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LM3S9997-IQC80-C3T

Texas Instruments

LM3S9997-IQC80-C3T by Texas Instruments

LM3S9997-IQC80-C3T by Texas Instruments is a 32-bit microcontroller with 262144 ROM words and 65536 RAM bytes. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring high-speed processing and multiple ADC/DMA channels. With a compact flatpack package style and low seated height of 1.6 mm, it offers efficient integration in space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,908 parts In-Stock

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2,908

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Digiode

USA . 2,210 parts In-Stock

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2,210

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Distributors (Availability)

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AZTECH Wire

Italy . 303 parts In-Stock

1+ parts

$5.645

100+ parts

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303

$5.645

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One Stop Electronics

USA . 1,160 parts In-Stock

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$10.000

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$10.000

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Parana Technologies

USA . 1,497 parts In-Stock

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$58.501

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$58.501

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ChromeModa Solutions

Germany . 3,589 parts In-Stock

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$65.732

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$53.900

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3,589

$65.732

$53.900

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IDEA Electronic Components Group

UK . 908 parts In-Stock

1+ parts

$65.732

100+ parts

$62.445

1k+ parts

$59.159

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908

$65.732

$62.445

$59.159

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QUARKTWIN TECHNOLOGY LTD

USA . 20,565 parts In-Stock

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20,565

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DigiPath Technology Company

USA . 1,723 parts In-Stock

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$59.264

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$59.264

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Corphita

USA . 805 parts In-Stock

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Microchip USA

USA . 235 parts In-Stock

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Overview

Unlock the power of innovation with the LM3S9997-IQC80-C3T by Texas Instruments. This top-of-the-line microcontroller offers unrivaled quality and reliability that only a trusted manufacturer like Texas Instruments can provide. Ideal for a wide range of applications, this versatile device boasts cutting-edge technology and seamless performance. Experience the value, benefits, and advantages that this product brings to your projects, from increased efficiency to enhanced functionality. Upgrade your designs with the LM3S9997-IQC80-C3T and take your creations to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, making it suitable for a wide range of environments.

Surface Mount: YES

Allows for easy and secure attachment to circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

Can handle higher voltage inputs, providing flexibility in power supply options.

Bit Size: 32

Offers high computational capability for handling complex tasks efficiently.

Power Supplies (V): 1.2,3.3

Supports multiple voltage options, enabling compatibility with a variety of power sources.

No. of Terminals: 100

Provides a sufficient number of connection points for interfacing with other components in a system.

ADC Channels: YES

Allows for analog-to-digital conversion, essential for interfacing with sensors and other analog devices.

ROM Words: 262144

Offers ample memory capacity for storing program instructions and data.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments, ensuring reliable operation in tough conditions.

RAM Bytes: 65536

Provides sufficient random access memory for storing and accessing data during program execution.

Speed: 80 rpm

Indicates the processing speed of the microcontroller, suitable for applications requiring real-time data processing.

Technical Specifications

Microcontrollers LM3S9997-IQC80-C3T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

60

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S9997-IQC80-C3T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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