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LM3S817-EQN50-C2

Texas Instruments

LM3S817-EQN50-C2 by Texas Instruments

LM3S817-EQN50-C2 by Texas Instruments is a 32-bit microcontroller with 65536 ROM words and 8192 RAM bytes. Operating at a max clock frequency of 0.032 MHz, it is ideal for industrial applications requiring ADC channels and PWM functionality. With a package style of FLATPACK and GULL WING terminal form, this CMOS technology device offers 30 I/O lines and operates in temperatures ranging from -40 to 105 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,186 parts In-Stock

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Digiode

USA . 249 parts In-Stock

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249

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One Stop Electronics

USA . 319 parts In-Stock

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$4.000

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319

$4.000

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AZTECH Wire

Italy . 867 parts In-Stock

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$6.551

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867

$6.551

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Parana Technologies

USA . 290 parts In-Stock

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$28.799

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$51.959

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290

$28.799

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$51.959

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DigiPath Technology Company

USA . 1,874 parts In-Stock

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$31.711

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1,874

$31.711

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ChromeModa Solutions

Germany . 2,545 parts In-Stock

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$32.358

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$26.534

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2,545

$32.358

$26.534

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IDEA Electronic Components Group

UK . 1,842 parts In-Stock

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$32.358

100+ parts

$30.740

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$29.122

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$32.358

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$29.122

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Corphita

USA . 4,284 parts In-Stock

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Microchip USA

USA . 229 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the LM3S817-EQN50-C2 by Texas Instruments. This high-quality microcontroller offers unmatched reliability and precision, making it ideal for a wide range of applications. From industrial automation to consumer electronics, this versatile device delivers exceptional performance at every turn. Experience seamless operation and enhanced functionality with the LM3S817-EQN50-C2, where innovation meets excellence. Elevate your projects and unlock endless possibilities with this top-of-the-line solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material is lightweight, durable, and cost-effective, making the product suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology makes the product easy to mount on PCBs, saving space and enabling automated assembly processes.

Maximum Supply Voltage: 3.6 V

The higher maximum supply voltage allows for flexibility in power supply options and compatibility with various systems.

Package Shape: SQUARE

The square package shape offers a compact footprint, optimizing space utilization on the PCB.

Bit Size: 32

A 32-bit architecture provides enhanced processing power and performance for handling complex tasks and applications efficiently.

Power Supplies (V): 3.3

The stable power supply of 3.3V ensures reliable operation and compatibility with standard power sources.

No. of Terminals: 48

Having 48 terminals allows for connectivity to multiple components and peripherals, increasing the versatility of the product.

Package Style (Meter): FLATPACK

The flatpack package style offers a low profile and efficient heat dissipation, suitable for space-constrained applications.

Minimum Supply Voltage: 3 V

The minimum supply voltage of 3V ensures proper functionality even under low power conditions, enhancing reliability.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature of 105°C, the product can withstand harsh environmental conditions and extended operation.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows for reliable performance in cold environments or during startup conditions.

ADC Channels: YES

The presence of ADC channels enables analog-to-digital conversion, making the product suitable for sensor interfacing and data acquisition applications.

Terminal Position: QUAD

The quad terminal position provides multiple connection points, facilitating easy integration with external devices and peripherals.

ROM Words: 65536

With a ROM size of 65536 words, the product offers ample memory capacity for storing program instructions and data.

Maximum Seated Height: 1.6 mm

The low maximum seated height of 1.6mm minimizes the overall profile of the product, ideal for compact and slim designs.

Width: 7 mm

The 7mm width provides a compact form factor, allowing for efficient use of space on the PCB.

Maximum Clock Frequency: 0.032 MHz

The high maximum clock frequency of 32 MHz enables fast processing speeds and efficient multitasking capabilities.

Length: 7 mm

The 7mm length contributes to the overall compactness of the product, suitable for applications with limited space constraints.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, the product meets the required performance and reliability standards for demanding environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizing RISC architecture, the microcontroller offers efficient processing capabilities and high performance for a wide range of applications.

RAM Bytes: 8192

With 8192 bytes of RAM, the product provides sufficient memory for data storage and manipulation, enhancing operational efficiency.

Technology: CMOS

Utilizing CMOS technology, the product offers low power consumption and high noise immunity, ensuring reliable operation and energy efficiency.

Terminal Form: GULL WING

The gull wing terminal form allows for reliable solder connections and ease of assembly during manufacturing processes.

Maximum Supply Current: 110 mA

The maximum supply current of 110mA ensures stable operation and power efficiency, suitable for a variety of battery-powered applications.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V provides a stable power source for the product, ensuring consistent performance and reliability.

PWM Channels: YES

Having PWM channels allows for precise control of digital signals, making the product ideal for applications requiring accurate modulation and control.

ROM Programmability: FLASH

The use of flash ROM allows for reprogrammability, enabling firmware updates and customization without the need for external programming tools.

Terminal Pitch: 0.5 mm

The narrow terminal pitch of 0.5mm allows for compact PCB layout and high-density integration of components, optimizing space utilization.

Speed: 50 rpm

The speed of 50 rpm enables efficient data processing and system response, making the product suitable for real-time applications and control systems.

No. of I/O Lines: 30

With 30 I/O lines, the product offers versatile connectivity options for interfacing with external devices and peripherals, enhancing functionality.

Technical Specifications

Microcontrollers LM3S817-EQN50-C2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

No. of I/O Lines:

30

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

110 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Trade Compliance

LM3S817-EQN50-C2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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