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LM3S8C62-IQC80-A2

Texas Instruments

LM3S8C62-IQC80-A2 by Texas Instruments

LM3S8C62-IQC80-A2 by Texas Instruments is a 32-bit microcontroller with 524288 ROM words and 65536 RAM bytes. It operates at a max clock frequency of 16.384 MHz, making it suitable for industrial applications requiring high-speed processing and efficient memory management. With features like ADC and DMA channels, this Cortex-M3 CPU family device offers versatile functionality for various embedded systems projects.

Median Price

$8.965

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 75 parts In-Stock

1+ parts

$3.900

100+ parts

$3.900

1k+ parts

$3.900

10k+ parts

-

75

$3.900

$3.900

$3.900

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DigiKey

USA . 246 parts In-Stock

1+ parts

$14.030

100+ parts

$10.386

1k+ parts

-

10k+ parts

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246

$14.030

$10.386

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 65 parts In-Stock

1+ parts

$9.420

100+ parts

-

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-

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65

$9.420

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-

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Digiode

USA . 1,778 parts In-Stock

1+ parts

$13.328

100+ parts

-

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1,778

$13.328

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Vyrian

USA . 8,352 parts In-Stock

1+ parts

-

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8,352

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ACDS - Activité Composants Distribution Service

France . 87 parts In-Stock

1+ parts

-

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87

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Bristol Electronics

USA . 87 parts In-Stock

1+ parts

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87

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Netroflash

USA . 500 parts In-Stock

1+ parts

$9.420

100+ parts

$9.232

1k+ parts

-

10k+ parts

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500

$9.420

$9.232

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-

Ampacity Inc.

Singapore . 215 parts In-Stock

1+ parts

$11.930

100+ parts

-

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-

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215

$11.930

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Corphita

USA . 2,454 parts In-Stock

1+ parts

$12.627

100+ parts

-

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2,454

$12.627

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AZTECH Wire

Italy . 217 parts In-Stock

1+ parts

$16.341

100+ parts

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217

$16.341

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Microchip USA

USA . 467 parts In-Stock

1+ parts

$39.280

100+ parts

$38.720

1k+ parts

$38.440

10k+ parts

$38.160

467

$39.280

$38.720

$38.440

$38.160

Parana Technologies

USA . 734 parts In-Stock

1+ parts

$43.806

100+ parts

-

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734

$43.806

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DigiPath Technology Company

USA . 2,299 parts In-Stock

1+ parts

$48.236

100+ parts

-

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2,299

$48.236

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ChromeModa Solutions

Germany . 4,750 parts In-Stock

1+ parts

$49.220

100+ parts

$40.360

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4,750

$49.220

$40.360

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IDEA Electronic Components Group

UK . 1,422 parts In-Stock

1+ parts

$49.220

100+ parts

$46.759

1k+ parts

$44.298

10k+ parts

-

1,422

$49.220

$46.759

$44.298

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Authorized Procurement Solutions

USA . 12,000 parts In-Stock

1+ parts

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12,000

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Overview

Unleash the power of cutting-edge technology with the Texas Instruments LM3S8C62-IQC80-A2 microcontroller. Designed with precision and expertise, this device offers unparalleled performance in a wide range of applications. With its high-quality manufacturing by Texas Instruments and advanced features like ADC and DMA channels, this microcontroller provides exceptional value and benefits to customers. Whether you're working on industrial automation, robotics, or IoT projects, the LM3S8C62-IQC80-A2 delivers reliability and efficiency like no other. Upgrade your designs today with this top-of-the-line microcontroller and experience the difference for yourself!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller suitable for portable and rugged applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this microcontroller can function reliably in harsh environmental conditions.

ADC Channels: YES

Having Analog-to-Digital Converter channels enables the microcontroller to interface with a variety of sensors and analog devices.

DMA Channels: YES

Direct Memory Access channels allow for efficient data transfers between peripherals and memory, improving overall system performance.

ROM Words: 524288

The large amount of ROM words ensures sufficient storage capacity for program code and data.

RAM Bytes: 65536

Generous RAM capacity allows for temporary data storage and efficient processing of algorithms and calculations.

PWM Channels: YES

Pulse Width Modulation channels enable precise control of outputs such as motor speed and LED brightness.

Maximum Clock Frequency: 16.384 MHz

With a high clock frequency, this microcontroller can execute instructions quickly, making it suitable for real-time applications.

Technical Specifications

Microcontrollers LM3S8C62-IQC80-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16.384 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

46

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.3,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

210 mA

Maximum Supply Voltage:

1.365 V

Minimum Supply Voltage:

1.235 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S8C62-IQC80-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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