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LM3S812-IGZ50-C2T

Texas Instruments

LM3S812-IGZ50-C2T by Texas Instruments

Texas Instruments' LM3S812-IGZ50-C2T is a 32-bit microcontroller with 48 terminals, operating at up to 8 MHz. With 8192 bytes of RAM and 65536 ROM words, it's ideal for industrial applications requiring ADC channels and PWM functionality. The chip carrier package style and compact dimensions make it suitable for space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,647 parts In-Stock

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Digiode

USA . 4,386 parts In-Stock

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4,386

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Distributors (Availability)

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One Stop Electronics

USA . 934 parts In-Stock

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$12.000

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934

$12.000

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AZTECH Wire

Italy . 392 parts In-Stock

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$18.038

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392

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Parana Technologies

USA . 293 parts In-Stock

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$67.785

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$67.785

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DigiPath Technology Company

USA . 595 parts In-Stock

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$74.640

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$68.669

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595

$74.640

$68.669

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ChromeModa Solutions

Germany . 4,790 parts In-Stock

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$76.163

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$62.454

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$76.163

$62.454

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IDEA Electronic Components Group

UK . 20 parts In-Stock

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$76.163

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$72.355

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$68.547

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20

$76.163

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$68.547

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Corphita

USA . 2,015 parts In-Stock

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Microchip USA

USA . 1,185 parts In-Stock

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Overview

Elevate your projects with the LM3S812-IGZ50-C2T microcontroller by Texas Instruments. With a powerful 32-bit architecture and industrial-grade temperature tolerance, this chip carrier package offers unmatched reliability and performance. Ideal for a wide range of applications, from automation to robotics, this microcontroller boasts 34 I/O lines and 8192 bytes of RAM to tackle any task with ease. Trust in Texas Instruments' reputation for quality and innovation, and experience the value and benefits this microcontroller brings to your designs.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy mounting on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

Wide voltage range allows for compatibility with various power sources.

Package Shape: SQUARE

Square package shape is typically easier to handle and design around.

Bit Size: 32

Generous bit size for processing capabilities.

Power Supplies (V): 3.3

Standard power supply voltage for many applications.

No. of Terminals: 48

Sufficient number of terminals for connecting to peripherals and external components.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers good heat dissipation and compact size.

Minimum Supply Voltage: 3 V

Low minimum supply voltage for energy efficiency.

Maximum Operating Temperature: 85 °C

High maximum operating temperature suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Wide temperature range for operation in various environments.

ADC Channels: YES

Built-in ADC channels for analog input processing.

Terminal Position: QUAD

Quad terminal position for secure connections.

ROM Words: 65536

Large ROM capacity for storing program data.

Maximum Seated Height: 1 mm

Low profile design for space-constrained applications.

Width: 6.875 mm

Compact width for fitting into tight spaces.

Maximum Clock Frequency: 8 MHz

Fast clock frequency for rapid processing.

Length: 6.875 mm

Compact length for space-saving designs.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range for rugged environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture for efficient processing and control.

RAM Bytes: 8192

Adequate RAM storage for data processing and temporary storage.

Technology: CMOS

CMOS technology for low power consumption and high noise immunity.

Terminal Form: NO LEAD

No-lead terminal form for improved reliability and thermal performance.

Maximum Supply Current: 110 mA

Moderate supply current for efficient power usage.

Nominal Supply Voltage: 3.3 V

Nominal supply voltage for stable operation.

PWM Channels: YES

PWM channels for precise control of output signals.

ROM Programmability: FLASH

Flash ROM programmability for easy firmware updates.

Terminal Pitch: 0.5 mm

Fine terminal pitch for increased connectivity options.

Speed: 50 rpm

Operates reliably at a speed of 50 revolutions per minute.

No. of I/O Lines: 34

Sufficient number of I/O lines for interfacing with external devices.

Technical Specifications

Microcontrollers LM3S812-IGZ50-C2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N48

Length:

6.875 mm

No. of I/O Lines:

34

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

110 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.875 mm

Peripheral IC Type:

Trade Compliance

LM3S812-IGZ50-C2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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