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LM3S8C62-IQC80-A2T

Texas Instruments

LM3S8C62-IQC80-A2T by Texas Instruments

Texas Instruments LM3S8C62-IQC80-A2T is a 32-bit microcontroller with Cortex-M3 CPU, 524288 ROM words, and 65536 RAM bytes. It operates at up to 16.384 MHz clock frequency and has 46 I/O lines for industrial applications requiring high-speed processing and multiple input/output functionalities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,186 parts In-Stock

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3,186

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Vyrian

USA . 1,930 parts In-Stock

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1,930

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,610 parts In-Stock

1+ parts

$11.000

100+ parts

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1,610

$11.000

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AZTECH Wire

Italy . 355 parts In-Stock

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$14.053

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355

$14.053

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Microchip USA

USA . 490 parts In-Stock

1+ parts

$29.530

100+ parts

$29.100

1k+ parts

$28.890

10k+ parts

$28.680

490

$29.530

$29.100

$28.890

$28.680

Parana Technologies

USA . 2,237 parts In-Stock

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$36.475

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2,237

$36.475

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ChromeModa Solutions

Germany . 3,108 parts In-Stock

1+ parts

$40.983

100+ parts

$33.606

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3,108

$40.983

$33.606

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IDEA Electronic Components Group

UK . 194 parts In-Stock

1+ parts

$40.983

100+ parts

$38.934

1k+ parts

$36.885

10k+ parts

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194

$40.983

$38.934

$36.885

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Corphita

USA . 1,638 parts In-Stock

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1,638

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DigiPath Technology Company

USA . 1,097 parts In-Stock

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$36.950

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1,097

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$36.950

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Overview

Unlock the power of cutting-edge technology with the LM3S8C62-IQC80-A2T by Texas Instruments. This high-quality microcontroller offers unparalleled performance and reliability, making it ideal for a wide range of applications. From industrial automation to consumer electronics, this product delivers exceptional value and benefits to customers looking for innovative solutions. Trust in Texas Instruments for top-notch quality and take your projects to the next level with the LM3S8C62-IQC80-A2T.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight, durable, and cost-effective, making the product easy to handle and suitable for a variety of applications.

Surface Mount: YES

Surface mounting allows for easy and efficient assembly, saving time and enhancing the overall reliability of the product.

Maximum Supply Voltage: 1.365 V

The maximum supply voltage of 1.365 V ensures safe operation and protects the product from potential damage due to overvoltage.

Package Shape: SQUARE

The square package shape offers efficient use of space and easy integration into circuit designs.

Bit Size: 32

A 32-bit architecture provides high processing power and performance capabilities, allowing the product to handle complex tasks with ease.

Power Supplies (V): 1.3, 3.3

Having multiple power supply options (1.3V and 3.3V) offers flexibility in design and operation, catering to different voltage requirements.

No. of Terminals: 100

With 100 terminals, the product allows for a wide range of input and output connections, enhancing its versatility and applicability.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The package style options of flatpack, low profile, and fine pitch offer different mounting options for various applications, increasing usability.

Minimum Supply Voltage: 1.235 V

The minimum supply voltage of 1.235 V ensures efficient power consumption and helps optimize energy usage in the product.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C allows the product to operate in harsh environments without compromising performance.

CPU Family: CORTEX-M3

Being part of the Cortex-M3 CPU family ensures reliable and consistent performance, making the product suitable for a wide range of applications.

Technical Specifications

Microcontrollers LM3S8C62-IQC80-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16.384 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

46

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.3,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

210 mA

Maximum Supply Voltage:

1.365 V

Minimum Supply Voltage:

1.235 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S8C62-IQC80-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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