruments is a 32-bit microcontroller with 262144 ROM words and 98304 RAM bytes. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring high-speed processing and control. With features like ADC and DMA channels, it offers versatile functionality in a compact package ideal for grid array mounting.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,460 parts In-Stock

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3,460

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Digiode

USA . 617 parts In-Stock

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617

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Distributors (Availability)

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AZTECH Wire

Italy . 373 parts In-Stock

1+ parts

$6.165

100+ parts

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373

$6.165

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Parana Technologies

USA . 1,988 parts In-Stock

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$24.700

100+ parts

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$25.364

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1,988

$24.700

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$25.364

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DigiPath Technology Company

USA . 604 parts In-Stock

1+ parts

$27.198

100+ parts

$25.022

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604

$27.198

$25.022

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ChromeModa Solutions

Germany . 2,970 parts In-Stock

1+ parts

$27.753

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$22.757

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2,970

$27.753

$22.757

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IDEA Electronic Components Group

UK . 1,191 parts In-Stock

1+ parts

$27.753

100+ parts

$26.365

1k+ parts

$24.978

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1,191

$27.753

$26.365

$24.978

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One Stop Electronics

USA . 921 parts In-Stock

1+ parts

$29.000

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921

$29.000

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Corphita

USA . 1,393 parts In-Stock

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1,393

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Microchip USA

USA . 402 parts In-Stock

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402

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Overview

Unlock the power of cutting-edge technology with the LM3S9B95-IBZ80-C1T by Texas Instruments. This high-quality microcontroller offers unmatched performance and reliability, making it the perfect choice for a wide range of applications. From industrial automation to consumer electronics, this versatile device delivers exceptional value and benefits to customers looking for seamless integration and superior functionality. Trust Texas Instruments to provide the innovative solutions you need to bring your projects to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Surface mount technology allows for easy installation on circuit boards, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 3.6 V

The higher maximum supply voltage allows for flexibility in power supply options, accommodating a wider range of applications.

Package Shape: SQUARE

The square shape of the package makes it easier to align and solder onto the circuit board, improving manufacturing efficiency.

Bit Size: 32

A 32-bit microcontroller offers higher processing power, making it suitable for complex tasks and applications.

Power Supplies (V): 1.2,3.3

Having multiple power supply options allows for compatibility with various systems, ensuring versatility in use.

No. of Terminals: 108

Having a large number of terminals provides flexibility for connecting external components, expanding the capabilities of the microcontroller.

Package Style (Meter): GRID ARRAY

The grid array package style offers better thermal performance and electrical connectivity, enhancing the overall reliability of the microcontroller.

Minimum Supply Voltage: 3 V

The low minimum supply voltage helps in reducing power consumption and extending battery life in portable devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the microcontroller can withstand harsh environmental conditions without compromising performance.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures reliable operation even in extreme cold conditions, making it suitable for various applications.

ADC Channels: YES

Analog-to-digital converter channels allow for interfacing with analog sensors and signals, expanding the range of applications the microcontroller can be used for.

DMA Channels: YES

Direct Memory Access channels enable efficient data transfer without CPU intervention, improving performance in data-intensive applications.

Terminal Position: BOTTOM

Bottom terminal position makes it easier to solder and mount the microcontroller on the circuit board, simplifying the manufacturing process.

ROM Words: 262144

A large ROM size provides ample storage for program instructions and data, allowing for more complex programs to be executed.

Maximum Seated Height: 1.5 mm

The low seated height ensures compatibility with slim and compact devices, making it ideal for space-constrained applications.

Width: 10 mm

The compact width of the microcontroller saves space on the circuit board, enabling more components to be integrated into the design.

Maximum Clock Frequency: 16 MHz

A high clock frequency allows for fast execution of instructions, improving overall performance and response time of the microcontroller.

Length: 10 mm

The small length of the microcontroller helps in conserving space on the circuit board, especially in compact electronic devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh industrial environments, making it suitable for industrial applications.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, it integrates various peripherals and processing capabilities in a single chip, simplifying system design and reducing component count.

RAM Bytes: 98304

A large RAM size allows for efficient data processing and storage, enabling the microcontroller to handle complex algorithms and multitasking applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making the microcontroller energy-efficient and reliable.

Terminal Form: BALL

The ball terminal form provides high reliability and good electrical connections, ensuring stable performance in diverse operating conditions.

Nominal Supply Voltage: 3.3 V

Having a single nominal supply voltage simplifies the power supply design and ensures consistent performance across different operating conditions.

PWM Channels: YES

Pulse-width modulation channels allow for precise control of the output signal, making the microcontroller suitable for applications like motor control and power management.

ROM Programmability: FLASH

Flash ROM programmability enables easy updating and reprogramming of the firmware, providing flexibility and scalability in product development.

Terminal Pitch: 0.8 mm

Having a small terminal pitch facilitates dense packaging on the circuit board, allowing for space-saving design and efficient PCB layout.

Speed: 80 rpm

The high speed capability of the microcontroller enables fast computation and response time, improving overall system performance in real-time applications.

No. of I/O Lines: 65

A large number of input/output lines offer versatility in connecting external devices and peripherals, expanding the functionality of the microcontroller.

Technical Specifications

Microcontrollers LM3S9B95-IBZ80-C1T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

Length:

10 mm

No. of I/O Lines:

65

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

98304

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S9B95-IBZ80-C1T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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