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LM3S9B90-IQC80-C3

Texas Instruments

LM3S9B90-IQC80-C3 by Texas Instruments

LM3S9B90-IQC80-C3 by Texas Instruments is a 32-bit microcontroller with 262144 ROM words and 98304 RAM bytes. It operates at a max clock frequency of 0.032 MHz, suitable for industrial applications requiring ADC and DMA channels, as well as PWM functionality. The microcontroller has a wide temperature range from -40 to 85 °C and features a compact flatpack package style with gull wing terminal form.

Median Price

$128.488

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ozdisan Elektronik

Türkiye . 118 parts In-Stock

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$72.316

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$72.316

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Vyrian

USA . 5,713 parts In-Stock

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Digiode

USA . 2,987 parts In-Stock

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2,987

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Chip Stock

USA . 2,577 parts In-Stock

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2,577

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Cyclops Electronics Ltd

UK . 910 parts In-Stock

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NAC Semi

USA . 118 parts In-Stock

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$184.660

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$170.450

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118

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$184.660

$170.450

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Distributors (Availability)

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AZTECH Wire

Italy . 583 parts In-Stock

1+ parts

$8.340

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583

$8.340

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One Stop Electronics

USA . 332 parts In-Stock

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$27.000

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332

$27.000

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Parana Technologies

USA . 17 parts In-Stock

1+ parts

$57.972

100+ parts

$5,383.573

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$52.175

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17

$57.972

$5,383.573

$52.175

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DigiPath Technology Company

USA . 534 parts In-Stock

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$63.834

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534

$63.834

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ChromeModa Solutions

Germany . 1,858 parts In-Stock

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$65.137

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$53.412

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$65.137

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IDEA Electronic Components Group

UK . 913 parts In-Stock

1+ parts

$65.137

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$61.880

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$58.623

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913

$65.137

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$58.623

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Lixinc

USA . 18,271 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 4,900 parts In-Stock

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Corphita

USA . 3,319 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,500 parts In-Stock

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Metaverse IC Inc.

Canada . 1,100 parts In-Stock

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Kepictronics

USA . 354 parts In-Stock

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354

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Microchip USA

USA . 278 parts In-Stock

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278

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Perfect Parts

USA . 264 parts In-Stock

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264

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GreenTree Electronics

Israel . 118 parts In-Stock

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Overview

Unleash the power of innovation with the LM3S9B90-IQC80-C3 microcontroller from Texas Instruments. Designed with cutting-edge technology and precision engineering, this device offers unmatched performance and reliability for a wide range of applications. Whether you're a seasoned professional or a hobbyist looking to take your projects to the next level, this microcontroller delivers exceptional value with its advanced features and seamless integration. Experience the difference that Texas Instruments brings to the table and revolutionize your designs with the LM3S9B90-IQC80-C3.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring it can withstand various environmental conditions.

Surface Mount: YES

Allows for easy and convenient mounting on circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 1.32 V

Suitable for low power applications and helps in reducing power consumption.

Package Shape: SQUARE

Facilitates efficient placement on PCBs and enables a compact design.

Bit Size: 32

Provides high processing power and supports complex algorithms and calculations.

Power Supplies (V): 1.2,3.3

Offers flexibility in power requirements and compatibility with different voltage sources.

No. of Terminals: 100

Sufficient number of terminals for connecting peripherals and external components.

Package Style (Meter): FLATPACK

Enhances thermal performance and provides a low-profile design for space-constrained applications.

Minimum Supply Voltage: 1.08 V

Allows for operation at lower voltages, increasing energy efficiency.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Capable of functioning in extremely cold conditions, making it versatile in various operating environments.

ADC Channels: YES

Ability to perform analog-to-digital conversion, essential for interfacing with external analog sensors.

DMA Channels: YES

Supports Direct Memory Access for efficient data transfer, improving overall system performance.

Terminal Position: QUAD

Quad terminal position allows for easy connection and reduces chances of errors during installation.

ROM Words: 262144

Large ROM capacity for storing program code and data, suitable for complex applications.

Maximum Seated Height: 1.6 mm

Low profile design for compact PCB layouts and space-saving designs.

Width: 14 mm

Compact width for efficient board space utilization and integration into small form factor devices.

Maximum Clock Frequency: 0.032 MHz

High clock frequency for fast processing and execution of instructions.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures that the microcontroller can withstand soldering processes without damage.

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures during assembly processes, ensuring reliability.

Length: 14 mm

Compact length for space-efficient designs and applications with size constraints.

Temperature Grade: INDUSTRIAL

Designed to operate in industrial temperature ranges, suitable for harsh environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes RISC architecture for efficient processing and control of peripherals, enhancing overall performance.

RAM Bytes: 98304

Large RAM capacity for data storage and manipulation, suitable for multitasking applications.

Technology: CMOS

CMOS technology for low power consumption and high-speed operation.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and ease of soldering during assembly.

Nominal Supply Voltage: 1.2 V

Stable supply voltage for reliable operation and energy efficiency.

PWM Channels: YES

Supports Pulse Width Modulation for precise control of connected devices.

ROM Programmability: FLASH

Flash ROM allows for easy reprogramming and updating of firmware, enhancing flexibility.

Terminal Pitch: 0.5 mm

Fine pitch terminals for compact placement on PCBs and high-density designs.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates resilience to moisture during storage and assembly processes.

Speed: 80 rpm

Operates at a speed of 80 rotations per minute, suitable for applications requiring precise timing.

No. of I/O Lines: 60

Sufficient I/O lines for interfacing with external devices and peripherals, enabling versatile applications.

Technical Specifications

Microcontrollers LM3S9B90-IQC80-C3 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

60

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

98304

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S9B90-IQC80-C3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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