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LM3S9B90-IBZ80-C5

Texas Instruments

LM3S9B90-IBZ80-C5 by Texas Instruments

LM3S9B90-IBZ80-C5 by Texas Instruments is a 32-bit microcontroller with Cortex-M3 CPU family. It features 108 terminals, 262144 ROM words, and 98304 RAM bytes. Ideal for industrial applications requiring high-speed processing, it operates b/w -40 to 85 °C with a max clock frequency of 0.032 MHz.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,867 parts In-Stock

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4,867

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Digiode

USA . 3,414 parts In-Stock

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3,414

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Distributors (Availability)

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AZTECH Wire

Italy . 376 parts In-Stock

1+ parts

$14.075

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376

$14.075

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One Stop Electronics

USA . 334 parts In-Stock

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$30.000

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334

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Parana Technologies

USA . 1,359 parts In-Stock

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$36.245

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$36.245

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ChromeModa Solutions

Germany . 3,192 parts In-Stock

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$40.725

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$33.394

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3,192

$40.725

$33.394

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IDEA Electronic Components Group

UK . 643 parts In-Stock

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$40.725

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$38.689

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$36.652

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643

$40.725

$38.689

$36.652

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Corphita

USA . 1,885 parts In-Stock

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DigiPath Technology Company

USA . 1,476 parts In-Stock

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$36.718

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Microchip USA

USA . 413 parts In-Stock

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Overview

Unlock the power of innovation with the LM3S9B90-IBZ80-C5 microcontroller from Texas Instruments. Designed with quality and precision, this device offers unmatched performance and reliability for a wide range of applications. Whether you're working on robotics, industrial automation, or IoT projects, this microcontroller delivers exceptional value, efficiency, and flexibility to meet your specific needs. Trust in Texas Instruments to provide cutting-edge technology that pushes boundaries and drives success in your projects. Experience the difference with the LM3S9B90-IBZ80-C5 microcontroller today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller suitable for various applications without adding unnecessary weight.

Surface Mount: YES

Allows for easy and efficient assembly onto PCBs, saving time and costs in production.

Maximum Supply Voltage: 1.32 V

Provides a safe operating range for the microcontroller, ensuring protection from overvoltage conditions.

Package Shape: SQUARE

Square shape allows for efficient use of board space and easy placement on PCB layouts.

Bit Size: 32

Offers high processing capabilities and precision for complex tasks and calculations.

Power Supplies (V): 1.2,3.3

Supports multiple voltage options, allowing for flexibility in power configurations.

No. of Terminals: 108

Provides ample connection points for interfacing with external components and peripherals.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Enables a compact design with high terminal density, suitable for compact electronic devices.

Minimum Supply Voltage: 1.08 V

Allows for operation at low voltages, which can be beneficial for power-efficient applications.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, making it ideal for industrial and harsh environments.

CPU Family: CORTEX-M3

Utilizes a powerful and efficient processor architecture for high-performance computing tasks.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold conditions, suitable for applications in frigid environments.

Terminal Finish: TIN SILVER COPPER

Provides good conductivity and corrosion resistance for reliable connections over time.

ADC Channels: YES

Includes analog-to-digital converters for accurate conversion of analog signals, essential for sensor interfacing.

DMA Channels: YES

Supports direct memory access for efficient data transfer between peripherals and memory, improving overall system performance.

Terminal Position: BOTTOM

Bottom terminal placement allows for easy PCB routing and integration into compact designs.

ROM Words: 262144

Offers ample non-volatile memory storage for program code and data, enabling complex applications to run smoothly.

Maximum Seated Height: 1.5 mm

Low profile design helps in slim and compact device designs, ideal for space-constrained applications.

Width: 10 mm

Compact width allows for efficient placement on PCB layouts and saves board space.

Maximum Clock Frequency: 0.032 MHz

High clock frequency enables fast processing speeds, essential for real-time applications and complex computations.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering during assembly processes, leading to reliable connections and long-term performance.

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures during soldering, ensuring proper component integration on PCBs.

Length: 10 mm

Compact length contributes to overall space-saving design for electronic devices.

Temperature Grade: INDUSTRIAL

Designed to withstand industrial operating conditions, ensuring reliable performance in demanding environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a reduced instruction set computing architecture for efficient data processing and control in embedded systems.

RAM Bytes: 98304

Provides ample random access memory for temporary data storage and processing, essential for multitasking applications.

Technology: CMOS

Utilizes complementary metal-oxide-semiconductor technology for low power consumption and high noise immunity.

Terminal Form: BALL

Ball terminal form allows for reliable connections and easy soldering during assembly processes.

Nominal Supply Voltage: 1.2 V

Stable nominal supply voltage ensures consistent performance and power efficiency in operation.

PWM Channels: YES

Includes pulse-width modulation channels for precise control of digital signals, suitable for motor control and LED dimming applications.

ROM Programmability: FLASH

Flash programmable ROM allows for easy and flexible code updates and modifications without requiring external programming tools.

Terminal Pitch: 0.8 mm

Fine terminal pitch enables high-density packaging and efficient use of board space, ideal for compact devices.

Moisture Sensitivity Level (MSL): 3

Designed to withstand moderate exposure to moisture during storage and assembly processes, ensuring long-term reliability.

Speed: 80 rpm

Operates at a moderate speed suitable for a wide range of applications, from motor control to data processing.

No. of I/O Lines: 60

Provides a sufficient number of input/output lines for interfacing with external devices, sensors, and peripherals.

Technical Specifications

Microcontrollers LM3S9B90-IBZ80-C5 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

60

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

98304

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S9B90-IBZ80-C5 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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