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LM3S818-IQN50-C2

Texas Instruments

LM3S818-IQN50-C2 by Texas Instruments

Texas Instruments LM3S818-IQN50-C2 microcontroller features 32-bit Cortex-M3 CPU, 8KB RAM, and 6-channel 10-bit ADC. Ideal for industrial applications requiring low power consumption, it offers PWM, QEI, and UART connectivity with a max clock frequency of 8MHz.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 7,803 parts In-Stock

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Digiode

USA . 476 parts In-Stock

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476

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Chip Stock

USA . 294 parts In-Stock

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294

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One Stop Electronics

USA . 449 parts In-Stock

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$4.000

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449

$4.000

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AZTECH Wire

Italy . 189 parts In-Stock

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$17.726

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Parana Technologies

USA . 1,533 parts In-Stock

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$43.590

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DigiPath Technology Company

USA . 601 parts In-Stock

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$47.997

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IDEA Electronic Components Group

UK . 2,026 parts In-Stock

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$48.977

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$46.528

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$44.079

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2,026

$48.977

$46.528

$44.079

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ChromeModa Solutions

Germany . 166 parts In-Stock

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$48.977

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$40.161

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Corphita

USA . 4,991 parts In-Stock

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Authorized Procurement Solutions

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Kepictronics

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A-Z Elektronik GmbH

Germany . 345 parts In-Stock

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Overview

Unlock the power of innovation with the LM3S818-IQN50-C2 microcontroller by Texas Instruments. Built with precision and expertise, this device offers unparalleled performance and reliability for a wide range of applications. From industrial automation to consumer electronics, this microcontroller provides seamless connectivity and cutting-edge features that will elevate your projects to new heights. Experience the difference with Texas Instruments and revolutionize your designs today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the microcontroller, ensuring it can withstand various environmental conditions.

Integrated Cache: YES

The integrated cache helps improve the microcontroller's performance by storing frequently accessed data, reducing latency and improving overall processing speeds.

Maximum Supply Voltage: 3.6 V

Operating within a maximum supply voltage of 3.6V ensures efficient power consumption and prevents damage from voltage spikes.

On Chip Data RAM Width: 8

Having a wide on-chip data RAM width of 8 bits allows for faster data processing and efficient memory management.

Package Shape: SQUARE

The square package shape is compact and allows for easy integration into various electronic devices and circuit boards.

Bit Size: 32

A 32-bit architecture provides the microcontroller with high computational power and supports complex algorithms and calculations.

Power Supplies (V): 3.3

Operating at 3.3V nominal supply voltage ensures compatibility with a wide range of electronic systems and devices.

No. of Terminals: 48

Having 48 terminals provides ample connectivity options for peripherals and external components, making the microcontroller versatile in different applications.

Package Style (Meter): FLATPACK

The flatpack package style offers a low profile design, making it suitable for space-constrained applications where height is a concern.

Minimum Supply Voltage: 3 V

Operating at a minimum supply voltage of 3V ensures reliable performance even under low power conditions, extending the microcontroller's operational range.

CPU Family: CORTEX-M3

Being part of the Cortex-M3 CPU family provides the microcontroller with a powerful and efficient instruction set architecture, enabling high-performance computing.

Minimum Operating Temperature: -40 °C

Operating at a minimum temperature of -40°C ensures the microcontroller can function in extreme cold environments without compromising performance.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish offers excellent corrosion resistance and ensures reliable electrical connections for long-term use.

ADC Channels: YES

Having ADC channels allows the microcontroller to interface with analog sensors and devices, enabling it to convert analog signals into digital data for processing.

Terminal Position: QUAD

The quad terminal position provides a secure and stable mounting configuration, enhancing the overall reliability of the microcontroller in harsh operating conditions.

ROM Words: 65536

With a ROM size of 65536 words, the microcontroller can store a large amount of program data, enabling complex algorithms and extensive program storage.

Maximum Seated Height: 1.6 mm

The maximum seated height of 1.6mm ensures a compact footprint, making the microcontroller suitable for applications where space constraints are a concern.

Width: 7 mm

With a width of 7mm, the microcontroller can be easily integrated into tight spaces or small electronic devices without sacrificing performance.

Boundary Scan: YES

Boundary scan support allows for efficient testing and debugging of the microcontroller during the manufacturing and development process, ensuring high reliability and quality.

Peripherals: PWM(6), QEI, TIMER(3), WDT

Having multiple peripherals such as PWM, QEI, timers, and watchdog timer enhances the microcontroller's capabilities and flexibility for various applications.

Maximum Clock Frequency: 8 MHz

Operating at a maximum clock frequency of 8MHz provides the microcontroller with fast processing speeds, enabling quick execution of instructions and tasks.

Technical Specifications

Microcontrollers LM3S818-IQN50-C2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

30

No. of Serial I/Os:

3

No. of Terminals:

48

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

110 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SSI, UART(2)

Peripherals:

PWM(6), QEI, TIMER(3), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

LM3S818-IQN50-C2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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