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LM3S828-IGZ50-C2T

Texas Instruments

LM3S828-IGZ50-C2T by Texas Instruments

LM3S828-IGZ50-C2T by Texas Instruments is a 32-bit microcontroller with 48 terminals, 8192 bytes of RAM, and 65536 ROM words. It operates at a max clock frequency of 0.032 MHz and is suitable for industrial applications requiring a microcontroller with PWM channels and ADC capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,065 parts In-Stock

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Digiode

USA . 507 parts In-Stock

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507

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One Stop Electronics

USA . 1,332 parts In-Stock

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$2.000

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1,332

$2.000

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AZTECH Wire

Italy . 882 parts In-Stock

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$16.690

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882

$16.690

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Parana Technologies

USA . 1,072 parts In-Stock

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$53.058

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DigiPath Technology Company

USA . 2,086 parts In-Stock

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$58.424

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ChromeModa Solutions

Germany . 3,635 parts In-Stock

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$59.616

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$48.885

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3,635

$59.616

$48.885

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IDEA Electronic Components Group

UK . 353 parts In-Stock

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$59.616

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$56.635

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$53.654

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353

$59.616

$56.635

$53.654

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Microchip USA

USA . 3,790 parts In-Stock

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Corphita

USA . 402 parts In-Stock

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Overview

Unlock a world of possibilities with the LM3S828-IGZ50-C2T by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers unparalleled quality and reliability. This microcontroller is perfect for a wide range of applications, offering customers the value and benefits they need to succeed. Whether you're looking to enhance your automation system or improve your IoT device, the LM3S828-IGZ50-C2T has you covered. Experience advanced technology at your fingertips with this powerful microcontroller.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and convenient mounting onto circuit boards, saving space and making assembly more efficient.

Maximum Supply Voltage: 3.6 V

Ability to operate at a maximum supply voltage of 3.6V provides flexibility in power supply options and compatibility with various systems.

Package Shape: SQUARE

Square package shape helps in easy orientation and alignment during installation and PCB design.

Bit Size: 32

32-bit architecture allows for handling more complex calculations and processing tasks efficiently.

Power Supplies (V): 3.3

Stable power supply at 3.3V ensures reliable and consistent performance of the microcontroller.

No. of Terminals: 48

Having 48 terminals allows for multiple connections and interfacing with external devices, expanding the functionality of the microcontroller.

Package Style (Meter): CHIP CARRIER

Chip carrier package style provides protection and durability to the microcontroller, making it suitable for various environments.

Minimum Supply Voltage: 3 V

The ability to operate at a minimum supply voltage of 3V ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance makes the microcontroller suitable for industrial applications where heat may be a concern.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature tolerance allows the microcontroller to function in cold environments without any issues.

ADC Channels: YES

Analog-to-digital converter channels enable the microcontroller to interface with analog sensors and devices, adding versatility to its applications.

Terminal Position: QUAD

Quad terminal position provides a stable and secure connection interface, reducing the chances of signal interference or loss.

ROM Words: 65536

Large ROM capacity of 65536 words allows for storing extensive program data and instructions for the microcontroller to execute complex tasks.

Maximum Seated Height: 1 mm

Low maximum seated height makes the microcontroller suitable for compact and slim devices, saving space in the overall design.

Width: 6.875 mm

Narrow width of 6.875mm facilitates compact PCB layout and integration into space-constrained applications.

Maximum Clock Frequency: 0.032 MHz

High maximum clock frequency of 0.032 MHz enables fast processing and execution of instructions, improving overall performance.

Length: 6.875 mm

Compact length of 6.875mm complements the narrow width, making the microcontroller ideal for small form factor designs.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh environmental conditions commonly found in industrial settings.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture of the microcontroller's peripheral IC type enhances computational efficiency and speed, making it suitable for high-performance applications.

RAM Bytes: 8192

Ample RAM capacity of 8192 bytes enables efficient data processing and storage during program execution, enhancing the microcontroller's performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to the overall energy efficiency and reliability of the microcontroller.

Terminal Form: NO LEAD

No lead terminal form simplifies soldering and connection processes, reducing assembly time and ensuring secure electrical connections.

Maximum Supply Current: 110 mA

Moderate maximum supply current of 110mA strikes a balance between power consumption and performance, making the microcontroller energy-efficient.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage of 3.3V ensures consistent and reliable operation of the microcontroller under varying load conditions.

PWM Channels: YES

Pulse-width modulation channels enable precise control over output signals, making the microcontroller suitable for applications requiring accurate voltage or signal modulation.

ROM Programmability: FLASH

Flash ROM programmability allows for easy reprogramming of the microcontroller, facilitating firmware updates and customization as per user requirements.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm enables high-density mounting on PCBs, optimizing space utilization and enhancing design flexibility.

Speed: 50 rpm

Operating speed of 50 rpm ensures efficient processing of tasks and data, making the microcontroller suitable for applications that require quick response times.

No. of I/O Lines: 28

Having 28 I/O lines provides ample connectivity options for interfacing with external devices and peripherals, expanding the functionality and versatility of the microcontroller.

Technical Specifications

Microcontrollers LM3S828-IGZ50-C2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N48

Length:

6.875 mm

No. of I/O Lines:

28

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

110 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.875 mm

Peripheral IC Type:

Trade Compliance

LM3S828-IGZ50-C2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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