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LM3S8630-EQC50-A2

Texas Instruments

LM3S8630-EQC50-A2 by Texas Instruments

LM3S8630-EQC50-A2 by Texas Instruments is a 32-bit microcontroller with 131072 ROM words and 32768 RAM bytes. It operates at a max clock frequency of 8.192 MHz, suitable for industrial applications requiring PWM channels and ADC functionality. With a package style of FLATPACK and terminal pitch of 0.5 mm, it offers compact design options for various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,808 parts In-Stock

1+ parts

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3,808

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Digiode

USA . 3,505 parts In-Stock

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3,505

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 831 parts In-Stock

1+ parts

$13.000

100+ parts

-

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831

$13.000

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AZTECH Wire

Italy . 552 parts In-Stock

1+ parts

$17.294

100+ parts

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552

$17.294

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Parana Technologies

USA . 1,862 parts In-Stock

1+ parts

$47.247

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1,862

$47.247

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DigiPath Technology Company

USA . 2,311 parts In-Stock

1+ parts

$52.025

100+ parts

$47.863

1k+ parts

-

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2,311

$52.025

$47.863

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ChromeModa Solutions

Germany . 6,467 parts In-Stock

1+ parts

$53.087

100+ parts

$43.531

1k+ parts

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6,467

$53.087

$43.531

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IDEA Electronic Components Group

UK . 1,243 parts In-Stock

1+ parts

$53.087

100+ parts

$50.433

1k+ parts

$47.778

10k+ parts

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1,243

$53.087

$50.433

$47.778

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Corphita

USA . 1,953 parts In-Stock

1+ parts

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1,953

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Microchip USA

USA . 322 parts In-Stock

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322

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Overview

Unlock the power of innovation with the LM3S8630-EQC50-A2 by Texas Instruments, a top-of-the-line microcontroller that boasts unparalleled quality and reliability. Manufactured by a trusted industry leader, this versatile device is perfect for a wide range of applications in various industries. From automation to IoT, this microcontroller offers exceptional value, providing customers with cutting-edge technology and unmatched performance. Experience the advantages of seamless integration, high-speed processing, and efficient power management. Upgrade your projects today with the LM3S8630-EQC50-A2 and revolutionize the way you work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy body material provides durability and helps protect the internal components of the microcontroller.

Surface Mount: YES

Surface mount design allows for easy installation on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 2.75 V

Operates at a low maximum supply voltage, making it energy efficient and suitable for battery-powered applications.

Package Shape: SQUARE

Square package shape makes it easier to mount securely on a PCB and ensures efficient use of space.

Bit Size: 32

32-bit architecture provides high performance and processing capabilities for complex applications.

Power Supplies (V): 2.5,3.3

Supports multiple power supply options, offering flexibility in design and compatibility with various systems.

No. of Terminals: 100

Plenty of terminals allow for versatile connectivity options and integration with external components.

Package Style (Meter): FLATPACK

Flatpack design enhances thermal performance and allows for efficient heat dissipation.

Minimum Supply Voltage: 2.25 V

Low minimum supply voltage ensures the microcontroller operates reliably even under low power conditions.

Maximum Operating Temperature: 105 °C

High maximum operating temperature makes it suitable for industrial environments with varying temperature conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures the microcontroller can operate in harsh environments and extreme temperatures.

ADC Channels: YES

Built-in ADC channels enable analog signal conversion, expanding the range of applications the microcontroller can be used for.

Terminal Position: QUAD

Quad terminal layout simplifies PCB routing and allows for efficient signal flow between components.

ROM Words: 131072

Large ROM capacity allows for storing a significant amount of program data and code, ideal for complex applications.

Maximum Seated Height: 1.6 mm

Low seated height enables compact and slim designs, suitable for space-constrained applications.

Width: 14 mm

Compact width dimension allows for efficient placement on PCBs and integration into electronic devices.

Maximum Clock Frequency: 8.192 MHz

High clock frequency enables fast operation and high-speed processing, suitable for real-time applications.

Length: 14 mm

Short length dimension saves space on the PCB and allows for flexible placement within electronic devices.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range ensures reliability and performance under rugged operating conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with RISC architecture provides efficient processing, reduced power consumption, and high performance.

RAM Bytes: 32768

Large RAM capacity enables efficient data storage and processing, essential for multitasking and data-intensive applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and high-speed operation, enhancing overall performance.

Terminal Form: GULL WING

Gull wing terminal form offers secure solder connections and reliable electrical contact, ensuring long-term durability.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage ensures consistent and reliable operation of the microcontroller.

PWM Channels: YES

PWM channels enable precise control of connected devices, making the microcontroller suitable for motor control and power management applications.

ROM Programmability: FLASH

Flash ROM programmability allows for easy firmware updates and modifications, enhancing product flexibility and future-proofing capabilities.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density mounting on the PCB, maximizing space utilization and allowing for compact designs.

Speed: 50 rpm

Operates at a speed of 50rpm, suitable for various applications requiring precise timing and control.

No. of I/O Lines: 31

Sufficient I/O lines allow for versatile connectivity and communication with external devices, expanding the microcontroller's capabilities.

Technical Specifications

Microcontrollers LM3S8630-EQC50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

8.192 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

31

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S8630-EQC50-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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