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LM3S8971-IQC50-A2T

Texas Instruments

LM3S8971-IQC50-A2T by Texas Instruments

Texas Instruments' LM3S8971-IQC50-A2T is a 32-bit microcontroller with 262144 ROM words and 65536 RAM bytes. Operating at up to 0.032 MHz, it features 38 I/O lines and PWM channels for industrial applications requiring a temperature range of -40 to 85 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,550 parts In-Stock

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Digiode

USA . 2,007 parts In-Stock

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2,007

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Distributors (Availability)

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AZTECH Wire

Italy . 432 parts In-Stock

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$10.283

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432

$10.283

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One Stop Electronics

USA . 741 parts In-Stock

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$24.000

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741

$24.000

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Parana Technologies

USA . 2,051 parts In-Stock

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$75.848

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$7,043.598

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$68.263

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2,051

$75.848

$7,043.598

$68.263

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DigiPath Technology Company

USA . 1,589 parts In-Stock

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$83.518

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$76.836

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1,589

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$76.836

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IDEA Electronic Components Group

UK . 2,196 parts In-Stock

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$85.222

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$80.961

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$76.700

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2,196

$85.222

$80.961

$76.700

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ChromeModa Solutions

Germany . 53 parts In-Stock

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$85.222

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$69.882

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53

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$69.882

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QUARKTWIN TECHNOLOGY LTD

USA . 23,832 parts In-Stock

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Corphita

USA . 2,552 parts In-Stock

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Microchip USA

USA . 203 parts In-Stock

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Overview

Experience superior performance and reliability with the LM3S8971-IQC50-A2T microcontroller by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality products that meet the highest standards. This versatile microcontroller is perfect for a wide range of applications, offering customers unparalleled value and benefits. Whether you're looking to enhance your industrial processes or develop innovative solutions, the LM3S8971-IQC50-A2T provides the power and efficiency you need. Trust in Texas Instruments for cutting-edge technology that drives success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and reliable for long-term use

Surface Mount: YES

Surface mount technology allows for compact design and easy installation

Maximum Supply Voltage: 2.75 V

Suitable for low voltage applications, reducing power consumption

Package Shape: SQUARE

Square package shape allows for efficient use of space on a circuit board

Bit Size: 32

32-bit architecture provides high processing power and performance

Power Supplies (V): 2.5, 3.3

Supports multiple power supply options for versatility in application

No. of Terminals: 100

Ample terminals for connectivity with other components

Package Style (Meter): FLATPACK

Flatpack style offers a low profile and space-saving design

Minimum Supply Voltage: 2.25 V

Can operate at low supply voltages for energy efficiency

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures for industrial applications

Minimum Operating Temperature: -40 °C

Operates effectively in extreme cold environments

Terminal Finish: TIN

TIN finish provides corrosion resistance and good electrical conductivity

ADC Channels: YES

Analog-to-digital converter channels enable interfacing with analog sensors

Terminal Position: QUAD

Quad terminal position allows for secure and stable connections

ROM Words: 262144

Large ROM capacity for storing program instructions and data

Maximum Seated Height: 1.6 mm

Low profile design for compact and space-efficient PCB layout

Width: 14 mm

Moderate width for fitting into various electronic devices

Maximum Clock Frequency: 0.032 MHz

High clock frequency for fast data processing

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for soldering process

Peak Reflow Temperature °C: 260

Suitable peak reflow temperature for efficient soldering

Length: 14 mm

Compact length for space-constrained applications

Temperature Grade: INDUSTRIAL

Designed for industrial temperature ranges and rugged environments

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with RISC architecture for efficient data processing

RAM Bytes: 65536

Large RAM capacity for temporary data storage and processing

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity

Terminal Form: GULL WING

Gull wing terminal form for easy soldering and strong mechanical connection

Nominal Supply Voltage: 2.5 V

Stable supply voltage for consistent performance

PWM Channels: YES

Pulse Width Modulation (PWM) channels for precise control of output signals

ROM Programmability: FLASH

Flash programmable ROM for easy updating of firmware

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density integration on PCBs

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture during storage and handling

Speed: 50 rpm

Can handle data processing at high speeds

No. of I/O Lines: 38

Sufficient I/O lines for input and output connections with external devices

Technical Specifications

Microcontrollers LM3S8971-IQC50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

38

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S8971-IQC50-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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