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LM3S9792-IQC80-C5

Texas Instruments

LM3S9792-IQC80-C5 by Texas Instruments

Texas Instruments LM3S9792-IQC80-C5 is a 32-bit Cortex-M3 microcontroller with 131072 ROM words and 65536 RAM bytes. It operates at up to 16.384 MHz, has 65 I/O lines, and supports ADC and DMA channels. Ideal for industrial applications requiring high-speed processing in a compact form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,181 parts In-Stock

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5,181

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Digiode

USA . 3,705 parts In-Stock

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3,705

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Distributors (Availability)

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AZTECH Wire

Italy . 499 parts In-Stock

1+ parts

$7.468

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499

$7.468

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One Stop Electronics

USA . 1,225 parts In-Stock

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$16.000

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$16.000

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Parana Technologies

USA . 679 parts In-Stock

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$34.666

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679

$34.666

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ChromeModa Solutions

Germany . 1,631 parts In-Stock

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$38.950

100+ parts

$31.939

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1,631

$38.950

$31.939

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IDEA Electronic Components Group

UK . 1,290 parts In-Stock

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$38.950

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$37.002

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$35.055

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1,290

$38.950

$37.002

$35.055

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Lixinc

USA . 19,236 parts In-Stock

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Corphita

USA . 2,620 parts In-Stock

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DigiPath Technology Company

USA . 878 parts In-Stock

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$35.117

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Microchip USA

USA . 489 parts In-Stock

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489

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Overview

Unlock the power of innovation with the Texas Instruments LM3S9792-IQC80-C5 microcontroller. Designed for cutting-edge applications, this high-quality device boasts a 32-bit Cortex-M3 CPU family and an array of features including ADC and DMA channels. With a compact square package and low profile design, this microcontroller is perfect for industrial-grade projects that require precision and reliability. Experience the seamless performance and efficiency that Texas Instruments is known for, and take your project to the next level with the LM3S9792-IQC80-C5.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it suitable for various environments.

Surface Mount: YES

Allows for easy installation on circuit boards, saving space and enabling efficient assembly processes.

Maximum Supply Voltage: 1.365 V

Operates within a safe voltage range, protecting the microcontroller from potential damage.

Package Shape: SQUARE

Square shape allows for efficient placement and alignment on circuit boards, optimizing space usage.

Bit Size: 32

32-bit architecture provides high processing power and performance for complex tasks and applications.

Power Supplies (V): 1.2,3.3

Supports multiple power supplies, offering flexibility in designing power schemes for different functionalities.

No. of Terminals: 100

Sufficient number of terminals for connecting various components and peripherals, enhancing the microcontroller's capabilities.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

These package styles promote efficient board layout and thermal management, contributing to overall system performance.

Minimum Supply Voltage: 1.235 V

Provides a narrow voltage range for operation, ensuring stability and reliability of the microcontroller.

Maximum Operating Temperature: 85 °C

Withstands high temperature environments, making it suitable for industrial applications with challenging operating conditions.

CPU Family: CORTEX-M3

Cortex-M3 architecture offers high efficiency and performance, ideal for real-time processing and control in embedded systems.

Minimum Operating Temperature: -40 °C

Capable of functioning in cold temperatures, enabling usage in harsh environments or outdoor applications.

ADC Channels: YES

Integrated Analog-to-Digital Converters (ADC) enable the microcontroller to interface with analog sensors and signals.

DMA Channels: YES

Supports Direct Memory Access (DMA) for efficient data transfer, reducing the workload on the CPU and improving overall system performance.

Terminal Position: QUAD

Quad terminal positioning simplifies the connection of external devices and peripherals, enhancing the microcontroller's versatility.

ROM Words: 131072

Large Read-Only Memory (ROM) capacity allows for storing extensive program code and data, accommodating complex software requirements.

Maximum Seated Height: 1.6 mm

Low-profile design facilitates compact product designs and enables the microcontroller to fit in space-constrained applications.

Width: 14 mm

Compact width dimension makes the microcontroller suitable for small form factor devices and space-limited installations.

Maximum Clock Frequency: 16.384 MHz

High clock frequency enables rapid data processing and responsiveness, enhancing the microcontroller's performance in demanding applications.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for a limited duration, ensuring reliable soldering during assembly processes.

Peak Reflow Temperature °C: 260

Peak reflow temperature tolerance allows for proper soldering and mounting of the microcontroller on PCBs during manufacturing.

Length: 14 mm

Compact length dimension contributes to space-efficient designs and helps in accommodating the microcontroller in various product configurations.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliability and performance in harsh operating environments with temperature fluctuations.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC-based microcontroller architecture offers high efficiency, low power consumption, and quick execution of instructions for responsive operation.

RAM Bytes: 65536

Ample Random Access Memory (RAM) capacity for storing data variables and temporary program information, supporting multitasking and data processing requirements.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and fast switching speeds, enhancing the microcontroller's overall efficiency.

Terminal Form: GULL WING

Gull wing terminal form factor simplifies soldering and mounting of the microcontroller on circuit boards, ensuring secure and reliable connections.

Nominal Supply Voltage: 1.3 V

Stable nominal supply voltage ensures consistent performance and functionality of the microcontroller across different operating conditions.

PWM Channels: YES

Supports Pulse Width Modulation (PWM) outputs for precise control of motors, lighting, and other analog devices, adding versatility to the microcontroller's capabilities.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updating and customization of software programs, enabling flexibility and adaptability in applications.

Terminal Pitch: 0.5 mm

Fine terminal pitch facilitates high-density mounting on PCBs, enabling compact designs and efficient use of board space.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates moderate sensitivity to moisture, requiring standard handling and storage practices to maintain the microcontroller's reliability.

Speed: 80 rpm

With a speed of 80 revolutions per minute, this microcontroller can efficiently process instructions and manage tasks at a brisk pace.

No. of I/O Lines: 65

Adequate number of Input/Output (I/O) lines for connecting external devices, sensors, and interfaces, enhancing the microcontroller's connectivity and functionality.

Technical Specifications

Microcontrollers LM3S9792-IQC80-C5 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16.384 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

65

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.365 V

Minimum Supply Voltage:

1.235 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S9792-IQC80-C5 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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