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LM3S9997-IQC80-C1T

Texas Instruments

LM3S9997-IQC80-C1T by Texas Instruments

Texas Instruments LM3S9997-IQC80-C1T is a 32-bit microcontroller with 262144 ROM words and 65536 RAM bytes. It operates at up to 16.384 MHz, suitable for industrial applications requiring ADC and DMA channels, with a temperature range of -40 to 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,463 parts In-Stock

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3,463

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Vyrian

USA . 2,047 parts In-Stock

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2,047

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Distributors (Availability)

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AZTECH Wire

Italy . 569 parts In-Stock

1+ parts

$19.426

100+ parts

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569

$19.426

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One Stop Electronics

USA . 808 parts In-Stock

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$32.000

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808

$32.000

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Parana Technologies

USA . 2,023 parts In-Stock

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$36.960

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2,023

$36.960

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ChromeModa Solutions

Germany . 2,417 parts In-Stock

1+ parts

$41.528

100+ parts

$34.053

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2,417

$41.528

$34.053

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IDEA Electronic Components Group

UK . 693 parts In-Stock

1+ parts

$41.528

100+ parts

$39.452

1k+ parts

$37.375

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693

$41.528

$39.452

$37.375

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Corphita

USA . 1,154 parts In-Stock

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1,154

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DigiPath Technology Company

USA . 892 parts In-Stock

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$37.442

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892

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$37.442

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Microchip USA

USA . 383 parts In-Stock

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383

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Overview

Unlock the next level of performance with the LM3S9997-IQC80-C1T by Texas Instruments. Crafted with precision and expertise, this microcontroller offers unparalleled quality and reliability. Ideal for a wide range of applications, from industrial automation to consumer electronics, this powerhouse delivers exceptional value and efficiency. Experience seamless operation and cutting-edge technology without compromising on power or speed. Elevate your projects with the LM3S9997-IQC80-C1T and witness the difference Texas Instruments brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it suitable for a variety of applications.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and reducing production costs.

Maximum Supply Voltage: 1.32 V

Provides flexibility in power supply options while ensuring the safety of the microcontroller.

Package Shape: SQUARE

Compact shape saves space on the PCB and allows for efficient layout designs.

Bit Size: 32

High bit size allows for complex calculations and processing capabilities.

Power Supplies (V): 1.2,3.3

Supports multiple power supply options, enabling compatibility with various systems.

No. of Terminals: 100

Sufficient number of terminals for connecting peripherals and external components.

Package Style (Meter): FLATPACK

Flatpack style offers ease of PCB mounting and maintenance.

Minimum Supply Voltage: 1.08 V

Low minimum supply voltage allows for energy-efficient operation.

Maximum Operating Temperature: 85 °C

Wide operating temperature range makes it suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Ensures reliable performance even in extreme low-temperature conditions.

ADC Channels: YES

Integrated ADC channels enable analog-to-digital conversion for sensor interfacing.

DMA Channels: YES

Supports DMA for efficient data transfer and processing, improving overall system performance.

Terminal Position: QUAD

Quad terminal position provides stable connection and signal integrity.

ROM Words: 262144

Large ROM capacity allows for storing program code and data for complex applications.

Maximum Seated Height: 1.6 mm

Low profile design saves space and allows for compact PCB layouts.

Width: 14 mm

Compact width size enables flexibility in PCB design and layout.

Maximum Clock Frequency: 16.384 MHz

High clock frequency supports fast processing speed for real-time applications.

Length: 14 mm

Compact length size enables efficient use of PCB space.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range ensures reliable operation in harsh environmental conditions.

Peripheral IC Type: MICROCONTROLLER

Equipped with various peripherals for versatile functionality in embedded applications.

RAM Bytes: 65536

Large RAM capacity for temporary data storage and fast access during operation.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminals offer reliable solder connections for robust PCB assembly.

Nominal Supply Voltage: 1.2 V

Stable nominal supply voltage ensures consistent performance of the microcontroller.

PWM Channels: YES

Integrated PWM channels for precise control of analog output signals.

ROM Programmability: FLASH

Flash ROM allows for easy and fast reprogramming of the microcontroller for firmware updates.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density PCB layout and miniaturization of electronic devices.

Speed: 80 rpm

Fast processing speed of 80 rpm for efficient data handling and computation tasks.

No. of I/O Lines: 60

Sufficient number of I/O lines for connecting to external devices and interfaces in embedded systems.

Technical Specifications

Microcontrollers LM3S9997-IQC80-C1T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16.384 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

60

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S9997-IQC80-C1T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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