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LM3S8733-EQC50-A2

Texas Instruments

LM3S8733-EQC50-A2 by Texas Instruments

LM3S8733-EQC50-A2 by Texas Instruments is a 32-bit microcontroller with 131072 ROM words and 65536 RAM bytes. It operates at a max clock frequency of 8.192 MHz, suitable for industrial applications requiring high-speed processing and ADC channels for analog signal conversion. The compact square package with gull wing terminals makes it ideal for space-constrained designs in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,384 parts In-Stock

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5,384

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Digiode

USA . 3,517 parts In-Stock

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3,517

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Distributors (Availability)

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AZTECH Wire

Italy . 657 parts In-Stock

1+ parts

$6.566

100+ parts

-

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657

$6.566

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One Stop Electronics

USA . 1,343 parts In-Stock

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$13.000

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-

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1,343

$13.000

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Parana Technologies

USA . 2,349 parts In-Stock

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$32.551

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$107.713

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2,349

$32.551

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$107.713

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DigiPath Technology Company

USA . 205 parts In-Stock

1+ parts

$35.843

100+ parts

$32.975

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205

$35.843

$32.975

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IDEA Electronic Components Group

UK . 469 parts In-Stock

1+ parts

$36.574

100+ parts

$34.745

1k+ parts

$32.917

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469

$36.574

$34.745

$32.917

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ChromeModa Solutions

Germany . 213 parts In-Stock

1+ parts

$36.574

100+ parts

$29.991

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213

$36.574

$29.991

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Corphita

USA . 4,187 parts In-Stock

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4,187

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Microchip USA

USA . 335 parts In-Stock

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335

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Overview

Unlock endless possibilities with the Texas Instruments LM3S8733-EQC50-A2 microcontroller. Manufactured with the highest quality standards, this device offers unparalleled performance and reliability. Ideal for a wide range of applications, this microcontroller provides customers with the value and benefits they need to bring their projects to life. Experience the advantages of cutting-edge technology in a compact package. Choose Texas Instruments for superior quality and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, ensuring long-lasting performance.

Surface Mount: YES

Surface mounting makes it easy to integrate the microcontroller onto circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 2.75 V

The maximum supply voltage of 2.75V allows for efficient power usage and prevents the risk of overloading the microcontroller.

Package Shape: SQUARE

The square package shape is standardized and easy to work with for designers and manufacturers.

Bit Size: 32

A 32-bit architecture provides high processing power and capability for complex applications.

Power Supplies (V): 2.5,3.3

The availability of multiple power supply options allows for flexibility in different operating environments.

Package Style (Meter): FLATPACK

The flatpack style saves space and allows for efficient layout on circuit boards.

Minimum Supply Voltage: 2.25 V

The minimum supply voltage of 2.25V ensures reliable operation even under low power conditions.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, this microcontroller can withstand harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures functionality in a wide range of temperature environments.

ADC Channels: YES

The presence of ADC channels allows for analog signal processing and interfacing with various sensors.

Terminal Position: QUAD

The quad terminal position provides stable and secure connections for I/O applications.

ROM Words: 131072

With a large ROM capacity, this microcontroller can store a significant amount of program data and instructions.

Maximum Seated Height: 1.6 mm

The low seated height allows for compact design and space efficiency in electronic devices.

Width: 14 mm

The compact width of 14mm enables easy integration into small electronic devices and circuit boards.

Maximum Clock Frequency: 8.192 MHz

The high maximum clock frequency allows for fast and efficient processing of data and instructions.

Length: 14 mm

The short length of 14mm contributes to the overall compactness and versatility of this microcontroller.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in demanding industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of this microcontroller provides high performance and efficiency in processing tasks.

RAM Bytes: 65536

With a large RAM capacity, this microcontroller can handle multiple tasks and data processing efficiently.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this microcontroller energy-efficient and reliable.

Terminal Form: GULL WING

The gull wing terminal form provides secure and reliable connections for I/O applications.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage of 2.5V ensures stable and efficient power supply for the microcontroller.

PWM Channels: YES

The presence of PWM channels enables precise control of analog signals and motor speeds.

ROM Programmability: FLASH

Flash programmability allows for easy and quick updates of firmware and software on the microcontroller.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm allows for high-density mounting and space-saving on circuit boards.

Speed: 50 rpm

With a speed of 50rpm, this microcontroller is suitable for a wide range of real-time control applications.

No. of I/O Lines: 35

The 35 I/O lines provide ample connectivity options for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers LM3S8733-EQC50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

8.192 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

35

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S8733-EQC50-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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