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LM3S8730-EQC50-A2T

Texas Instruments

LM3S8730-EQC50-A2T by Texas Instruments

Texas Instruments LM3S8730-EQC50-A2T is a 32-bit microcontroller with 131072 ROM words and 65536 RAM bytes. Operating at up to 8.192 MHz, it features 32 I/O lines, PWM channels, and ADC channels for industrial applications requiring high-speed processing in a compact package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,682 parts In-Stock

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8,682

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Digiode

USA . 4,257 parts In-Stock

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4,257

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Distributors (Availability)

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AZTECH Wire

Italy . 477 parts In-Stock

1+ parts

$9.805

100+ parts

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477

$9.805

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One Stop Electronics

USA . 1,363 parts In-Stock

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$18.000

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1,363

$18.000

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Parana Technologies

USA . 1,234 parts In-Stock

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$63.892

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1,234

$63.892

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ChromeModa Solutions

Germany . 3,358 parts In-Stock

1+ parts

$71.789

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$58.867

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3,358

$71.789

$58.867

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IDEA Electronic Components Group

UK . 415 parts In-Stock

1+ parts

$71.789

100+ parts

$68.200

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$64.610

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415

$71.789

$68.200

$64.610

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DigiPath Technology Company

USA . 1,952 parts In-Stock

1+ parts

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$64.725

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1,952

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$64.725

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Corphita

USA . 1,473 parts In-Stock

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1,473

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Microchip USA

USA . 153 parts In-Stock

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Overview

Experience the cutting-edge technology of Texas Instruments with the LM3S8730-EQC50-A2T microcontroller. Designed with precision and reliability in mind, this powerful device offers endless possibilities for a variety of applications. Whether you're looking to enhance your industrial processes, create innovative consumer electronics, or develop smart home devices, this microcontroller delivers unmatched performance and efficiency. Trust in Texas Instruments to provide you with the tools you need to bring your ideas to life and stay ahead of the competition. Upgrade to the LM3S8730-EQC50-A2T and unlock the full potential of your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY provides durability and protection for the microcontroller, ensuring it can withstand various environmental conditions.

Surface Mount: YES

Surface mount technology makes the microcontroller easy to integrate into PCB designs, saving space and simplifying assembly.

Maximum Supply Voltage: 2.75 V

The limited maximum supply voltage helps in preventing overvoltage situations and ensures safe operation of the microcontroller.

Package Shape: SQUARE

The square package shape allows for efficient use of board space and makes it easier to place the microcontroller within a design.

Bit Size: 32

32-bit architecture provides enhanced processing power and efficiency for handling complex tasks and calculations.

Power Supplies (V): 2.5,3.3

The availability of multiple power supply options allows flexibility in powering the microcontroller, catering to different design requirements.

No. of Terminals: 100

Having a high number of terminals enables connectivity to various external components and peripherals for expanded functionality.

Minimum Supply Voltage: 2.25 V

The low minimum supply voltage ensures that the microcontroller can operate efficiently even in low-power scenarios, conserving energy.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature range allows the microcontroller to function reliably in industrial environments with elevated temperatures.

Minimum Operating Temperature: -40 °C

The wide minimum operating temperature range ensures the microcontroller can operate in harsh conditions with extreme cold temperatures.

ADC Channels: YES

The presence of ADC channels enables the microcontroller to interface with analog sensors and signals, expanding its range of applications.

Terminal Position: QUAD

Quad terminal position allows for easy soldering and connection of the microcontroller to the PCB, simplifying the assembly process.

ROM Words: 131072

Large ROM capacity of 131072 words allows for storing extensive program code and data, supporting complex software applications.

Maximum Seated Height: 1.6 mm

Low maximum seated height ensures the microcontroller can be used in compact designs and slim form factor products.

Width: 14 mm

Compact width of 14mm enables the microcontroller to fit into tight spaces and be integrated into small devices or systems.

Maximum Clock Frequency: 8.192 MHz

High maximum clock frequency of 8.192 MHz provides fast processing speed and real-time responsiveness for applications requiring quick data handling.

Length: 14 mm

Having a length of 14mm allows for uniform and symmetrical placement of the microcontroller within the PCB layout, ensuring an organized design.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in rugged environments and manufacturing settings where temperature variations are common.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture in a microcontroller design offers high performance, reduced power consumption, and efficient code execution for faster processing.

RAM Bytes: 65536

With 65536 bytes of RAM, the microcontroller can efficiently store and retrieve data during operation, supporting multitasking and memory-intensive applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in noisy environments.

Terminal Form: GULL WING

Gull wing terminal form enhances solder joint strength and reliability, ensuring secure connections and long-term performance of the microcontroller.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage of 2.5V ensures consistent and reliable power delivery to the microcontroller for smooth operation.

PWM Channels: YES

The presence of PWM channels allows for accurate control of motor speeds, LED brightness, and other analog outputs, enhancing the microcontroller's versatility.

ROM Programmability: FLASH

Flash ROM programmability enables easy reprogramming of the microcontroller, facilitating firmware updates and customization without requiring special equipment.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm enables high-density mounting of the microcontroller on the PCB, maximizing space efficiency and component density.

Speed: 50 rpm

The speed of 50 rpm indicates the rotational speed of the microcontroller, which can be crucial for applications involving motor control or rotation sensing.

No. of I/O Lines: 32

Having 32 I/O lines allows the microcontroller to interact with a wide range of external devices and peripherals, enabling extensive connectivity and functionality.

Technical Specifications

Microcontrollers LM3S8730-EQC50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

8.192 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

32

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S8730-EQC50-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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