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LM3S817-EQN50-C2T

Texas Instruments

LM3S817-EQN50-C2T by Texas Instruments

LM3S817-EQN50-C2T by Texas Instruments is a 32-bit microcontroller with 48 terminals, operating at up to 0.032 MHz. It features 8192 bytes of RAM, 65536 ROM words, and ADC channels for industrial applications requiring a power supply of 3.3V and temperature range from -40 to 105°C.

Median Price

-

Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 9,318 parts In-Stock

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Digiode

USA . 1,186 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 399 parts In-Stock

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$7.726

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One Stop Electronics

USA . 1,199 parts In-Stock

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$13.000

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Parana Technologies

USA . 777 parts In-Stock

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$64.849

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DigiPath Technology Company

USA . 1,988 parts In-Stock

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$71.407

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$65.694

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ChromeModa Solutions

Germany . 4,551 parts In-Stock

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$72.864

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$59.748

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IDEA Electronic Components Group

UK . 1,603 parts In-Stock

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$69.221

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$65.578

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QUARKTWIN TECHNOLOGY LTD

USA . 6,361 parts In-Stock

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Corphita

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Microchip USA

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Overview

Elevate your projects with the LM3S817-EQN50-C2T by Texas Instruments, a top-tier microcontroller designed to deliver exceptional performance and reliability. Crafted by the renowned manufacturer, this powerful device boasts cutting-edge technology and a wide range of applications in various industries. With its advanced features and innovative design, this microcontroller offers immense value and benefits to customers looking for seamless integration, high-speed processing, and efficient power management. Experience the next level of control and precision with the LM3S817-EQN50-C2T.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and thermal stability, ensuring reliable performance in various environments.

Surface Mount: YES

Surface mount technology simplifies the manufacturing process and allows for compact designs, saving space in electronic devices.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage gives flexibility in power input options and can support a wider range of applications.

Package Shape: SQUARE

Square package shape facilitates easy integration into circuit layouts and provides uniform distribution of components.

Bit Size: 32

32-bit architecture enables high computational power and performance for running complex algorithms and processing data efficiently.

Power Supplies (V): 3.3

Stable 3.3V power supply ensures consistent and reliable operation of the microcontroller without fluctuations or voltage drops.

No. of Terminals: 48

Having 48 terminals allows for versatile connectivity options and integration with various external devices for expanded functionality.

Package Style (Meter): FLATPACK

Flatpack package style offers a low-profile design, making it suitable for space-constrained applications and providing efficient heat dissipation.

Minimum Operating Temperature: -40 °C

Wide temperature range from -40°C to 105°C ensures reliable operation in both extreme cold and hot environments.

ADC Channels: YES

Analog-to-digital converter (ADC) channels enable the microcontroller to interface with analog sensors and signals, expanding its input capabilities.

ROM Words: 65536

Large ROM capacity of 65536 words allows for storing complex programs and data, providing ample memory for diverse applications.

RAM Bytes: 8192

Ample RAM capacity of 8192 bytes facilitates efficient data processing and temporary storage, enabling smooth multitasking and program execution.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in noisy environments.

Terminal Form: GULL WING

Gull wing terminal form provides secure soldering connections and ease of assembly during PCB manufacturing, ensuring stable electrical connections.

Maximum Clock Frequency: 0.032 MHz

High maximum clock frequency of 0.032 MHz allows for fast data processing and execution speeds, enhancing overall performance of the microcontroller.

PWM Channels: YES

Pulse width modulation (PWM) channels enable precise control of output signals and motor speed, making the microcontroller suitable for applications requiring accurate pulse control.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and fast firmware updates, making it convenient to adapt to changing requirements and enhancements.

No. of I/O Lines: 30

Having 30 I/O lines provides flexibility for connecting to a variety of external devices and peripherals, expanding the microcontroller's interfacing capabilities.

Technical Specifications

Microcontrollers LM3S817-EQN50-C2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

No. of I/O Lines:

30

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

110 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Trade Compliance

LM3S817-EQN50-C2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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