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LM3S8G62-IQC80-A2

Texas Instruments

LM3S8G62-IQC80-A2 by Texas Instruments

Texas Instruments' LM3S8G62-IQC80-A2 is a 32-bit Cortex-M3 microcontroller with 393216 ROM words and 65536 RAM bytes. It operates at a max clock frequency of 16.384 MHz, suitable for industrial applications requiring high-speed processing and ADC/DMA capabilities. With a compact size of 14mm x 14mm and low profile design, it's ideal for space-constrained projects needing efficient data handling.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,742 parts In-Stock

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3,742

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Digiode

USA . 2,050 parts In-Stock

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2,050

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 447 parts In-Stock

1+ parts

$19.171

100+ parts

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447

$19.171

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One Stop Electronics

USA . 1,079 parts In-Stock

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$27.000

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1,079

$27.000

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Parana Technologies

USA . 718 parts In-Stock

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$39.642

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718

$39.642

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ChromeModa Solutions

Germany . 5,837 parts In-Stock

1+ parts

$44.542

100+ parts

$36.524

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5,837

$44.542

$36.524

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IDEA Electronic Components Group

UK . 1,661 parts In-Stock

1+ parts

$44.542

100+ parts

$42.315

1k+ parts

$40.088

10k+ parts

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1,661

$44.542

$42.315

$40.088

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Corphita

USA . 3,684 parts In-Stock

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3,684

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DigiPath Technology Company

USA . 1,708 parts In-Stock

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$40.159

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1,708

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$40.159

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Microchip USA

USA . 102 parts In-Stock

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102

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Overview

Elevate your projects with the LM3S8G62-IQC80-A2 microcontroller from Texas Instruments. Designed with precision and quality in mind, this powerful Cortex-M3 CPU family device offers unmatched performance and reliability for a wide range of applications. Whether you are working on robotics, automation, or IoT projects, this microcontroller's advanced features like ADC and DMA channels, along with its wide operating temperature range, make it the ideal choice for your next innovation. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, ensuring it can withstand various environmental conditions.

Surface Mount: YES

Surface mount technology enables easy and efficient PCB assembly, making it convenient for manufacturers.

Maximum Supply Voltage: 1.365 V

Provides a safe operating range for the microcontroller, preventing damage from overvoltage.

Package Shape: SQUARE

Square shape allows for efficient use of PCB space, optimizing design layouts.

Bit Size: 32

Offers sufficient processing power for a wide range of applications, suitable for complex tasks.

Power Supplies (V): 1.3,3.3

Supports multiple power supply options, providing flexibility in system design.

No. of Terminals: 100

Plenty of terminals for connectivity options, enabling interfacing with other components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Variety of package styles for different mounting preferences, enhancing compatibility with diverse PCB designs.

Minimum Supply Voltage: 1.235 V

Low minimum supply voltage allows for power-efficient operation, saving energy.

Maximum Operating Temperature: 85 °C

Wide operating temperature range suitable for industrial environments, ensuring reliable performance.

CPU Family: CORTEX-M3

Advanced Cortex-M3 architecture offers high performance and energy efficiency, ideal for embedded systems.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold temperatures, making it suitable for harsh conditions.

ADC Channels: YES

Includes ADC channels for analog signal processing, enabling sensor interfacing and data conversion.

DMA Channels: YES

DMA channels for efficient data transfer, reducing CPU overhead and improving overall system performance.

Terminal Position: QUAD

Quad terminal position for stable and secure connection, reducing signal interference and enhancing reliability.

ROM Words: 393216

Large ROM capacity for storing program instructions and data, suitable for complex software applications.

Maximum Seated Height: 1.6 mm

Low profile design for space-constrained applications, enabling compact and slim device designs.

Width: 14 mm

Compact width for easy integration on PCBs, allowing for efficient use of board space.

Maximum Clock Frequency: 16.384 MHz

High clock frequency for fast processing speed, improving overall system performance.

Maximum Time At Peak Reflow Temperature (s): 30

30 seconds threshold at peak reflow temperature ensures proper soldering during manufacturing.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance for reliable soldering and durability during assembly.

Length: 14 mm

Compact length for space-saving designs, allowing for versatile placement on PCBs.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance for reliable operation in harsh manufacturing environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with RISC architecture for efficient instruction execution and low power consumption.

RAM Bytes: 65536

Ample RAM capacity for data storage and manipulation, suitable for multitasking and high-performance applications.

Technology: CMOS

CMOS technology for low power consumption and high noise immunity, ensuring stable and efficient operation.

Terminal Form: GULL WING

Gull wing terminal form for reliable solder joint connections, minimizing the risk of signal loss or disconnection.

Nominal Supply Voltage: 1.3 V

Stable nominal supply voltage for consistent and reliable operation, ensuring system stability.

PWM Channels: YES

PWM channels for precise control of output signals, suitable for motor control and power management applications.

ROM Programmability: FLASH

Flash ROM programmability for easy and flexible software updates, enhancing product longevity and adaptability.

Terminal Pitch: 0.5 mm

Fine terminal pitch for compact PCB layouts, enabling higher terminal density and miniaturization.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating for safe handling and storage, ensuring product integrity and reliability during manufacturing and operation.

Speed: 80 rpm

High operational speed for responsive and efficient performance in time-critical applications.

No. of I/O Lines: 46

Sufficient I/O lines for versatile connectivity and interfacing with external devices, enhancing system integration capabilities.

Technical Specifications

Microcontrollers LM3S8G62-IQC80-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16.384 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

46

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.3,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

393216

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.365 V

Minimum Supply Voltage:

1.235 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S8G62-IQC80-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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