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LM3S9997-IQC80-C3

Texas Instruments

LM3S9997-IQC80-C3 by Texas Instruments

Texas Instruments' LM3S9997-IQC80-C3 microcontroller features 32-bit architecture, 262144 ROM words, and 65536 RAM bytes. Ideal for industrial applications with a max clock frequency of 16 MHz, it offers ADC and DMA channels along with PWM support.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,802 parts In-Stock

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Digiode

USA . 4,305 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 301 parts In-Stock

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$5.191

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301

$5.191

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One Stop Electronics

USA . 1,021 parts In-Stock

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$30.000

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Parana Technologies

USA . 1,682 parts In-Stock

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$55.741

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$55.741

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DigiPath Technology Company

USA . 2,170 parts In-Stock

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$61.377

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$56.467

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$61.377

$56.467

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ChromeModa Solutions

Germany . 2,664 parts In-Stock

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$62.630

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$51.357

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$62.630

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IDEA Electronic Components Group

UK . 616 parts In-Stock

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$62.630

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$59.498

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$56.367

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$62.630

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$56.367

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Corphita

USA . 2,133 parts In-Stock

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Microchip USA

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Kepictronics

USA . 72 parts In-Stock

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Overview

Unlock the power of innovation with the LM3S9997-IQC80-C3 microcontroller by Texas Instruments. Trusted for its high quality and reliability, Texas Instruments is a leading manufacturer in the industry. This microcontroller offers endless possibilities in various applications, providing customers with unbeatable value and benefits. Whether you're looking to design smart devices, automation systems, or IoT solutions, this product delivers exceptional performance and efficiency. Stay ahead of the curve with the LM3S9997-IQC80-C3 and experience the advantages it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and lightweight, making the product reliable and easy to handle.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards.

Maximum Supply Voltage: 3.6 V

Can operate efficiently at a relatively high supply voltage, providing flexibility in power source selection.

Package Shape: SQUARE

Square package shape saves space and provides a compact design for tighter PCB layouts.

Bit Size: 32

The 32-bit architecture offers high performance and processing capabilities for demanding applications.

Power Supplies (V): 1.2,3.3

Supports multiple power supply options, enabling compatibility with various voltage sources.

No. of Terminals: 100

Ample terminals allow for versatile connectivity options and integration with other components.

Package Style (Meter): FLATPACK

Flatpack design enhances heat dissipation and allows for efficient thermal management.

Minimum Supply Voltage: 3 V

Can operate at relatively low supply voltage levels, conserving power and extending battery life.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures, suitable for industrial environments with increased heat.

Minimum Operating Temperature: -40 °C

Can withstand extremely low temperatures, making it suitable for use in harsh or outdoor conditions.

ADC Channels: YES

Built-in ADC channels enable analog signal processing and conversion, expanding the range of input signals that can be handled.

DMA Channels: YES

DMA channels help improve data transfer efficiency by offloading data transfer tasks from the CPU, enhancing overall system performance.

Terminal Position: QUAD

Quad terminal position facilitates easy soldering and provides stable connection points on the PCB.

ROM Words: 262144

Ample ROM storage capacity allows for storing firmware and program code, enabling complex applications to run smoothly.

Maximum Seated Height: 1.6 mm

Low seated height saves space and allows for compact device designs, especially in slim applications.

Width: 14 mm

Narrow width dimensions offer flexibility in PCB layout and placement, accommodating space-constrained designs.

Maximum Clock Frequency: 16 MHz

High maximum clock frequency enables fast processing speed, essential for real-time applications and high data throughput.

Length: 14 mm

Compact length dimensions fit well in small devices and support miniaturization in electronic products.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable performance in harsh environmental conditions and extended operating lifetimes.

Peripheral IC Type: MICROCONTROLLER, RISC

Equipped with RISC architecture for efficient data processing and control, ideal for embedded applications and IoT devices.

RAM Bytes: 65536

Generous RAM size enables multitasking and handling of large datasets, essential for advanced applications requiring significant memory capacity.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of voltage levels, enhancing overall performance and reliability.

Terminal Form: GULL WING

Gull wing terminal form ensures secure soldering connections and reliable electrical contacts on the PCB.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage allows for consistent and reliable operation, ensuring proper functioning of the microcontroller.

PWM Channels: YES

PWM channels enable precise control of motor speeds, LED brightness, and other analog functions, enhancing versatility and functionality.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and modifications to firmware and software, facilitating product enhancements and feature additions.

Terminal Pitch: 0.5 mm

Fine terminal pitch supports high-density PCB designs and miniaturized assemblies, enabling compact and space-saving product layouts.

Speed: 80 rpm

Capable of processing data and executing commands at a speed of 80 revolutions per minute, ensuring efficient operation and performance.

No. of I/O Lines: 60

Abundance of I/O lines facilitates versatile input and output configurations, allowing for seamless integration with external devices and peripherals.

Technical Specifications

Microcontrollers LM3S9997-IQC80-C3 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

60

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S9997-IQC80-C3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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