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LM3S8970-EQC50-A2

Texas Instruments

LM3S8970-EQC50-A2 by Texas Instruments

LM3S8970-EQC50-A2 by Texas Instruments is a 32-bit microcontroller with 262144 ROM words and 65536 RAM bytes. Operating at up to 8.192 MHz, it features 46 I/O lines and PWM channels for industrial applications requiring high-speed processing and precise control.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,740 parts In-Stock

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2,740

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Vyrian

USA . 2,679 parts In-Stock

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2,679

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Distributors (Availability)

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AZTECH Wire

Italy . 433 parts In-Stock

1+ parts

$6.951

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433

$6.951

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One Stop Electronics

USA . 1,596 parts In-Stock

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$10.000

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Parana Technologies

USA . 1,349 parts In-Stock

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$66.264

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$66.264

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IDEA Electronic Components Group

UK . 1,275 parts In-Stock

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$74.454

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$70.731

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$67.009

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1,275

$74.454

$70.731

$67.009

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ChromeModa Solutions

Germany . 802 parts In-Stock

1+ parts

$74.454

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$61.052

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802

$74.454

$61.052

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Corphita

USA . 4,223 parts In-Stock

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4,223

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DigiPath Technology Company

USA . 200 parts In-Stock

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$67.128

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Microchip USA

USA . 101 parts In-Stock

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Overview

Discover the powerful LM3S8970-EQC50-A2 microcontroller by Texas Instruments, a cutting-edge technology that offers unparalleled performance and reliability in a compact package. With its innovative design and top-notch manufacturing quality, this microcontroller is perfect for a wide range of applications in industries such as automotive, industrial automation, and consumer electronics. Experience the efficiency and precision of this product, providing you with seamless integration, high-speed processing, and exceptional functionality. Upgrade your projects with the LM3S8970-EQC50-A2 and unleash endless possibilities!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, ensuring long-term reliability.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and simplifying assembly processes.

Maximum Supply Voltage: 2.75 V

The maximum supply voltage of 2.75 V ensures safe operation and protects the microcontroller from overvoltage conditions.

Package Shape: SQUARE

The square package shape provides uniformity and ease of mounting onto circuit boards.

Bit Size: 32

A 32-bit architecture provides enhanced performance and precision in data processing and calculations.

Power Supplies (V): 2.5,3.3

Support for multiple power supply voltages allows for flexibility in design and compatibility with various systems.

No. of Terminals: 100

With a high number of terminals, this microcontroller offers ample connectivity options for peripherals and external devices.

Package Style (Meter): FLATPACK

The flatpack package style offers a compact form factor and efficient heat dissipation for optimal performance.

Minimum Supply Voltage: 2.25 V

The minimum supply voltage of 2.25 V ensures reliable operation even under low voltage conditions.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature allows for reliable operation in harsh industrial environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance even in extreme cold conditions.

ADC Channels: YES

The presence of ADC channels enables analog-to-digital conversion for sensor interfacing and data acquisition.

Terminal Position: QUAD

The quad terminal position offers a stable mounting configuration and ease of soldering.

ROM Words: 262144

With a large ROM capacity of 262144 words, this microcontroller can store extensive program data and instructions.

Maximum Seated Height: 1.6 mm

The low maximum seated height allows for slim and compact device designs.

Width: 14 mm

The moderate width of 14 mm provides a balance between compactness and ease of layout in PCB designs.

Maximum Clock Frequency: 8.192 MHz

The high maximum clock frequency of 8.192 MHz enables fast processing and response times in real-time applications.

Length: 14 mm

The moderate length of 14 mm complements the width and ensures a well-proportioned form factor.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating ensures reliable operation in demanding environmental conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Featuring a RISC architecture, this microcontroller offers efficient processing and execution of instructions.

RAM Bytes: 65536

With a RAM capacity of 65536 bytes, this microcontroller can store and access data quickly for efficient operation.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for battery-powered devices.

Terminal Form: GULL WING

The gull wing terminal form provides secure connections and ease of soldering during assembly.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage of 2.5 V ensures optimal performance and compatibility with standard power sources.

PWM Channels: YES

Support for PWM channels enables precise control of analog signals for applications such as motor control and lighting.

ROM Programmability: FLASH

Flash ROM technology allows for easy reprogramming and updating of firmware without the need for external programming devices.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5 mm enables high-density packaging and efficient use of PCB space.

Speed: 50 rpm

With a speed rating of 50 rpm, this microcontroller can process instructions rapidly for real-time control applications.

No. of I/O Lines: 46

With 46 I/O lines, this microcontroller provides ample connectivity for interfacing with external sensors, actuators, and communication devices.

Technical Specifications

Microcontrollers LM3S8970-EQC50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

8.192 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

46

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S8970-EQC50-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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