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LM3S828-EQN50-C2T

Texas Instruments

LM3S828-EQN50-C2T by Texas Instruments

Texas Instruments' LM3S828-EQN50-C2T is a 32-bit microcontroller with 65536 ROM words and 8192 RAM bytes. Operating at up to 0.032 MHz, it features 28 I/O lines, PWM channels, and ADC channels. Ideal for industrial applications requiring a reliable RISC-based microcontroller with a max clock frequency of 0.032 MHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,543 parts In-Stock

1+ parts

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3,543

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Digiode

USA . 421 parts In-Stock

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421

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,605 parts In-Stock

1+ parts

$14.000

100+ parts

-

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1,605

$14.000

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AZTECH Wire

Italy . 291 parts In-Stock

1+ parts

$14.838

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291

$14.838

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Parana Technologies

USA . 635 parts In-Stock

1+ parts

$38.744

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635

$38.744

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DigiPath Technology Company

USA . 2,006 parts In-Stock

1+ parts

$42.662

100+ parts

$39.249

1k+ parts

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2,006

$42.662

$39.249

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ChromeModa Solutions

Germany . 2,544 parts In-Stock

1+ parts

$43.533

100+ parts

$35.697

1k+ parts

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2,544

$43.533

$35.697

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IDEA Electronic Components Group

UK . 1,341 parts In-Stock

1+ parts

$43.533

100+ parts

$41.356

1k+ parts

$39.180

10k+ parts

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1,341

$43.533

$41.356

$39.180

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Corphita

USA . 3,822 parts In-Stock

1+ parts

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3,822

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Microchip USA

USA . 421 parts In-Stock

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421

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Overview

Unlock endless possibilities with the LM3S828-EQN50-C2T microcontroller from Texas Instruments, offering unparalleled quality and reliability. Designed for various applications, this powerful device boasts a 32-bit architecture and an impressive array of features, including ADC channels, PWM channels, and a wide operating temperature range. With Texas Instruments' reputation for excellence, you can trust that this microcontroller will deliver superior performance and efficiency. Embrace innovation and streamline your projects with the LM3S828-EQN50-C2T today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package body material makes the microcontroller lightweight and durable, ensuring reliable performance in various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on printed circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage of 3.6V provides flexibility in power supply options and compatibility with a wide range of systems.

Package Shape: SQUARE

Square package shape offers uniformity in design and easy integration into electronic systems and devices.

Bit Size: 32

32-bit architecture enables higher processing capabilities and performance compared to lower bit microcontrollers.

Power Supplies (V): 3.3

Operating at a nominal supply voltage of 3.3V ensures compatibility with common power sources and efficient power consumption.

No. of Terminals: 48

Having 48 terminals allows for versatile connectivity options and interface capabilities with external components and peripherals.

Package Style (Meter): FLATPACK

Flatpack package style offers a compact form factor, ideal for space-constrained applications where size and weight are crucial factors.

Minimum Supply Voltage: 3 V

With a low minimum supply voltage of 3V, the microcontroller can operate efficiently even in power-constrained environments.

Maximum Operating Temperature: 105 °C

High maximum operating temperature of 105°C ensures reliability and performance in harsh environmental conditions or industrial settings.

Minimum Operating Temperature: -40 °C

Having a minimum operating temperature of -40°C allows the microcontroller to function reliably in extreme cold conditions without performance degradation.

ADC Channels: YES

Integrated ADC channels enable analog-to-digital conversion, providing versatile input options and sensor interfacing capabilities for a wide range of applications.

Terminal Position: QUAD

Quad terminal position offers a balanced layout for easy PCB routing, signal integrity, and robust connection with external devices.

ROM Words: 65536

Large ROM size of 65536 words allows for ample program storage capacity, accommodating complex applications and firmware.

Maximum Seated Height: 1.6 mm

Low maximum seated height of 1.6mm ensures compatibility with slim-profile designs and minimizes the overall height of the microcontroller assembly.

Width: 7 mm

Compact width of 7mm facilitates space-saving PCB layouts and enables integration into small form factor electronic devices.

Maximum Clock Frequency: 0.032 MHz

High maximum clock frequency of 0.032MHz allows for fast and efficient processing of instructions and data, ensuring high-speed performance.

Length: 7 mm

Compact length of 7mm enables compact and space-efficient board layouts, suitable for applications with size constraints.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in harsh environments and industrial applications where temperature fluctuations are common.

Peripheral IC Type: MICROCONTROLLER, RISC

Featuring RISC architecture, the microcontroller delivers efficient performance, low power consumption, and streamlined instruction execution for optimal operation.

RAM Bytes: 8192

Ample RAM capacity of 8192 bytes provides sufficient memory for data storage, variable processing, and temporary workspace, enhancing computational capabilities.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and efficient operation, making the microcontroller suitable for battery-operated devices and energy-efficient applications.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering, robust mechanical connections, and efficient heat dissipation, ensuring reliable electrical connections in various operating conditions.

Maximum Supply Current: 110 mA

With a maximum supply current of 110mA, the microcontroller operates efficiently within specified power limits, ensuring stable performance and preventing overheating.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3V, the microcontroller delivers consistent performance and compatibility with standard power sources for reliable operation.

PWM Channels: YES

Providing PWM channels enables precise control of motor speed, LED brightness, and analog signal modulation, enhancing versatility and functionality in various applications.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and convenient firmware updates, code modifications, and customizations, ensuring flexibility and adaptability to changing application requirements.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm facilitates high-density board designs, minimizes signal crosstalk, and enables robust electrical connections, enhancing reliability and performance.

Speed: 50 rpm

Operating at a speed of 50 rpm enables fast data processing, efficient task execution, and real-time performance, making the microcontroller suitable for time-critical applications and high-speed requirements.

No. of I/O Lines: 28

Having 28 I/O lines provides versatile input/output capabilities, enabling connection with external sensors, actuators, and communication interfaces for enhanced functionality and integration.

Technical Specifications

Microcontrollers LM3S828-EQN50-C2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

No. of I/O Lines:

28

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

110 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Trade Compliance

LM3S828-EQN50-C2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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