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LM3S9997-IQC80-C5T

Texas Instruments

LM3S9997-IQC80-C5T by Texas Instruments

Texas Instruments' LM3S9997-IQC80-C5T is a 32-bit microcontroller with 262144 ROM words and 65536 RAM bytes. Operating at up to 16 MHz, it features 60 I/O lines, ADC and DMA channels for industrial applications. With a package style of FLATPACK, it has a max supply voltage of 3.6 V and operates b/w -40°C to 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,475 parts In-Stock

1+ parts

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8,475

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Digiode

USA . 3,464 parts In-Stock

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3,464

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ComSIT Distribution GmbH

Germany . 606 parts In-Stock

1+ parts

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606

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 825 parts In-Stock

1+ parts

$18.668

100+ parts

-

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825

$18.668

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One Stop Electronics

USA . 1,100 parts In-Stock

1+ parts

$20.000

100+ parts

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1,100

$20.000

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Parana Technologies

USA . 440 parts In-Stock

1+ parts

$57.912

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440

$57.912

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DigiPath Technology Company

USA . 1,698 parts In-Stock

1+ parts

$63.769

100+ parts

$58.667

1k+ parts

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1,698

$63.769

$58.667

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ChromeModa Solutions

Germany . 4,267 parts In-Stock

1+ parts

$65.070

100+ parts

$53.357

1k+ parts

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4,267

$65.070

$53.357

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IDEA Electronic Components Group

UK . 219 parts In-Stock

1+ parts

$65.070

100+ parts

$61.816

1k+ parts

$58.563

10k+ parts

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219

$65.070

$61.816

$58.563

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Corphita

USA . 2,507 parts In-Stock

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2,507

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Microchip USA

USA . 324 parts In-Stock

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324

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Overview

Unlock unparalleled performance and reliability with the Texas Instruments LM3S9997-IQC80-C5T microcontroller. Crafted by a trusted industry leader, this cutting-edge device offers seamless integration, exceptional power efficiency, and unmatched versatility. Ideal for a wide range of applications, this microcontroller boasts advanced features like ADC and DMA channels, PWM functionality, and extensive ROM and RAM capacity. Elevate your projects to new heights with the LM3S9997-IQC80-C5T and experience innovation at its finest.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, making it suitable for various environments.

Surface Mount: YES

Surface mount technology allows for easy and convenient assembly on circuit boards.

Maximum Supply Voltage: 3.6 V

Offers a higher maximum supply voltage which can handle a wider range of power input.

Bit Size: 32

Larger bit size enables faster processing and handling of data.

Power Supplies (V): 1.2,3.3

Supports multiple power supply options allowing flexibility in different applications.

No. of Terminals: 100

Having a higher number of terminals allows for more connectivity options and functionality.

Package Style (Meter): FLATPACK

The flatpack style provides a compact and flat form factor for space-saving designs.

Minimum Operating Temperature: -40 °C

Operates reliably in low-temperature environments, making it suitable for a wide range of applications.

RAM Bytes: 65536

Large RAM capacity enables the storage and processing of a significant amount of data.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers efficient and fast processing capabilities for embedded applications.

Technical Specifications

Microcontrollers LM3S9997-IQC80-C5T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

60

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S9997-IQC80-C5T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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