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LM3S9B90-IQC80-C5

Texas Instruments

LM3S9B90-IQC80-C5 by Texas Instruments

LM3S9B90-IQC80-C5 by Texas Instruments is a 32-bit microcontroller with Cortex-M3 CPU, 262144 ROM words, and 98304 RAM bytes. It operates at a max clock frequency of 0.032 MHz and has 60 I/O lines for industrial applications requiring high-speed processing and efficient data handling.

Median Price

$67.830

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Ozdisan Elektronik

Türkiye . 34 parts In-Stock

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$40.410

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Vyrian

USA . 8,726 parts In-Stock

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Digiode

USA . 2,132 parts In-Stock

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NAC Semi

USA . 27 parts In-Stock

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$95.250

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Inventory MP

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Bristol Electronics

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AZTECH Wire

Italy . 455 parts In-Stock

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$8.663

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One Stop Electronics

USA . 383 parts In-Stock

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$12.000

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Parana Technologies

USA . 53 parts In-Stock

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$38.485

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DigiPath Technology Company

USA . 1,510 parts In-Stock

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$42.377

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$38.987

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$42.377

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ChromeModa Solutions

Germany . 4,637 parts In-Stock

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$43.242

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$35.458

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IDEA Electronic Components Group

UK . 178 parts In-Stock

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$43.242

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$41.080

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$38.918

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$38.918

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QUARKTWIN TECHNOLOGY LTD

USA . 28,273 parts In-Stock

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Microchip USA

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Corphita

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A-Z Elektronik GmbH

Germany . 3,539 parts In-Stock

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Perfect Parts

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Lixinc

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Metaverse IC Inc.

Canada . 452 parts In-Stock

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Kepictronics

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GreenTree Electronics

Israel . 34 parts In-Stock

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Authorized Procurement Solutions

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Overview

Unlock the potential of your next project with the LM3S9B90-IQC80-C5 microcontroller from Texas Instruments. Known for their top-quality products, Texas Instruments delivers a reliable and efficient solution for a wide range of applications. Whether you're working on IoT devices, industrial automation, or consumer electronics, this 32-bit microcontroller offers unmatched performance and versatility. With advanced features like ADC and DMA channels, along with a wide range of power supplies, this device provides the flexibility you need to bring your ideas to life. Trust Texas Instruments to provide the innovation and quality you require for success.

Feature Benefit Bullets

Package Body Material PLASTIC/EPOXY

PLASTIC/EPOXY material provides good durability and resistance to external elements, making the product suitable for a wide range of applications.

Surface Mount YES

Surface mount capability allows for easy and compact installation on circuit boards, saving space and simplifying assembly processes.

Maximum Supply Voltage 1.32 V

With a maximum supply voltage of 1.32 V, the product offers efficient power management and low energy consumption.

Package Shape SQUARE

The square package shape ensures a uniform and compact design, aiding in consistent placement within electronic devices.

Bit Size 32

A 32-bit architecture provides high processing power and performance capabilities for handling complex tasks effectively.

Power Supplies (V) 1.2,3.3

Support for multiple power supplies (1.2V and 3.3V) offers versatility in voltage requirements, enabling compatibility with various power sources.

No. of Terminals 100

Having 100 terminals allows for diverse I/O connections, facilitating communication with peripheral devices and enabling versatile functionality.

Package Style (Meter) FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package styles enhance space efficiency, ease of PCB layout, and compatibility with modern assembly techniques.

Minimum Supply Voltage 1.08 V

With a minimum supply voltage of 1.08V, the product ensures stable operation even at low power levels, enhancing energy efficiency.

Maximum Operating Temperature 85 °C

The product's high maximum operating temperature of 85°C enables reliable performance under demanding thermal conditions.

CPU Family CORTEX-M3

Belonging to the Cortex-M3 CPU family indicates efficient processing capabilities, high performance, and compatibility with various software applications.

