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LM3S8G62-IQC80-A2T

Texas Instruments

LM3S8G62-IQC80-A2T by Texas Instruments

LM3S8G62-IQC80-A2T by Texas Instruments is a 32-bit microcontroller with Cortex-M3 CPU, 393216 ROM words, and 65536 RAM bytes. It operates at up to 16.384 MHz, suitable for industrial applications requiring high-speed processing and features like ADC and DMA channels for efficient data handling. With a compact square package style of 14mm x 14mm and low profile design, it is ideal for space-constrained environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,971 parts In-Stock

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6,971

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Digiode

USA . 2,387 parts In-Stock

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2,387

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Distributors (Availability)

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AZTECH Wire

Italy . 842 parts In-Stock

1+ parts

$13.888

100+ parts

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842

$13.888

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One Stop Electronics

USA . 922 parts In-Stock

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$28.000

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922

$28.000

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Parana Technologies

USA . 2,231 parts In-Stock

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$74.780

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2,231

$74.780

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ChromeModa Solutions

Germany . 2,731 parts In-Stock

1+ parts

$84.023

100+ parts

$68.899

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2,731

$84.023

$68.899

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IDEA Electronic Components Group

UK . 177 parts In-Stock

1+ parts

$84.023

100+ parts

$79.822

1k+ parts

$75.621

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177

$84.023

$79.822

$75.621

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Corphita

USA . 4,314 parts In-Stock

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4,314

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DigiPath Technology Company

USA . 1,262 parts In-Stock

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$75.755

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1,262

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$75.755

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Microchip USA

USA . 126 parts In-Stock

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126

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Overview

Unlock the power of innovation with the LM3S8G62-IQC80-A2T by Texas Instruments. Crafted with precision and expertise, this microcontroller is designed to deliver unmatched performance and reliability. From industrial automation to consumer electronics, the possibilities are endless with this versatile device. Experience seamless integration, efficient power management, and cutting-edge technology all in one compact package. Elevate your projects to new heights with the LM3S8G62-IQC80-A2T and witness the difference that superior quality and advanced features can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material for long-lasting performance.

Surface Mount: YES

Easy to mount on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 1.365 V

Efficient power usage and protection against voltage spikes.

Package Shape: SQUARE

Compact design for efficient use of space on the PCB.

Bit Size: 32

High processing power for complex tasks and calculations.

Power Supplies (V): 1.3,3.3

Supports multiple power supply options for flexibility in system design.

No. of Terminals: 100

Sufficient connectivity options for interfacing with other components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Versatile packaging options for different application requirements.

Minimum Supply Voltage: 1.235 V

Allows for operation at lower power levels, increasing energy efficiency.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments with high temperature fluctuations.

CPU Family: CORTEX-M3

Powerful and efficient processor for running advanced applications.

Minimum Operating Temperature: -40 °C

Wide temperature range for operation in harsh environmental conditions.

ADC Channels: YES

Analog-to-digital conversion capability for sensor interface and data acquisition.

DMA Channels: YES

Direct Memory Access for efficient data transfer and processing.

Terminal Position: QUAD

Quad position terminals for stable and secure connections.

ROM Words: 393216

Large ROM capacity for storing program instructions and data.

Maximum Seated Height: 1.6 mm

Low profile design for compact and space-saving installation.

Width: 14 mm

Narrow width for fitting into tight spaces on the PCB.

Maximum Clock Frequency: 16.384 MHz

High-speed clock frequency for fast processing and responsiveness.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering and assembly during manufacturing.

Peak Reflow Temperature °C: 260

High reflow temperature tolerance for reliable soldering.

Length: 14 mm

Compact length for space-efficient PCB layout.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial temperature conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Specifically designed for microcontroller applications with reduced instruction set computing (RISC) architecture.

RAM Bytes: 65536

Sufficient random access memory for temporary data storage and processing.

Technology: CMOS

CMOS technology for low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminals for secure solder connections and durability.

Nominal Supply Voltage: 1.3 V

Stable nominal voltage for consistent and reliable operation.

PWM Channels: YES

Pulse-width modulation channels for precise control of analog signals.

ROM Programmability: FLASH

Flash ROM for reprogrammable memory storage and firmware updates.

Terminal Pitch: 0.5 mm

Fine pitch terminals for high-density PCB layouts and compact design.

Moisture Sensitivity Level (MSL): 3

Resistant to moisture and humidity-related damage during operation.

Speed: 80 rpm

Operates efficiently at a speed of 80 revolutions per minute.

No. of I/O Lines: 46

Sufficient input/output lines for connectivity and external device interface.

Technical Specifications

Microcontrollers LM3S8G62-IQC80-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16.384 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

46

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.3,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

393216

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.365 V

Minimum Supply Voltage:

1.235 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S8G62-IQC80-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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