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LM3S817-IQN50-C2

Texas Instruments

LM3S817-IQN50-C2 by Texas Instruments

Texas Instruments' LM3S817-IQN50-C2 microcontroller features a 32-bit Cortex-M3 CPU, 8192 bytes of RAM, and 6-channel 10-bit ADC for industrial applications. With a max clock frequency of 0.032 MHz and peripherals like PWM(6) and TIMER(3), it offers low power mode with a supply voltage range of 3-3.6 V.

Median Price

$19.040

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 146 parts In-Stock

1+ parts

$19.040

100+ parts

$12.220

1k+ parts

$10.270

10k+ parts

-

146

$19.040

$12.220

$10.270

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 739 parts In-Stock

1+ parts

$12.312

100+ parts

-

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-

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739

$12.312

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Vyrian

USA . 8,946 parts In-Stock

1+ parts

-

100+ parts

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8,946

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,582 parts In-Stock

1+ parts

$11.664

100+ parts

-

1k+ parts

-

10k+ parts

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4,582

$11.664

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-

-

Component Stockers USA

USA . 429 parts In-Stock

1+ parts

$12.060

100+ parts

$9.360

1k+ parts

-

10k+ parts

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429

$12.060

$9.360

-

-

Microchip USA

USA . 189 parts In-Stock

1+ parts

$36.990

100+ parts

$36.720

1k+ parts

$36.720

10k+ parts

$36.460

189

$36.990

$36.720

$36.720

$36.460

Parana Technologies

USA . 1,138 parts In-Stock

1+ parts

$63.083

100+ parts

-

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-

10k+ parts

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1,138

$63.083

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DigiPath Technology Company

USA . 2,056 parts In-Stock

1+ parts

$69.462

100+ parts

-

1k+ parts

-

10k+ parts

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2,056

$69.462

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ChromeModa Solutions

Germany . 4,310 parts In-Stock

1+ parts

$70.880

100+ parts

$58.122

1k+ parts

-

10k+ parts

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4,310

$70.880

$58.122

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IDEA Electronic Components Group

UK . 1,234 parts In-Stock

1+ parts

$70.880

100+ parts

$67.336

1k+ parts

$63.792

10k+ parts

-

1,234

$70.880

$67.336

$63.792

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A-Z Elektronik GmbH

Germany . 4,398 parts In-Stock

1+ parts

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4,398

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Alle Elektronik GmbH

Germany . 2,311 parts In-Stock

1+ parts

-

100+ parts

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2,311

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Perfect Parts

USA . 392 parts In-Stock

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392

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Kepictronics

USA . 275 parts In-Stock

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275

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Overview

Unlock the power of innovation with the LM3S817-IQN50-C2 by Texas Instruments, a cutting-edge microcontroller designed to exceed your expectations. Crafted with precision by a trusted manufacturer, this device offers unparalleled quality and reliability in a wide range of applications. From industrial automation to consumer electronics, this versatile microcontroller delivers superior performance, efficiency, and functionality. Experience seamless connectivity, advanced features, and low power consumption, all in a compact and durable package. Embrace the future of technology with the LM3S817-IQN50-C2 and revolutionize your projects today.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, making this product suitable for mass production and integration into various devices.

Screening Level: TS 16949

Compliance with TS 16949 screening level ensures high quality and reliability of the product, making it a trustworthy choice for telecom applications.

Package Shape: RECTANGULAR

Rectangular package shape enables efficient use of space on circuit boards, facilitating compact designs and saving valuable real estate in electronic devices.

Package Style (Meter): MICROELECTRONIC ASSEMBLY

Microelectronic assembly package style indicates precise and compact construction, ideal for telecom interface ICs that require high density packaging for optimal performance.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this telecom interface IC is suitable for industrial environments with elevated temperatures, ensuring reliable operation under challenging conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows this product to function effectively in a wide range of environments, making it versatile and suitable for various applications.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3V ensures compatibility with standard power sources, making integration into existing systems convenient and seamless.

Data Rate: 0.0086 Mbps

The data rate of 0.0086 Mbps is suitable for telecom applications that require moderate-speed data transmission, making this product well-suited for communication and networking equipment.

Technical Specifications

Microcontrollers LM3S817-IQN50-C2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

30

No. of Serial I/Os:

3

No. of Terminals:

48

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

110 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SSI, UART(2)

Peripherals:

PWM(6), TIMER(3), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

LM3S817-IQN50-C2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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