Minimum Operating Temperature -40 °C

The product's low minimum operating temperature of -40°C allows for reliable operation in cold environments without compromising performance.

ADC Channels YES

Integrated ADC channels enable analog-to-digital conversion, facilitating sensor data acquisition and signal processing for a wide range of applications.

DMA Channels YES

Having DMA channels improves data transfer efficiency, reduces CPU load, and enhances overall system performance by offloading data movement tasks.

Terminal Position QUAD

Quad terminal position ensures secure connectivity, ease of soldering, and efficient signal transmission, enhancing product reliability and durability.

ROM Words 262144

With 262144 ROM words, the product offers ample storage capacity for program code, firmware updates, and data storage, enabling versatile application development.

Maximum Seated Height 1.6 mm

The low maximum seated height of 1.6mm ensures compatibility with slim designs and compact spaces, enhancing the product's versatility for various form factors.

Width 14 mm

A width of 14mm provides a compact footprint, allowing for efficient placement on the circuit board and minimizing space requirements in electronic devices.

Maximum Clock Frequency 0.032 MHz

The high maximum clock frequency of 0.032 MHz enables fast and efficient data processing, supporting real-time applications and high-speed computations.

Maximum Time At Peak Reflow Temperature (s) 30

A maximum time of 30 seconds at peak reflow temperature ensures proper soldering and assembly, enhancing product reliability and manufacturing efficiency.

Peak Reflow Temperature °C 260

The peak reflow temperature of 260°C ensures proper soldering and assembly during manufacturing processes, leading to durable and reliable product performance.

Length 14 mm

A length of 14mm contributes to the overall compact design of the product, enabling efficient placement on the circuit board and optimizing space utilization in electronic devices.

Temperature Grade INDUSTRIAL

Designed for industrial environments, the product's industrial temperature grade ensures reliable operation under harsh conditions, making it suitable for rugged applications.

Peripheral IC Type MICROCONTROLLER, RISC

Being a microcontroller with RISC architecture indicates efficient processing, reduced power consumption, and compatibility with various embedded applications, making it a versatile choice.

RAM Bytes 98304

With 98304 RAM bytes, the product offers sufficient memory for data storage, buffer allocation, and efficient program execution, supporting diverse application requirements.

Technology CMOS

Utilizing CMOS technology provides low power consumption, high noise immunity, and reliable operation, making the product energy-efficient and reliable for long-term use.

Terminal Form GULL WING

Gull wing terminal form ensures secure soldering, mechanical stability, and efficient signal transmission, enhancing product durability, reliability, and ease of assembly.

Nominal Supply Voltage 1.2 V

A nominal supply voltage of 1.2V provides stable power delivery, low energy consumption, and compatibility with common power sources, ensuring reliable operation in various settings.

PWM Channels YES

Integrated PWM channels allow for precise control of power outputs, motor speed modulation, and LED brightness adjustment, enhancing the product's versatility for diverse applications.

ROM Programmability FLASH

Flash programmability for ROM enables easy firmware updates, code modifications, and data storage, simplifying development cycles and enhancing product flexibility.

Terminal Pitch 0.5 mm

With a terminal pitch of 0.5mm, the product offers fine-pitch connectivity, enabling compact design layouts, efficient signal routing, and high-density integration on the PCB.

Moisture Sensitivity Level (MSL) 3

A moisture sensitivity level of 3 indicates moderate sensitivity to moisture exposure during storage and assembly processes, requiring proper handling and storage precautions.

Speed 80 rpm

With a speed of 80 revolutions per minute, the product is suited for applications requiring precise speed control, motor operation, or timing functions, offering versatility in usage.

No. of I/O Lines 60

Having 60 I/O lines allows for versatile input-output configurations, connectivity to external devices, and flexibility in interfacing with various components, enhancing the product's functionality.

Technical Specifications

Microcontrollers LM3S9B90-IQC80-C5 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

60

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

98304

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S9B90-IQC80-C5 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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