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LM3S9997-IBZ80-C1T

Texas Instruments

LM3S9997-IBZ80-C1T by Texas Instruments

Texas Instruments' LM3S9997-IBZ80-C1T is a 32-bit microcontroller with 262144 ROM words and 65536 RAM bytes. It operates at a max clock frequency of 16.384 MHz, suitable for industrial applications requiring ADC and DMA channels, with a temperature range from -40 to 85°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,771 parts In-Stock

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4,771

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Digiode

USA . 2,052 parts In-Stock

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2,052

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Distributors (Availability)

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AZTECH Wire

Italy . 672 parts In-Stock

1+ parts

$11.088

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672

$11.088

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One Stop Electronics

USA . 1,635 parts In-Stock

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$24.000

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1,635

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Parana Technologies

USA . 585 parts In-Stock

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$55.055

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585

$55.055

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ChromeModa Solutions

Germany . 6,556 parts In-Stock

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$61.859

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$50.724

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6,556

$61.859

$50.724

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IDEA Electronic Components Group

UK . 1,974 parts In-Stock

1+ parts

$61.859

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$58.766

1k+ parts

$55.673

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1,974

$61.859

$58.766

$55.673

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QUARKTWIN TECHNOLOGY LTD

USA . 17,529 parts In-Stock

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17,529

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Microchip USA

USA . 4,658 parts In-Stock

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Corphita

USA . 2,614 parts In-Stock

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DigiPath Technology Company

USA . 1,945 parts In-Stock

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$55.772

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1,945

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Overview

Unlock the power of innovation with the LM3S9997-IBZ80-C1T by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and reliability. This microcontroller is perfect for a wide range of applications, offering customers unparalleled value and benefits. Whether you're working on IoT devices, industrial automation, or consumer electronics, this product provides the performance and flexibility you need to bring your ideas to life. Trust Texas Instruments to help you stay ahead of the curve with cutting-edge technology that meets your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and protection for the microcontroller, making it suitable for various environments.

Surface Mount: YES

Surface mount technology enables easy and efficient PCB assembly, saving space and reducing overall product size.

Maximum Supply Voltage: 1.32 V

The maximum supply voltage of 1.32 V ensures safe operation and protection of the microcontroller.

Package Shape: SQUARE

The square package shape allows for easier PCB layout and component placement, optimizing space utilization.

Bit Size: 32

The 32-bit architecture provides high processing power and performance for demanding applications.

Power Supplies (V): 1.2,3.3

Support for multiple power supply voltages (1.2V and 3.3V) allows flexibility in system design and compatibility with different power sources.

No. of Terminals: 108

The high number of terminals (108) enables versatile connectivity and integration with other components in the system.

Package Style (Meter): GRID ARRAY

The grid array package style enhances mechanical stability and reliability, suitable for industrial applications.

Minimum Supply Voltage: 1.08 V

The minimum supply voltage of 1.08 V ensures efficient power consumption and extends battery life in portable devices.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the microcontroller can withstand high-temperature environments without performance degradation.

Minimum Operating Temperature: -40 °C

The wide operating temperature range (-40 to 85°C) makes the microcontroller suitable for harsh environmental conditions.

ADC Channels: YES

Built-in ADC channels enable analog signal processing, making the microcontroller suitable for sensor interfacing and data acquisition applications.

DMA Channels: YES

Support for DMA channels improves data transfer efficiency and offloads the CPU, enhancing system performance.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy PCB mounting and soldering, optimizing assembly process and reliability.

ROM Words: 262144

Large ROM capacity of 262144 words allows for storing firmware and program data, accommodating complex software algorithms.

Maximum Seated Height: 1.5 mm

Low seated height of 1.5 mm minimizes the overall profile of the microcontroller, suitable for space-constrained applications.

Width: 10 mm

Compact width of 10 mm enables compact PCB design, saving board space and reducing overall system footprint.

Maximum Clock Frequency: 16.384 MHz

High maximum clock frequency of 16.384 MHz allows for fast execution of instructions, enhancing real-time processing capabilities.

Length: 10 mm

With a length of 10 mm, the microcontroller can fit in compact electronic devices and modules, suitable for miniaturized applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh industrial environments with wide temperature fluctuations.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, the product integrates various peripheral interfaces and processing units in a single chip, simplifying system design and reducing component count.

RAM Bytes: 65536

Ample RAM capacity of 65536 bytes allows for efficient data storage and manipulation, supporting multitasking and data-intensive applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, enhancing overall performance and energy efficiency.

Terminal Form: BALL

Ball terminal form provides reliable electrical connections and mechanical stability, ensuring secure interconnection with external circuitry.

Nominal Supply Voltage: 1.2 V

Nominal supply voltage of 1.2 V ensures stable and efficient operation of the microcontroller, meeting power requirements of the system.

PWM Channels: YES

Support for PWM channels enables precise control of analog signals, suitable for motor control, power management, and dimming applications.

ROM Programmability: FLASH

Flash ROM programmability allows for in-system programming and updating of firmware, facilitating product customization and software upgrades.

Terminal Pitch: 0.8 mm

Fine terminal pitch of 0.8 mm enables high-density mounting and compact PCB layout, saving space and enhancing design flexibility.

Speed: 80 rpm

Operating at a speed of 80 revolutions per minute (rpm), the microcontroller provides fast data processing and response times in dynamic applications.

No. of I/O Lines: 60

With 60 I/O lines, the microcontroller offers versatile connectivity options for interfacing with external devices and peripherals, enhancing system integration.

Technical Specifications

Microcontrollers LM3S9997-IBZ80-C1T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16.384 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

Length:

10 mm

No. of I/O Lines:

60

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S9997-IBZ80-C1T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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