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LM3S9B81-IQC80-C5

Texas Instruments

LM3S9B81-IQC80-C5 by Texas Instruments

LM3S9B81-IQC80-C5 by Texas Instruments is a 32-bit microcontroller with 262144 ROM words and 98304 RAM bytes. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring high-speed processing and multiple ADC/DMA channels. With a compact square package style and low seated height of 1.6 mm, it is ideal for space-constrained designs in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,349 parts In-Stock

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5,349

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Digiode

USA . 1,556 parts In-Stock

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1,556

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Distributors (Availability)

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AZTECH Wire

Italy . 558 parts In-Stock

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$19.242

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558

$19.242

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Parana Technologies

USA . 2,147 parts In-Stock

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$25.909

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$26.507

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2,147

$25.909

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$26.507

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DigiPath Technology Company

USA . 189 parts In-Stock

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$28.529

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189

$28.529

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ChromeModa Solutions

Germany . 4,146 parts In-Stock

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$29.111

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$23.871

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4,146

$29.111

$23.871

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IDEA Electronic Components Group

UK . 197 parts In-Stock

1+ parts

$29.111

100+ parts

$27.655

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$26.200

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197

$29.111

$27.655

$26.200

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One Stop Electronics

USA . 256 parts In-Stock

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$31.000

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256

$31.000

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Corphita

USA . 4,044 parts In-Stock

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4,044

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Kepictronics

USA . 1,000 parts In-Stock

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Microchip USA

USA . 494 parts In-Stock

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494

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Overview

Unlock endless possibilities with the Texas Instruments LM3S9B81-IQC80-C5 microcontroller. Crafted with precision and expertise, this powerful device is designed to elevate your projects to new heights. From automation to IoT applications, this versatile microcontroller offers unparalleled performance and reliability. Embrace innovation and streamline your designs with the LM3S9B81-IQC80-C5, where quality meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body provides durability and protection for the microcontroller, making it suitable for various environments.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for versatile usage in different applications without risk of damaging the microcontroller.

Bit Size: 32

With a 32-bit architecture, this microcontroller offers high computational power and efficiency for complex tasks and processing.

Maximum Operating Temperature: 85 °C

The wide maximum operating temperature range makes this microcontroller suitable for industrial applications where temperature fluctuations may occur.

ADC Channels: YES

The presence of ADC channels allows the microcontroller to interface with analog sensors, enabling it to gather and process real-world data.

ROM Words: 262144

The large ROM capacity of 262144 words provides ample space for program storage, allowing for the implementation of complex algorithms and functionalities.

RAM Bytes: 98304

A generous RAM size of 98304 bytes enables efficient data storage and manipulation during program execution, enhancing the microcontroller's performance.

PWM Channels: YES

The availability of PWM channels allows for precise control of analog outputs, making the microcontroller suitable for applications such as motor control and LED dimming.

Technical Specifications

Microcontrollers LM3S9B81-IQC80-C5 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

65

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

98304

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S9B81-IQC80-C5 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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